Abstract: This invention provides a process for cutting a film covered item without piercing the covering film. Basically, the process comprises the steps of mounting an item on a compressible base and covering the mounted item with a resilient film, and then contacting the mounted film covered item with cutting means under pressure such that the item is cut and the base is compressed by the cutter means without the covering film being pierced by the cutter means. The present invention is also directed toward the mounted film covered and cut item that is produced by this process.