Abstract: Disclosed is a probe bonding device and method. The probe bonding device includes, a second gripper configured to move the probe to a bonding position on the substrate, a laser unit configured to emit a laser beam, a fourth vision device configured to check whether the probe gripped by the second gripper; and a controller configured to control the second gripper and the fourth vision device, wherein the controller controls the fourth vision device to photograph one end of the probe a plurality of numbers of times while sequentially adjusting a height of at least one of the second gripper and the fourth vision device at a predetermined interval to acquire information on a height of the probe based on a plurality of captured images, thereby bonding the probe to an accurate position to enhance bonding quality of the probe and quality of a probe card.
Type:
Grant
Filed:
August 10, 2016
Date of Patent:
May 5, 2020
Assignee:
DAWON NEXVIEW CO., LTD.
Inventors:
G Jung Nam, Kang San Lee, Dae Sub Lee, Min Su Yang
Abstract: Disclosed is a probe bonding device and method. The probe bonding device includes, a second gripper configured to move the probe to a bonding position on the substrate, a laser unit configured to emit a laser beam, a fourth vision device configured to check whether the probe gripped by the second gripper; and a controller configured to control the second gripper and the fourth vision device, wherein the controller controls the fourth vision device to photograph one end of the probe a plurality of numbers of times while sequentially adjusting a height of at least one of the second gripper and the fourth vision device at a predetermined interval to acquire information on a height of the probe based on a plurality of captured images, thereby bonding the probe to an accurate position to enhance bonding quality of the probe and quality of a probe card.
Type:
Application
Filed:
August 10, 2016
Publication date:
July 26, 2018
Applicant:
DAWON NEXVIEW CO.,LTD.
Inventors:
G Jung NAM, Kang San LEE, Dae Sub LEE, Min Su YANG