Patents Assigned to DDP Speciality Electronic Materials US, LLC
  • Epoxy adhesive resistant to open bead humidity exposure
    Patent number: 11624012
    Abstract: Epoxy adhesives are made using core-shell rubbers and small amounts if any of other elastomeric materials. The epoxy adhesives contain a mixture of latent curing agents and/or high levels of calcium oxide. The adhesives exhibit excellent bonding properties even when an open or closed bead is exposed to humid air for prolonged periods before the epoxy adhesive is cured.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: April 11, 2023
    Assignee: DDP Speciality Electronic Materials US, LLC
    Inventor: Glenn G. Eagle