Patents Assigned to DDP SPECIALTY ELECTRONICS MATERIALS US, INC.
  • Patent number: 11732080
    Abstract: Disclosed are curable compositions containing isocyanate functional prepolymer containing two part adhesives wherein the prepolymers contain in their backbones hydrophobic segments and the curative part comprises one or more oligomeric or polymeric compounds having more than one isocyanate reactive groups; and one or more low molecular weight compounds having more than one isocyanate reactive groups wherein the low molecular weight compounds and the amount of such low molecular weight compounds are selected to such that the composition after full cure exhibits a ratio of modulus (e.g., Young's modulus or shear storage modulus) measured at ?35° C. to the modulus measured at 23° C. of less than 10. The cured compositions exhibit higher stiffness across the common use temperature range and improved hydrolytic stability especially when exposed to elevated temperatures. Also disclosed are methods of bonding substrates together utilizing such compositions.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: August 22, 2023
    Assignee: DDP SPECIALTY ELECTRONICS MATERIALS US, INC.
    Inventors: Stefan Schmatloch, Ilona Caderas
  • Patent number: 11548955
    Abstract: Provided is a collection of polymeric beads, wherein the beads comprise (i) 75 to 99% by weight, based on the weight of the bead, polymerized units of monofunctional vinyl monomer, and (ii) 1 to 25% by weight, based on the weight of the bead, polymerized units of multifunctional vinyl monomer; wherein, within each bead, the average concentration of moles of polymerized units of multifunctional vinyl monomer per cubic micrometer is MVAV; wherein, within each bead, T1000 is a sequence of 1,000 unique connected polymerized monomer units; wherein, within each T1000, MVSEQ is the weight percent polymerized units of multifunctional vinyl monomer, based on the weight of T1000; wherein MVRATIO=MVSEQ/MVAV; and wherein 90% or more of the beads by volume are uniform beads, wherein a uniform bead is a bead in which 90% or more of all T1000 sequences has MVRATIO of 1.5 or less.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: January 10, 2023
    Assignees: DDP Specialty Electronic Materials US, INC., DDP Specialty Electronic Materials US 8, LLC
    Inventors: Andrew M. Savo, Alfred K. Schultz, Kenneth Laughlin, John Reffner
  • Patent number: 11525045
    Abstract: Chemically modified polyesters, foamable compositions thereof that form low density foams, and methods of making the foamable compositions and foams are disclosed. The compositions comprise an amorphous copolyester, or amorphous co-polyesterpolycarbonate or amorphous co-polyesterpolyether or combination thereof. Additionally, uses for the low density foams are disclosed.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: December 13, 2022
    Assignee: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
    Inventors: Michal Elizabeth Porter, Mark Alan Barger, Yiyong He, Stéphane Costeux, Gerald F Billovits, Wenyi Huang, Edoardo Nicoli
  • Publication number: 20210130529
    Abstract: Disclosed are curable compositions containing isocyanate functional prepolymer containing two part adhesives wherein the prepolymers contain in their backbones hydrophobic segments and the curative part comprises one or more oligomeric or polymeric compounds having more than one isocyanate reactive groups; and one or more low molecular weight compounds having more than one isocyanate reactive groups wherein the low molecular weight compounds and the amount of such low molecular weight compounds are selected to such that the composition after full cure exhibits a ratio of modulus (e.g., Young's modulus or shear storage modulus) measured at ?35° C. to the modulus measured at 23° C. of less than 10. The cured compositions exhibit higher stiffness across the common use temperature range and improved hydrolytic stability especially when exposed to elevated temperatures. Also disclosed are methods of bonding substrates together utilizing such compositions.
    Type: Application
    Filed: June 15, 2018
    Publication date: May 6, 2021
    Applicant: DDP SPECIALTY ELECTRONICS MATERIALS US, INC.
    Inventors: Stefan Schmatloch, Ilona Caderas
  • Publication number: 20210130663
    Abstract: One-component epoxy adhesives containing a phosphorus-modified epoxy resin, a toughener and an epoxy resin that is neither rubber-modified nor phosphorus-modified. These adhesives are structural adhesives useful in automotive applications. They exhibit particularly good corrosion resistance.
    Type: Application
    Filed: July 20, 2018
    Publication date: May 6, 2021
    Applicant: DDP SPECIALTY ELECTRONICS MATERIALS US, INC.
    Inventors: Felix Koch, Andreas Lutz, Cathy Grossnickel, Jeannine Flueckiger
  • Patent number: 10988558
    Abstract: Provided is a method of making a collection of polymer beads comprising (a1) forming a first collection of monomer droplets in an aqueous medium in a container, wherein the first collection of monomer droplets has volume-average diameter DAV1 and has uniformity coefficient less than 1.3; (a2) forming a second collection of monomer droplets in the aqueous medium in the container, wherein the second collection of monomer droplets has volume-average diameter DAV2 and has uniformity coefficient less than 1.3, wherein DAV1 and DAV2 differ by 10 ?m or more; wherein either step (a1) and step (a2) are performed simultaneously; or step (a2) is performed after step (a1), while the first collection of monomer droplets remains in the container; or a combination thereof; and (b) after steps (a1) and (a2), polymerizing the monomer droplets by suspension polymerization to form the polymer beads.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: April 27, 2021
    Assignees: DDP SPECIALTY ELECTRONIC MATERIALS US, INC., DDP SPECIALTY ELECTRONIC MATERIALS US 8, LLC
    Inventors: John David Finch, James A. Jagodzinski
  • Publication number: 20210082593
    Abstract: Provided is a process for blast cleaning comprising subjecting a work surface to a blast stream, wherein the work surface is metal that is contaminated with one or more radioactive moiety, wherein the blast stream comprises water and one or more resin particles.
    Type: Application
    Filed: March 12, 2019
    Publication date: March 18, 2021
    Applicant: DDP Specialty Electronic Materials US, Inc.
    Inventors: Leaelaf Mengislu HAILEMARIAM, Katariina MAJAMAA
  • Patent number: 10894758
    Abstract: Provided is a process for producing 2,2-bis(4-hydroxyphenyl)propane, comprising condensing phenol with acetone in the presence of an acid catalyst; wherein the acid catalyst comprises a collection of sulfonated polymeric beads, wherein the sulfonated polymeric beads comprise (i) 75 to 99% by weight, based on the weight of the bead, polymerized units of monofunctional vinyl monomer, and (ii) 1 to 25% by weight, based on the weight of the bead, polymerized units of multifunctional vinyl monomer; wherein 90% or more of the beads by volume are uniform beads.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: January 19, 2021
    Assignees: DDP SPECIALTY ELECTRONIC MATERIALS US, INC., DDP SPECIALTY ELECTRONS MATERIALS US 8, LLC
    Inventors: Andrew M. Savo, Mark Vandersall, Klaus-Dieter Topp, Liu Yang
  • Publication number: 20200339847
    Abstract: Disclosed is a composition including one or more isocyanate functional prepolymers; one or more catalysts for the reaction of isocyanate moieties and active hydrogen containing moieties; one or more mercapto silanes; one or more amino silanes, isocyanato silanes or a mixture thereof; one or more reinforcing fillers comprising one or more high surface area carbon blacks; one or more untreated calcium carbonates; one or more polyisocyanates having an isocyanate functionality of about 2 or greater; and one or more linear plasticizers. Preferably, the isocyanate functional prepolymer is prepared in the presence of at least a portion of the linear plasticizer. Preferably, the isocyanate functional polymer is prepared in the presence of a dialkyl malonate. The composition may be one-part adhesive composition. Also disclosed are methods of applying the compositions to substrates.
    Type: Application
    Filed: October 1, 2018
    Publication date: October 29, 2020
    Applicant: DDP SPECIALTY ELECTRONICS MATERIALS US, INC.
    Inventors: Dietmar Golombowski, Andreas Lutz, Stefan Schmatloch, Huide D. Zhu
  • Patent number: 10793665
    Abstract: A formulation system contains: (a) a pre-polymer reaction product of a polymeric isocyanate and a polyether polyol, where: (i) the polymeric isocyanate contains five weight-percent or more methylene diphenyl diisocyanate; (ii) the polymeric isocyanate has a functionality of 3.0 or less; (iii) the polyether polyol is present in the pre-polymer at a concentration of one to 25 weight-percent; (iv) the polyol has an equivalent weight of 50 to 500 grams per equivalent; (v) the ?NCO concentration of the pre-polymer is 15 to 31 weight-percent; (vi) the pre-polymer is free of isocyanate trimers; (b) a polyester polyol component containing 10 to 25 weight-percent of free glycol; and (c) a blowing agent that contains less than five weight-percent water; where the ratio of pre-polymer and polyester result in foam having a trimer content of 12 to 22 weight-percent, and an ?NCO index of more than 300 and less than 700.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: October 6, 2020
    Assignee: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
    Inventors: Kshitish A. Patankar, Mark F. Sonnenschein, Steven P. Crain, Christina A. Rhoton
  • Patent number: 10781271
    Abstract: Conjugated diene polymers such as a styrene-butadiene copolymer are sequentially brominated by reaction with a quaternary ammonium tribromide or quaternary phosphonium tribromide and halohydrated by reaction with an N-haloimide compound. This produces a brominated and halohydrated polymer with very good thermal stability. The product is useful as a flame retardant in a variety of polymer systems.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: September 22, 2020
    Assignee: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
    Inventors: John W. Hull, Jr., Shari Kram, Michal Elizabeth Porter, William G. Stobby
  • Patent number: 10752533
    Abstract: A method for treating waste water containing ammonia comprising the steps of: i) passing the waste water as a feed solution through a first RO membrane (24) to produce a first permeate stream (30) and a first reject stream (32), ii) adjusting the pH of the first reject stream (32) to >9, iii) passing the first reject stream (32) through a second RO membrane (26) to produce a second permeate stream (36) containing ammonia and a second reject stream (38), and iv) passing at least a portion of the second permeate stream (36) to a cooling tower (12) to evaporate at least a portion of the ammonia.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: August 25, 2020
    Assignee: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
    Inventors: Cheng Yang, Hong Su, Minjia Zhao, Hugh Zhu
  • Publication number: 20200231849
    Abstract: An epoxy-based crash durable adhesive composition including: (I) a liquid resin system comprising: (a) at least one epoxy resin; and (b) at least one toughener; wherein the viscosity of the above liquid resin system is less than about 800 Pa s at a temperature of 15° C.; and wherein the viscosity of the above liquid resin system is greater than about 5 Pa-s at a temperature of 60° C.; (II) a solid material comprising: (c) at least one hydrophobic fumed silica, wherein the fumed silica is present in the adhesive composition at a concentration of greater than 5 weight percent; and (III) a curative material comprising: (d) at least one latent heat-activated curing agent; wherein the rheology of the epoxy-based crash durable adhesive composition is such that the adhesive composition is pumpable at a temperature of 15° C.
    Type: Application
    Filed: October 2, 2018
    Publication date: July 23, 2020
    Applicant: DDP SPECIALTY ELECTRONICS MATERIALS US, INC.
    Inventors: Tyler Auvil, Gary L. Jialanella, Eric E. Cole, Felix Koch, Andreas Lutz, Daniel Schneider
  • Patent number: 10717050
    Abstract: A spiral wound membrane module adapted for hyperfiltration and including at least one membrane envelope and feed spacer sheet wound about a central permeate tube to form an inlet and outlet scroll face and an outer periphery, wherein the feed spacer sheet includes: i) a feed entrance section extending along the permeate collection tube from the inlet scroll face toward the outlet scroll face, ii) a feed exit section extending along the outer periphery from the outlet scroll face toward the inlet scroll face, and iii) a central feed section located between the feed entrance section and the feed exit section; and wherein the feed entrance section has a median resistance to flow in a direction parallel to the permeate collection tube that is less than 25% of the median resistance to flow of the central feed section in a direction perpendicular to the permeate collection tube.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: July 21, 2020
    Assignee: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
    Inventors: Steven D. Jons, Michael S. Koreltz, Luke Franklin
  • Patent number: 10661219
    Abstract: A method for separating N2 from a hydrocarbon gas mixture containing N2 comprising the steps of: i) providing a bed of adsorbent selective for N2; (ii) passing the hydrocarbon gas mixture through the bed of adsorbent to at least partially remove N2 from the gas mixture to produce: (a) N2-loaded adsorbent and (b) N2-depleted hydrocarbon gas mixture; iii) recovering the N2-depleted hydrocarbon gas mixture; iv) regenerating the N2-loaded adsorbent by at least partially removing N2 from the adsorbent; and v) sequentially repeating steps (ii) and (iii) using regenerated adsorbent from step (iv); wherein the adsorbent comprises a pyrolized sulfonated macroporous ion exchange resin.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: May 26, 2020
    Assignee: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
    Inventors: Junqiang Liu, Chan Han, H. Robert Goltz, Matthew L. Rodgers, Scott T. Matteucci, Brandon J. Kern
  • Publication number: 20200140727
    Abstract: Room temperature curing, two-component epoxy adhesives useful in bonding oily substrates include a resin side A and a curative side B. The resin side A includes an epoxy resin, a toughening component, a plasticizer and filler, and the curative side B includes a polyetheramine, amine-terminated butadiene rubber and a curing catalyst.
    Type: Application
    Filed: August 4, 2018
    Publication date: May 7, 2020
    Applicant: DDP SPECIALTY ELECTRONICS MATERIALS US, INC.
    Inventors: Benjamin Alexander Haag, Andreas Lutz, Beda Steiner
  • Publication number: 20200131414
    Abstract: Disclosed are latent three-component polyurethane adhesive compositions which includes; (a) a first polyol component comprising (i) one or more polyols having a hydroxyl equivalent weight of 400 to 2000 and a nominal hydroxyl functionality of 2 to 4; (ii) one or more aliphatic diol chain extenders; (iii) from 0.01 to 1 weight percent, based on the total weight of the first polyol component, of one or more latent room temperature organometallic catalysts; and (iv) from 0.01 to 1 weight percent, based on the total weight of the first polyol component, of one or more one or more blocked cyclic amidine compound catalysts or one or more phenol-blocked cyclic amidine compounds catalysts; (b) a second polyol component comprising (i) one or more polyols having a hydroxyl equivalent weight of 400 to 2000 and a nominal hydroxyl functionality of 2 to 4; (ii) one or more aliphatic diol chain extenders; (iii) from 0.
    Type: Application
    Filed: June 13, 2018
    Publication date: April 30, 2020
    Applicant: DDP SPECIALTY ELECTRONICS MATERIALS US, INC.
    Inventors: Sergio Grunder, Stefan Schmatloch, Joel Kunz
  • Patent number: 10632486
    Abstract: An article includes an adapter having a flow channel extending through it, where the adapter includes a base, a neck, a bendable segment attached to the base and neck and positioned between the base and neck, and a plunger attached to the neck or bendable segment and extending within the flow channel in the bendable segment.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: April 28, 2020
    Assignee: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
    Inventors: Daniel R. Schroer, Marc S. Black, Chad V. Schuette, Christopher J. Siler, Daniel Ramirez
  • Patent number: 10611554
    Abstract: An article includes a dispenser having a flow channel extending therethrough and having a base, a bendable segment attached to the base, a straw attached to the bendable segment, a plunger attached to the base and extending within the flow channel of the bendable segment; a sleeve extending over at least a portion of the straw, and a trigger hingedly attached to the straw at a hinge point and having a portion above the hinge point engaging the sleeve and a trigger portion extending below the hinge point.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: April 7, 2020
    Assignee: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
    Inventors: Daniel R. Schroer, Marc S. Black, Chad V. Schuette, Christopher J. Siler, Daniel Ramirez
  • Patent number: 10610860
    Abstract: Provided is a method of regenerating an acrylic resin (B2), comprising (A) providing a collection of particles of acrylic resin (B2) that has calculated Hansch parameter of ?1.0 to 2.5, wherein one or more humic acid, one or more fulvic acid, or a mixture thereof, is adsorbed onto said acrylic resin (B2), and (B) bringing said collection of particles of acrylic resin (B2) into contact with an aqueous solution (RB) having pH of 10 or higher, to form a mixture B2RB, (C) then separating acrylic resin (B4) from said mixture B2RB.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: April 7, 2020
    Assignees: DDP SPECIALTY ELECTRONIC MATERIALS US, INC., DDP SPECIALTY ELECTRONIC MATERIALS US 8, INC.
    Inventors: J. Marcus Slagt, Alfred K. Schultz