Abstract: A single-sided compliant probe is provided that includes a conductive tip shaped as one or more thin conductive fins having one edge which is positioned on a supporting substrate in a manner that allows the opposing edge to engage a contact pad and to move flexibly with respect to the supporting substrate while in close proximity to adjacent probes in an array. The probe tip is oriented in a direction of wipe of the tip across the contact pad but moves substantially vertically in response to the force of a mating contact pad as it is mechanically biased against the tip. Mechanical compliance of the probe allows electrical contact to be made reliably between the probe and its corresponding contact pad on a microelectronic device, where the mechanical compliance accommodates variations in height of the contact pad and wipe improves reliability of electrical engagement.

Abstract: A small single-sided compliant probe is provided that includes a conductive tip, which is positioned on a supporting surface in a manner that allows a tip on the probe to move flexibly with respect to the supporting surface in close proximity to adjacent probes in an array. The probe tip moves vertically in response to the force of a mating contact pad as it biased against the tip. Mechanical compliance of the probe allows electrical contact to be made reliably between the probe and a corresponding contact pad on a microelectronic device, where the mechanical compliance accommodates variations in height of the contact pad.

Abstract: A mechanically compliant probe for electrically connecting to contact pads on microelectronic devices. The probe is used for burn-in of integrated circuits at the wafer level. Additional applications include probe cards for testing integrated circuits and sockets for flip-chips. One embodiment of the probe includes a probe tip which is held on an extension arm projecting laterally from an elongated flat spring. The spring is supported above a substrate by posts such that the probe tip moves vertically in response to a contact force on the probe tip. Deflection of the probe tip is compliantly limited by bending and torsional flexure of the sheet spring. Mechanical compliance of the tip allows arrays of the probe to contact pads on integrated circuits where the pads are not precisely planar.

Abstract: A small single-sided compliant probe is provided that includes a conductive tip, which is positioned on a supporting surface in a manner that allows a tip on the probe to move flexibly with respect to the supporting surface in close proximity to adjacent probes in an array. The probe tip moves vertically in response to the force of a mating contact pad as it biased against the tip. Mechanical compliance of the probe allows electrical contact to be made reliably between the probe and a corresponding contact pad on a microelectronic device, where the mechanical compliance accommodates variations in height of the contact pad.

Abstract: A mechanically compliant probe for electrically connecting to contact pads on microelectronic devices. The probe is used for burn-in of integrated circuits at the wafer level. Additional applications include probe cards for testing integrated circuits and sockets for flip-chips. One embodiment of the probe includes a probe tip (81) which is held on an extension arm (82) projecting laterally from an elongated flat spring (83). The spring is supported above a substrate (89) by posts (85) such that the probe tip moves vertically in response to a contact force on the probe tip. Deflection of the probe tip is compliantly limited by bending and torsional flexure of the sheet spring. Mechanical compliance of the tip allows arrays of the probe to contact pads on integrated circuits where the pads are not precisely planar.

Abstract: A mechanically compliant probe for electrically connecting to contact pads on microelectronic devices. The probe is used for burn-in of integrated circuits at the wafer level. Additional applications include probe cards for testing integrated circuits and sockets for flip-chips. One embodiment of the probe includes a probe tip (81) which is held on an extension arm (82) projecting laterally from an elongated flat spring (83). The spring is supported above a substrate (89) by posts (85) such that the probe tip moves vertically in response to a contact force on the probe tip. Deflection of the probe tip is compliantly limited by bending and torsional flexure of the sheet spring. Mechanical compliance of the tip allows arrays of the probe to contact pads on integrated circuits where the pads are not precisely planar.