Abstract: A heat-transfer component defines a thermal-interface surface and has a metallic thermal-interface material bonded to the thermal-interface surface. The metallic thermal-interface material has a solid-to-liquid phase-change temperature between about 60° C. and about 90° C. With a thermal-interface material bonded to the thermal-interface surface, the thermal-contact resistance between the thermal-interface material and the heat-transfer component can be reduced or substantially eliminated compared to conventional thermal-interface materials, including conventional metallic thermal-interface materials. Also disclosed are electrical devices having a heat generating component cooled by such a heat-transfer component.

Abstract: A heat-transfer component defines a thermal-interface surface and has a composite thermal-interface material on the thermal-interface surface. The composite thermal-interface material comprises a silicone oil substrate and a metallic filler. In some embodiments, the metallic filler undergoes a transition from solid to liquid at a temperature below a typical operating temperature of an electronic device. For example, an embodiment of a metallic filler has a solid-to-liquid transition temperature between about 25° C. and about 95° C. In some embodiments, a second thermal interface material extends around an outer periphery of the composite thermal interface material, which can inhibit or prevent seepage or other migration of metallic filler in the composite thermal-interface material out of a thermal interface region between the heat-transfer component and, e.g., a heat-generating component. Also disclosed are electrical devices having a heat generating component cooled by such a heat-transfer component.

Abstract: A loop thermosyphon can combine the best of heat-pipes and traditional liquid-cooling systems that include a mechanical pump. A disclosed heat-transfer device includes a first heat-transfer component and a second heat-transfer component fluidly coupled with each other by a first conduit and a second conduit. A first manifold is positioned in the first heat-transfer component and defines a first plurality of liquid pathways. The first manifold fluidly couples with the first conduit. A second manifold is also positioned in the first heat-transfer component and defines a second plurality of liquid pathways fluidly coupled with and extending from the first plurality of liquid pathways. The second manifold further defines a plurality of boiling channels, a plurality of accumulator channels and a vapor manifold. The boiling channels extend transversely relative to and are fluidly coupled with the second plurality of liquid pathways.