Patents Assigned to Delco Electonics Corporation
  • Thick film circuit having conductor composition with coated metallic particles
    Patent number: 5928568
    Abstract: A thick-film conductor paste and thick-film conductors formed therefrom. The conductor paste is composed of metallic particles coated with a barrier layer that reduces leaching and solder diffusion into the conductor, thereby improving the reliability of the conductor-solder bond. The barrier layer may be continuous or discontinuous, and may be applied to some or all of the metallic particles of the conductor paste.
    Type: Grant
    Filed: October 20, 1997
    Date of Patent: July 27, 1999
    Assignee: Delco Electonics Corporation
    Inventors: Christine Ann Paszkiet, Dwadasi Hare Rama Sarma