Patents Assigned to Delphi Tecnologies, Inc
  • Electronic enclosure with improved EMC performance
    Patent number: 6549426
    Abstract: An electronics assembly 10 is provided, including a base element 16 and a cover element 18. The base element 16 includes a perimeter mating groove 20 and the cover element 18 including a perimeter tongue element 26. A plurality of crush ribs 34 are formed into the perimeter tongue element 26 such that when the perimeter tongue element 26 is positioned within the perimeter mating groove 20 during assembly, the plurality of crush ribs 34 establish conductive contact between the base element 16 and the cover element 18.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: April 15, 2003
    Assignee: Delphi Tecnologies, Inc
    Inventors: Daniel A. Lawlyes, Roy A. Visser