Abstract: The invention relates generally to carrier materials. More specifically, the present invention relates to silicon-free thermoplastic elastomer (TPE) materials for use in carrier devices. In some embodiments, a textured film to temporarily immobilize a device is provided, characterized in that a surface of the film in contact with the one or more objects is comprised of textured topology.
Type:
Grant
Filed:
March 17, 2014
Date of Patent:
October 23, 2018
Assignee:
Delphon Industries, LLC
Inventors:
Rajesh Kumar Varma, Darby Allen Davis, Claudia Leigh Allison
Abstract: The invention relates generally to carrier materials. More specifically, the present invention relates to silicon-free thermoplastic elastomer (TPE) materials for use in carrier devices. In some embodiments, a textured film to temporarily immobilize a device is provided, characterized in that a surface of the film in contact with the one or more objects is comprised of textured topology.
Type:
Grant
Filed:
March 19, 2018
Date of Patent:
September 25, 2018
Assignee:
Delphon Industries, LLC
Inventors:
Rajesh Kumar Varma, Darby Allen Davis, Claudia Leigh Allison
Abstract: The invention relates generally to carrier materials. More specifically, the present invention relates to silicon-free thermoplastic elastomer (TPE) materials for use in carrier devices. In some embodiments, a textured film to temporarily immobilize a device is provided, characterized in that a surface of the film in contact with the one or more objects is comprised of textured topology.
Type:
Grant
Filed:
July 6, 2016
Date of Patent:
April 3, 2018
Assignee:
Delphon Industries, LLC
Inventors:
Rajesh Kumar Varma, Darby Allen Davis, Claudia Leigh Allison
Abstract: A vacuum release device is provided for temporarily immobilizing objects, the device comprising: a substrate; a plurality of vacuum release subunits which can be operated independent of each other, each vacuum release subunit comprising an adhesive layer over a surface of the substrate; and a spacing material positioned between the substrate and the adhesive layer so as to form a chamber within which a vacuum may be formed, application of the vacuum causing the adhesive layer to recess toward the chamber.
Type:
Grant
Filed:
May 10, 2002
Date of Patent:
August 24, 2010
Assignee:
Delphon Industries LLC
Inventors:
Claudia Leigh Allison, Darby Allen Davis, Philip John Haseltine
Abstract: A method is provided for reconstructing an integrated circuit package comprising: attaching a die to exposed wire bond pads of a lead frame so that the die is electrically connected to the lead frame; and encapsulating the die and the wire bond pads in an encapsulant; and reshaping an upper surface of the encapsulant where at least a portion of the encapsulant reshaping is performed by a lapping process.
Type:
Grant
Filed:
January 7, 2002
Date of Patent:
April 26, 2005
Assignee:
Delphon Industries, LLC
Inventors:
Joseph J. Dlugokecki, Gerardo Bagalawig Nazareno, Carmencita I. Robbins, Steven David Swendrowski