Abstract: An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.

Abstract: An integrated circuit device testing system includes a socket configured to receive an integrated circuit device, wherein the socket comprises at least one conductive trace made of a material with a resistivity that is a function of temperature, and wherein the socket is configured such that, when the integrated circuit device is located in the socket, the at least one conductive trace extends along a surface of the integrated circuit device. The integrated circuit device testing system further includes a controller or active circuit configured to determine a temperature at the surface of the integrated circuit device based on a measured resistance of the at least one conductive trace.

Abstract: An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.

Abstract: A method for controlling temperature in a temperature control system. The method includes providing a temperature control system including a controller, a first contactor assembly having a first channel system, a plurality of first contacts, each of the first contacts including a portion that is disposed within the first channel system, and one or more of a first exhaust valve or a first inlet valve, and a second contactor assembly having a second channel system, a plurality of second contacts, each of the second contacts including a portion that is disposed within the second channel system, and one or more of a second exhaust valve or a second inlet valve. The method also includes receiving, by the first contactor assembly, a fluid at a first temperature. The method also includes receiving, by the second contactor assembly, the fluid at the first temperature.

Abstract: A method for controlling temperature in a temperature control system. The method includes providing a temperature control system including a controller, a first contactor assembly having a first channel system, a plurality of first contacts, each of the first contacts including a portion that is disposed within the first channel system, and one or more of a first exhaust valve or a first inlet valve, and a second contactor assembly having a second channel system, a plurality of second contacts, each of the second contacts including a portion that is disposed within the second channel system, and one or more of a second exhaust valve or a second inlet valve. The method also includes receiving, by the first contactor assembly, a fluid at a first temperature. The method also includes receiving, by the second contactor assembly, the fluid at the first temperature.

Abstract: A system includes a plurality of thermally-coupled zones and a plurality of thermal control devices, each controllable to thermally control one of the plurality of zones, and a plurality of temperature sensors, each configured to measure temperature of one of the plurality of zones. The system includes a control circuit configured to receive a temperature measurement for each of the plurality of zones, collect the temperature measurements in a temperature vector in a real coordinate system, and transform the temperature vector to a normal coordinate system that provides a plurality of uncoupled equations. The control circuit is configured to determine, based on the plurality of uncoupled equations and a desired temperature gradient, a desired power vector in the normal coordinate system, transform the desired power vector to the real coordinate system to generate a power vector, and control the plurality of heaters in accordance with the power vector.

Abstract: An assembly for controlling the temperature of a device includes: a heat sink configured to be maintained at a temperature below a desired set point temperature; a heater element having a surface configured to be thermally coupled to a surface of the device; and a thermally conductive pedestal interposed between the heat sink and the heater element. The heater is configured to apply heat to the device when the temperature of the device falls below the set point temperature, and heat is transferable to the heat sink through the pedestal and heater element when the temperature of the device is above the set point temperature.

Abstract: An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.

Abstract: An integrated circuit device testing system includes a socket configured to receive an integrated circuit device, wherein the socket comprises at least one conductive trace made of a material with a resistivity that is a function of temperature, and wherein the socket is configured such that, when the integrated circuit device is located in the socket, the at least one conductive trace extends along a surface of the integrated circuit device. The integrated circuit device testing system further includes a controller or active circuit configured to determine a temperature at the surface of the integrated circuit device based on a measured resistance of the at least one conductive trace.

Abstract: A sound suppressor, comprising an elongate tubular housing, a projectile entrance passage at a rearward portion of the elongate tubular housing, and a plurality of tubes positioned within the elongate tubular housing. In at least one example, the plurality of tubes may be offset from the elongate tubular housing and offset from a central axis of the elongate tubular housing.

Abstract: A test head for a semiconductor device handler includes a plunger; and a funnel insert attached to the plunger via a funnel insert spring, the funnel insert having a channel extending axially therethrough, and the funnel insert including a plurality of sloped inner walls that are sloped outwardly in a distal direction of the funnel insert and configured to contact upper edges of a semiconductor device to center the semiconductor device in the funnel insert. The plunger includes a projecting portion that extends through the channel of the funnel insert. When the spring is in an uncompressed state, a distal end of the funnel insert extends past a distal end of the projecting portion of the plunger.

Abstract: An integrated circuit device testing system includes a socket configured to receive an integrated circuit device, wherein the socket comprises at least one conductive trace made of a material with a resistivity that is a function of temperature, and wherein the socket is configured such that, when the integrated circuit device is located in the socket, the at least one conductive trace extends along a surface of the integrated circuit device. The integrated circuit device testing system further includes a controller or active circuit configured to determine a temperature at the surface of the integrated circuit device based on a measured resistance of the at least one conductive trace.

Abstract: A cooling system for at least one thermal unit includes a tank assembly that includes: a sump chamber, a purge chamber that is located above the sump chamber, and a reservoir chamber that is located above the purge chamber; a cooling circuit that includes a pump, a heat exchanger, and conduits, the cooling circuit being configured to circulate a liquid coolant through the at least one thermal unit, the sump chamber, the pump, the heat exchanger, and the reservoir chamber; a first valve located externally of the tank assembly and configured such that, when the first valve is open, (i) the liquid coolant is flowable from the purge chamber to the sump chamber via the first valve, and (ii) air is simultaneously flowable from the sump chamber to the purge chamber via the first valve; and a second valve located externally of the tank assembly and configured such that, when the second valve is open, (i) the liquid coolant is flowable from the reservoir chamber to the purge chamber via the second valve, and (ii) air

Abstract: A system for detecting a status of a pocket of a tray includes a tray having a plurality of pockets that hold an integrated circuit device, a vision mechanism, a light line generator, a reflective device, and a controller. The vision mechanism images the tray along a first optical axis. The light line generator emits a light line along a second optical axis. The reflective device reflects the light line onto the tray along a third optical axis. The third optical axis has a different angle relative to the first optical axis than an angle between the first optical axis and the second optical axis. The controller receives an image of the tray from the vision mechanism, detects the light line reflected onto the tray along the third optical axis, and determines a status of a pocket based on the detected light line along the third optical axis.

Abstract: A thermal control method and assembly uses an expansion chamber structured to receive liquid nitrogen and expand the liquid to nitrogen gas having a first temperature. The nitrogen gas having the first temperature is provided to a system. A pump is configured to receive the nitrogen gas at a second temperature and a second pressure from the system. The pump is further configured to pump the nitrogen gas at a third temperature and third pressure. A sump is structured to receive the nitrogen gas at the third temperature and the third pressure from the pump, and recirculate at least a portion of the nitrogen gas to the expansion chamber.

Abstract: A system includes: a bottom contactor assembly; a top contactor assembly; and a contactor vision alignment system located separate from a test site of an integrated circuit device testing system. The contactor vision alignment system includes: a downward-looking camera, an upward-looking camera, an adjustment mechanism configured to move the top contactor assembly, and a controller configured to: determine a first offset between a bottom side integrated circuit device contact array and a bottom contactor contact array, cause the adjustment mechanism to align the bottom side integrated circuit device contact array with the bottom contactor contact array based on the determined first offset, determine a second offset between the top contactor contact array and a top side integrated circuit device contact array, and cause the adjustment mechanism to align the top contactor with respect to the top side device contact array based on the determined second offset.

Abstract: An apparatus includes a device holder including a device placement area configured to hold an electronic device, and a shoulder extending peripherally around the device placement area; a laser line generator configured to generate a laser line that includes (i) a device placement area laser line portion, and (ii) a shoulder area laser line portion; a camera configured to obtain an image of at least the laser line; and a processor configured to: receive the image from the camera, determine (i) an angle of the device placement area laser line portion, and/or (ii) an offset between the location of the device placement area laser line portion and the location of the shoulder area laser line portion, and determine whether an electronic device is positioned in the device placement area or positioned incorrectly in the device holder.

Abstract: A thermal control head for a semiconductor device handler includes: a heater configured to heat a semiconductor device; a cold manifold; and a cooling mass that is movable between: a first position at which a first surface of the cooling mass contacts a surface of the cold manifold, and a second position at which the first surface of the cooling mass is separated from the cold manifold, and a second surface of the cooling mass contacts a surface of the heater.

Abstract: An integrated circuit device testing system includes a socket configured to receive an integrated circuit device, wherein the socket comprises at least one conductive trace made of a material with a resistivity that is a function of temperature, and wherein the socket is configured such that, when the integrated circuit device is located in the socket, the at least one conductive trace extends along a surface of the integrated circuit device. The integrated circuit device further includes a controller or active circuit configured to determine a temperature at the surface of the integrated circuit device based on a measured resistance of the at least one conductive trace.

Abstract: An offline vision assisted calibration system includes: a bottom side socket assembly that is mountable in an integrated circuit device handler and comprises: a socket plate that comprises a hole grid array; and a top contactor assembly that is mountable in an integrated circuit device handler and comprises: a guide plate, a plurality of fiducials located on a lower side surface of the guide plate, a contact holder plate comprising a top contactor contact array, and a plurality of adjustment actuators configured to move the contact holder plate with respect to the guide plate; and a calibration jig comprising an array of contacts on a bottom side thereof, wherein the calibration jig is configured to be placed in the socket plate such that the contacts engage with the hole grid array of the socket plate.