Abstract: A power module and a power device having the power module are disclosed. The power device includes a main board. The power module is inserted in the main board and includes a PCB, a magnetic element, a primary winding circuit and at least one secondary winding circuit. The magnetic element is provided on the PCB and includes a core structure, a primary winding and at least one secondary winding. The core structure has a first side and a second side opposite to each other, and a third side and a fourth side opposite to each other. The primary winding circuit is provided on the PCB and positioned in the vicinity of the first or second side of the core structure. The secondary winding circuit is provided on the PCB and positioned in the vicinity of the third or fourth side of the core structure.

Abstract: A converter is provided. The converter includes a housing, a circuit board unit, a heat source member, a fan, and a first heat sink. A waterproof area and a ventilation area are formed in the housing. The circuit board unit is disposed in the waterproof area. The heat source member is disposed in the waterproof area and coupled to the circuit board unit. The fan is disposed in the ventilation area, wherein the fan is adapted to generate an air flow. The first heat sink is disposed in the ventilation area, and thermally connected to the heat source member, wherein the air flow is adapted to pass through the first heat sink.

Abstract: A near-eye display device includes an image output module, a coded-aperture module, and a light-guiding component. The image output module is configured to provide at least one image. The coded-aperture module is configured to encode the lights of the at least one image emitted from the image output module, so as to generate at least one left-eye image and at least one right-eye image. The light-guiding component is configured to send the left-eye image and the right-eye image to different directions respectively.

Abstract: The disclosure provides a system of providing power to a chip on a mainboard, including: a preceding-stage power supply, located on a mainboard, and configured to receive a first DC voltage and to provide a second DC voltage, wherein the first DC voltage is greater than the second DC voltage; and a first post-stage power supply and a second post-stage power supply, located on the mainboard, to receive the second DC voltage, the first post-stage power supply is disposed at a first side of the chip, the second post-stage power supply is disposed at a second side of the chip, the first post-stage power supply provides a third DC voltage to the chip, the second DC voltage is greater than the third DC voltage, the second post-stage power supply provides a fourth DC voltage to the chip, and the second DC voltage is greater than the fourth DC voltage.

Abstract: A dimmer control circuit for controlling a phase cut dimmer includes: a rectifier circuitry, configured to rectify the output voltage of the phase cut dimmer to output a rectified voltage; an input voltage detecting circuitry, configured to output a detected voltage according to the rectified voltage; a processor, configured to output a control signal when the detected voltage meets a preset condition; and a constant current circuitry, configured to output or stop outputting a preset current to the rectifier circuitry in response to the control signal; wherein the preset current has a value greater than a holding current of the phase cut dimmer.

Abstract: A switched-tank DC transformer and a voltage ratio switching method thereof are provided. The switched-tank DC transformer includes an input terminal, an output terminal, 2n inverting switches, 2n rectifying switches, 2n?2 clamping switches, n resonance tanks and n?1 support capacitors. The inverting switches are serially connected in sequence. There is an inverting node between every two neighboring inverting switches. A terminal of the rectifying switch is connected with a rectifying node. A terminal of the two clamping switch is electrically connected with a clamping node. The resonance tank is electrically connected between the inverting node and the rectifying node. The support capacitor is electrically connected between the inverting node and the clamping node. Every support capacitor and every resonance tank is switchable to be in a normal state or a voltage ratio switching state, thus a voltage ratio of the switched-tank DC transformer is allowed to vary correspondingly.

Abstract: In a wireless power transfer arrangement (1) power is wirelessly transferred from a primary side (2) to a secondary side (3) across an airgap (8) by means of a primary resonator (6) that generates a magnetic field (9) and a secondary resonator (10) that receives the power by picking up the magnetic field (9). The secondary side (3) includes an output stage (11) that receives the AC power provided by the secondary resonator (10) and generates a DC output (13) to be provided to a load. A current sensing arrangement (18) senses the AC current flowing from the secondary resonator (10) to the output stage (11) and provides a current sense signal (16) to a power transfer controller (15) that controls the power transfer of the wireless power transfer arrangement (1) based on the current sense signal (16).

Abstract: A system of providing power including: a preceding-stage power supply module, a post-stage power supply module and a load, connected in sequence; a projection on the mainboard of a smallest envelope area formed by contour lines of the preceding-stage power supply module and the load at least partially overlaps with a projection of the post-stage power supply module; the preceding-stage power supply module includes a plurality of sets of preceding-stage output pins and preceding-stage ground pins alternately arranged to form a first rectangular envelope area, and the load is disposed on a side of a long side of the first rectangular envelope area; and the load comprises a load input pin and a load ground pin forming a second rectangular envelope area, and a center line of the first rectangular envelope area and the second rectangular envelope area is perpendicular to the long side of the first rectangular envelope area.

Abstract: An LED light source guiding device is composed of an upper surface, a lower surface and side surfaces. The upper surface is geometrically shaped to project a light beam of a light source onto a light-receiving surface to form a rectangular light spot, and light beams projected by boundary curves of the upper surface are boundary positions of the rectangular light spot. The lower surface and the upper surface are coaxial axisymmetric surfaces, and the side surfaces surround between the upper surface and the lower surface to superimposedly project the light source on corresponding positions of the rectangular light spot: light beams projected through boundary curves of the side surfaces are projected on boundaries of the rectangular light spot, and light beams projected through interiors of the side surfaces are projected to fall within the boundaries of the rectangular light spot to enhance an illuminance of the rectangular light spot.

Abstract: An inverter device includes a casing, a heat source element, a heat dissipation structure and a fan. The casing has a base and a cover covering the base. An internal and an external surface are defined on the cover. The inner surface is disposed corresponding to the base. The heat source element is disposed in the casing and arranged on the base. The heat dissipation structure is thermal connected with the internal surface. The fan is accommodated in the casing corresponding to the heat dissipation structure. An air flow in the casing is accelerated by the fan, and the heat dissipation structure absorbs heat from the air flow in the casing and thermal conductively transfers to the external surface of the cover. A heat dissipation efficiency of the inverter device is thereby improved and the inverter device is thereby more durable.

Abstract: An antenna device includes an antenna unit and reflecting units. The antenna unit is arranged on a substrate. The reflecting units are arranged separately from each other on the substrate and surrounding the antenna unit. The reflecting units are configured to adjust a radiation pattern of the antenna unit, and each of the reflecting units includes a first portion and a second portion. The first portion has an upper side and a lower side, and the lower side of the first portion is coupled to the substrate. The second portion has a lower side connected to the upper side of the first portion. A width of the lower side of the first portion is smaller than a width of the lower side of the second portion.

Abstract: A semiconductor device includes an active layer, a source electrode, a drain electrode, a gate electrode, a source pad, a drain pad, and a source external connecting element. The source electrode, the drain electrode, and the gate electrode are disposed on an active region of the active layer. The source pad is electrically connected to the source electrode and includes a body portion, a plurality of branch portions, and a current diffusion portion. The body portion is at least partially disposed on the active region of the active layer. The current diffusion portion interconnects the body portion and the branch portions. A width of the current diffusion portion is greater than a width of the branch portion and less than a half of a width of the body portion. The source external connecting element is disposed on the body portion and spaced from the current diffusion portion.

Abstract: The invention relates to a sensor arrangement (140) for a foreign object detection device which includes a current input (142) and a current output (143), a multitude of detection cells (144.1-144.9), each comprising a sense coil and a capacitive element, forming a resonant tank. The sensor arrangement (140) further has a multitude of inputs leads (148a-148c) and a multitude of output leads (150a-150c), the total number of input and output leads being equal or smaller than the number of detection cells (144.1-144.9). Each detection cell is connected between one of the input leads (148a-148c) and one of the output leads (150a-150c), in a way that each of the detection cells (144.1-144.9) is connected to a different pair of input and output leads (148a-148c, 150a-150c).

Abstract: A mold for manufacturing a fan including a fixed portion and a plurality of blades connected to the fixed portion. Each of the blades has a bottom surface. The mold includes a body and an ejection structure. The body has a cavity with a shape matched with a shape of the fan. The ejection structure includes a plurality of ejection pins radially arranged. Each of the ejection pins has a working surface. Wherein a sum area of the working surfaces of the ejection pins is greater than or equal to 40% of a sum area of the bottom surfaces of the blades.

Abstract: The present disclosure provides a connector which is a combination of at least one power pin, one plastic member, and one signal pin, wherein the power pin includes a columnar metal block, each plastic member is connected to the columnar metal block at side surface, each signal pin is attached to a side surface of the plastic member, and extends to two bottom surfaces of the plastic member to form contact surfaces with predetermined areas on the two bottom surfaces; wherein, the contact surface on first bottom surface of the plastic member is flush with first bottom surface of the metal block, and the contact surface on second bottom surface of the plastic member is flush with second bottom surface of the metal block.

Abstract: A power module and a production method of the same, wherein a metal substrate is connected with the connection substrate in a high temperature, and in a process of cooling from a high temperature to a low temperature, an upper surface and a lower surface of the metal substrate are bendingly deformed toward the connection substrate, and the upper surface of the metal substrate is formed as a curved surface protruding toward the connection substrate, then the lower surface of the metal substrate is processed into a plane. In the power module and the production method of the disclosure, the second bonding material between the metal substrate and the connection substrate has a larger edge thickness, which reduces the thermal stress that the edge of the second bonding material is subject to, thereby improving the reliability of the power module while the power module has good heat dissipation performance.

Abstract: A waveform conversion circuit for converting a control signal of a control node ranging from a high voltage level to a low voltage level of a reference node into a driving signal of a first node is provided. The waveform conversion circuit includes a first resistor, a first capacitor, a unidirectional conducting device, and a voltage clamp unit. The first resistor and the first capacitor are in parallel and coupled between the control node and the first node. The unidirectional conducting device unidirectionally discharges the first node to the control node. The voltage clamp unit is coupled between the first node and the reference node and configured to clamp a driving signal.

Abstract: A motor includes a shaft, a shell, a sleeve, an abrasion-resistance piece, a bearing, an oil seal, and several compressed springs. The shaft has an axial line. The shell is connected to the shaft. The sleeve has an accommodating space, and the wall of the accommodating space forms a first inclined surface which is inclined at an angle with respect to the axial line. The abrasion-resistance piece is disposed at the bottom of the accommodating space. The bearing is disposed in the accommodating space, and the outer wall of the bearing forms a second inclined surface corresponding to the first inclined surface. The shaft passes through the bearing and abuts the abrasion-resistance piece. The oil seal is affixed to the wall of the accommodating space and covers the bearing. The compressed springs are connected between the oil seal and the bearing.