Abstract: A system for simultaneously burning in, testing and curing all the die on an uncut semiconductor wafer having top and bottom surfaces, the system having upper and lower platen assemblies with a flow section configured to receive and discharge a temperature-controlled, circulated liquid heat transfer medium to maintain the temperatures of the top and bottom surfaces of the uncut semiconductor wafer within desired limits during wafer burn-in and testing and a programmable CPU and service controller configurable to selectively energize, monitor, test, display and store a plurality of performance parameters for the electronic circuitry of each of the plurality of die of the uncut semiconductor wafer simultaneously throughout a desired burn-in and test period.