Patents Assigned to DENKA COMPANY LIMITED
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Publication number: 20240248085Abstract: Disclosed are a norovirus detection method and a device for the detection that enable detection of the major norovirus epidemic strains, GII.2 and GII.4, with high sensitivity. The immunoassay of norovirus utilizes the antigen-antibody reaction between norovirus in a sample and an antibody or an antigen-binding fragment thereof that recognizes the shell domain of the norovirus capsid. The novel immunoassay of norovirus and immunoassay device therefor were provided, which enable detection of GII.2 and GII.4 noroviruses with high sensitivity.Type: ApplicationFiled: May 20, 2022Publication date: July 25, 2024Applicant: Denka Company LimitedInventors: Yuji SAITO, Koji HIRAOKA, Shinya OGASAWARA
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Publication number: 20240240048Abstract: A polyrotaxane represented by Formula (1): wherein R1 is a hydrogen atom or a methyl group, m is 1 to 2000, and n is 10 to 500, is a cyclodextrin in which at least one hydroxyl group is modified with a group represented by —X—NH2, and X is a divalent organic group.Type: ApplicationFiled: November 22, 2021Publication date: July 18, 2024Applicants: DENKA COMPANY LIMITED, NATIONAL UNIVERSITY CORPORATION TOKYO MEDICAL AND DENTAL UNIVERSITYInventors: Ruriko AOYAMA SEKIYA, Yoshinori ARISAKA, Nobuhiko YUI, Takanori IWATA, Tetsuya YODA, Masahiro HAKARIYA, Hiroki MASUDA
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Publication number: 20240239682Abstract: To provide: an inorganic oxide powder which, when filled in a resin material, can simultaneously achieve a high dielectric constant and a low dielectric dissipation factor; a method for producing the same; and a resin composition comprising the inorganic oxide powder. Provided is an inorganic oxide powder comprising a spherical titanium oxide powder and an aluminum oxide powder, wherein the aluminum content in the inorganic oxide powder is 20-50,000 mass ppm. Further provided is a resin composition comprising the inorganic oxide powder and at least one resin material selected from a thermoplastic resin and a thermosetting resin.Type: ApplicationFiled: May 18, 2022Publication date: July 18, 2024Applicant: DENKA COMPANY LIMITEDInventors: Takuto OKABE, Motoharu FUKAZAWA
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Publication number: 20240241122Abstract: Disclosed is an anti-norovirus antibody that reacts with noroviruses of many genotypes and can collectively detect the noroviruses. The anti-norovirus antibody or an antigen-binding fragment thereof undergoes antigen-antibody reaction with the peptides composed of the amino acid sequences of SEQ ID NO: 1 and SEQ ID NO: 2, respectively. The anti-norovirus antibody, which can broadly bind to noroviruses and detect a wide range of human noroviruses with high specificity and sensitivity, and a norovirus immunoassay and a norovirus immunoassay device, both using the anti-norovirus antibody, are provided.Type: ApplicationFiled: May 20, 2022Publication date: July 18, 2024Applicant: Denka Company LimitedInventors: Yuji SAITO, Koji HIRAOKA, Shinya OGASAWARA
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Publication number: 20240243000Abstract: The present invention aims to provide an adhesive sheet for back grinding capable of enhance followability of a base material layer to a convex part of a semiconductor wafer. According to the present invention, provided is an adhesive sheet for back grinding of a semiconductor wafer having a convex part, comprising: a base material layer; and an adhesive layer provided on the base material layer, wherein: the adhesive layer comprises an opening part having a diameter smaller than a diameter of the semiconductor wafer; the adhesive layer is adhered to an outer peripheral part of the semiconductor wafer such shat the convex part of the semiconductor wafer is placed in the opening part; the adhesive layer is configured so that the convex part is protected by the base material layer with the semiconductor wafer adhered to the adhesive layer; the base material layer comprises a cushion layer and a barrier layer; and an oxygen permeability of the base material layer at 25° C.Type: ApplicationFiled: May 11, 2022Publication date: July 18, 2024Applicants: DISCO CORPORATION, DENKA COMPANY LIMITEDInventors: Shingo Motoike, Kazuki Iizuka, Masashi Nakamura, Mizuki Hasumi
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Patent number: 12040436Abstract: A phosphor substrate having a plurality of light emitting elements mounted on one surface, and includes an insulating substrate, a first electrode group which is disposed on one surface of the insulating substrate and includes a plurality of electrodes bonded to the plurality of light emitting elements, and a phosphor layer which is disposed on one surface of the insulating substrate and includes a phosphor in which a light emission peak wavelength, in a case where light emitted by the light emitting element is used as excitation light, is in a visible light region, and the insulating substrate contains a bismaleimide resin and glass cloth.Type: GrantFiled: December 18, 2019Date of Patent: July 16, 2024Assignee: DENKA COMPANY LIMITEDInventor: Masahiro Konishi
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Patent number: 12036715Abstract: A resin sheet having hairlike bodies arranged regularly on at least one surface of an underlayer can be manufactured by forming the bodies by: melt extruding, from a die with an extrusion molding method, a thermoplastic resin having, on a log-log graph having elongational viscosity ?(t) (unit: Pa·S) as measured at a strain rate of 0.5 (unit: S?1) and at a temperature at which elongation is possible as the vertical axis and elongation time t (unit: S) as the horizontal axis, a region in which the slope (log ?/log t) in the interval 0.1<t<1.0 is no greater than 0.5 and by the temperature range wherein the adhesive force in probe tack measurement is 0.05-0.25 N/mm2 at least partially overlapping with the temperature at which elongation is possible; and casting using a transfer roll on which a relief process has been performed and a touch roll.Type: GrantFiled: January 23, 2019Date of Patent: July 16, 2024Assignee: DENKA COMPANY LIMITEDInventors: Keishi Maeda, Junpei Fujiwara
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Publication number: 20240226997Abstract: A production method for an aluminum-diamond composite having a step of providing a laminate structure including a composition layer containing a diamond powder in an opening of a flat plate-like porous material having the opening so as to be separated from an inner circumferential surface of the opening and a step of press-fitting a melt of a metal containing aluminum into a space between the porous material and the laminate structure and impregnating the composition layer with the melt to form a composited part containing aluminum and diamond and forming metal layers on at least side surfaces of the laminate structure, in which the laminate structure includes a first mold release plate, a first inorganic layer, the composition layer, a second inorganic layer and a second mold release plate in this order.Type: ApplicationFiled: May 16, 2022Publication date: July 11, 2024Applicant: DENKA COMPANY LIMITEDInventors: Hiroaki OTA, Yosuke ISHIHARA, Daisuke GOTO
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Publication number: 20240227284Abstract: A photocurable resin composition, including a polymerizable organic compound component and a photopolymerization initiator, wherein a light transmittance at a wavelength of 405 nm of a cured product with an average thickness of 100 ?m is 24% or less, and the cured product is cured by irradiating the photocurable resin composition with a light having a light intensity of 1.7 mW/cm2 and an irradiation amount of 7.65 mJ/cm2.Type: ApplicationFiled: April 27, 2022Publication date: July 11, 2024Applicant: DENKA COMPANY LIMITEDInventors: Takumi BABA, Jun YOSHIDA, Takashi DOMOTO
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Publication number: 20240228836Abstract: An adhesive tape includes an adhesive layer containing an adhesive composition, wherein: the adhesive composition contains a styrene-butadiene-based block copolymer, a first tackifier, a second tackifier, and a third tackifier; a butadiene portion of the styrene-butadiene-based block copolymer is partially hydrogenated; the first tackifier is at least one of a rosin ester which is liquid at 23° C. and a terpene-based resin which is liquid at 23° C.; the second tackifier has a softening point of 70 to 120° C.; the third tackifier has a softening point of 140° C. or higher; holding force of the adhesive tape at 70° C. based on JIS Z0237 is 100 minutes or more; a melt viscosity of the adhesive composition at 200° C. is 100000 cp or lower.Type: ApplicationFiled: July 4, 2022Publication date: July 11, 2024Applicant: DENKA COMPANY LIMITEDInventors: Akiyoshi KIMURA, Yoshiaki YAMAMOTO, Daisuke YOSHIMURA
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Publication number: 20240228743Abstract: To provide: an inorganic oxide powder which, when filled in a resin material, can simultaneously achieve a high dielectric constant and a low dielectric dissipation factor; a method for producing the same; and a resin composition comprising the inorganic oxide powder. Provided is an inorganic oxide powder comprising a spherical titanium oxide powder having a rutile phase, wherein the ratio of the rutile phase in the inorganic oxide powder is 90 mass % or more. Further provided is a resin composition comprising the inorganic oxide powder and at least one resin selected from a thermoplastic resin and a thermosetting resin.Type: ApplicationFiled: May 18, 2022Publication date: July 11, 2024Applicant: DENKA COMPANY LIMITEDInventors: Takuto OKABE, Motoharu FUKAZAWA
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Publication number: 20240230649Abstract: Disclosed is an anti-norovirus antibody that reacts with noroviruses of many genotypes and can collectively detect the noroviruses. The anti-norovirus antibody or an antigen-binding fragment thereof undergoes antigen-antibody reaction with the peptides composed of the amino acid sequences of SEQ ID NO: 1 and SEQ ID NO: 2, respectively. The anti-norovirus antibody, which can broadly bind to noroviruses and detect a wide range of human noroviruses with high specificity and sensitivity, and a norovirus immunoassay and a norovirus immunoassay device, both using the anti-norovirus antibody, are provided.Type: ApplicationFiled: May 20, 2022Publication date: July 11, 2024Applicant: Denka Company LimitedInventors: Yuji SAITO, Koji HIRAOKA, Shinya OGASAWARA
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Patent number: 12031240Abstract: A fiber for artificial hair formed of a polyvinyl chloride-based resin composition. The fiber for artificial hair has a value X1 of a loss tangent tans at 70° C. of 0.06 or more and 0.12 or less, when dynamic viscoelasticity is measured under the following conditions, and has a peak in a temperature range of 90° C. or higher and 110° C. or lower. (Dynamic viscoelasticity measurement conditions) The measurement is performed by sandwiching a bundle of 40 fibers for artificial hair that are arranged at a heating rate of 4° C./min and a frequency of 1 Hz.Type: GrantFiled: November 15, 2019Date of Patent: July 9, 2024Assignee: DENKA COMPANY LIMITEDInventors: Atsushi Horihata, Atsushi Takei
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Publication number: 20240218215Abstract: A composition for temporary bonding with excellent compatibility, suitability for spin coating process, heat resistance, and suitability for various release processes. The composition includes: (A) a bifunctional (meth)acrylate not having a cyclic structure; (B) a bifunctional (meth)acrylate having a cyclic structure; and (C) a photo radical polymerization initiator.Type: ApplicationFiled: April 26, 2022Publication date: July 4, 2024Applicant: DENKA COMPANY LIMITEDInventors: Tometomo UCHIDA HAMAGUCHI, Takako TANIGAWA HOSHINO, Megumi SUDO, Hiromi OKUMURA, Jun YOSHIDA
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Publication number: 20240217819Abstract: A boron nitride powder that is an aggregate of boron nitride particles, wherein, when each of 20 boron nitride particles A that are selected from the boron nitride powder is crushed, a ratio of an average value Y (?m) to an average particle diameter X (?m) is 0.20 or more, wherein each of 20 boron nitride particles A is crushed by gradually applying a load at a loading rate of 0.7 mN/second in an arbitrary direction, the average particle diameter X (?m) is an average particle diameter of the boron nitride powder before applying the load, and the average value Y (?m) is displacement amounts in the direction of the boron nitride particles A until crushing.Type: ApplicationFiled: March 22, 2022Publication date: July 4, 2024Applicant: DENKA COMPANY LIMITEDInventors: Yusuke SASAKI, Kenji MIYATA, Tomonari MIYAZAKI, Takako ARAI
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Patent number: 12027652Abstract: A phosphor substrate having at least one light emitting element mounted on one surface, includes an insulating substrate, at least one electrode pair disposed on one surface of the insulating substrate and bonded to the light emitting element, and a phosphor layer disposed on one surface of the insulating substrate, including a phosphor in which a light emission peak wavelength, in a case where light emitted by the element is used as excitation light, is in a visible light region, in which a bonded surface of the electrode pair facing an outer side in a thickness direction of the insulating substrate, the bonded surface being bonded to the light emitting element, is positioned further on the outer side in the thickness direction than a non-bonded surface other than the bonded surface, and at least a part of the phosphor layer is disposed around the bonded surface of the one surface.Type: GrantFiled: December 18, 2019Date of Patent: July 2, 2024Assignee: DENKA COMPANY LIMITEDInventor: Masahiro Konishi
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Patent number: 12024657Abstract: An object of the present invention is to provide an adhesive tape having flexibility even at a low temperature, having excellent adhesive force at low temperature and after a certain period, and having excellent holding force after a certain period, and suppressing adhesive residue at peeling off even after being left for a certain period. According to the present invention, provided is an adhesive tape comprising a substrate and an adhesive layer, wherein the adhesive layer is formed directly on the substrate or with another layer therebetween, the substrate contains a polyvinyl chloride resin, a plasticizer, and a zinc compound, a content of the plasticizer in the substrate is 30 to 50 mass % with respect to the total mass of the substrate, a content of a zinc atom in the substrate is 0.01 to 0.15 mass % with respect to the total mass of the substrate, and the adhesive layer contains an adhesive component and a vulcanizing agent.Type: GrantFiled: February 15, 2019Date of Patent: July 2, 2024Assignee: Denka Company LimitedInventors: Akiyoshi Kimura, Daisuke Yoshimura
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Publication number: 20240209622Abstract: A fireproof heat insulating board including a foamed resin molded body filled with a slurry, the foamed resin molded body having continuous voids, wherein the filled slurry forms a hydrate containing water of crystallization in an amount of 50 kg/m3 or more through hydration reaction after the filling, and at least a part of the surface of the board is reinforced with one or more inorganic fibers selected from the group consisting of a basalt fiber and a ceramic fiber.Type: ApplicationFiled: March 3, 2021Publication date: June 27, 2024Applicants: JSP CORPORATION, DENKA COMPANY LIMITEDInventors: Kazuto TABARA, Hironori NAGASAKI, Kohei MIZUTA, Masanori MITSUMOTO, Yoshinori SHIMOJO, Hironobu KIKKAWA
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Publication number: 20240207395Abstract: An adjuvant activity enhancer for a CpG-ODN or squalene-comprising emulsion, containing as an active ingredient a peptide nucleic acid to which a cell-penetrating peptide is bound. A method for enhancing an adjuvant activity of a CpG-ODN or squalene-comprising emulsion, including combining a peptide nucleic acid to which a cell-penetrating peptide is bound with the CpG-ODN or squalene-comprising emulsion.Type: ApplicationFiled: April 7, 2022Publication date: June 27, 2024Applicant: DENKA COMPANY LIMITEDInventor: Ryotaro MITSUMATA
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Publication number: 20240208817Abstract: Provided is a hexagonal boron nitride powder including: secondary particles formed through agglomeration of primary particles of hexagonal boron nitride, in which in a cumulative distribution of volume-based particle sizes measured through a laser diffraction/light scattering method, the particle sizes at which cumulative values from small particle sizes reach 10%, 50%, and 90% of the total are respectively D10, D50, and D90, with D50 being 3 to 30 ?m, and a D90/D10 ratio is 4.0 or more.Type: ApplicationFiled: June 16, 2021Publication date: June 27, 2024Applicant: Denka Company LimitedInventor: Ryuki MATSUI