Patents Assigned to DENKA COMPANY LIMITED
  • Publication number: 20230220263
    Abstract: A heat-conductive resin composition containing an inorganic filler component and a resin component, wherein the inorganic filler component includes first and second inorganic fillers, a particle size distribution has a first maximum point caused by the first inorganic filler and a second maximum point caused by the second, the diameter at the first maximum point is 15 ?m or more, the diameter at the second is ? or less that at the first, an integrated amount of frequency between a peak start and end in a peak having the first maximum point is 50% or more, and the first inorganic filler is formed by agglomerating hexagonal boron nitride primary particles and has a crushing strength of 6 MPa or more. The heat dissipation sheet is obtained by molding the heat-conductive resin composition.
    Type: Application
    Filed: June 11, 2021
    Publication date: July 13, 2023
    Applicant: DENKA COMPANY LIMITED
    Inventors: Kosuke WADA, Kiyotaka FUJI, Yoshitaka TANIGUCHI
  • Publication number: 20230220262
    Abstract: A heat dissipation sheet having excellent thermal conductance, is a molded thermally conductive resin composition prepared by blending an inorganic filler component and a resin component, wherein the inorganic filler component particle size distribution includes a first maximum point attributable to the first inorganic filler and a second maximum point attributable to the second inorganic filler; the particle size at the first maximum point is 15 ?m or more; the particle size at the second maximum point is ? or less the particle size at the first maximum point; and an accumulated amount of the frequency between the peak start and the peak end of the peak having the first maximum point is 50% or more, and which has a surface roughness of from 1.5 to 3.0 ?m and a thickness of 0.2 mm or less.
    Type: Application
    Filed: June 11, 2021
    Publication date: July 13, 2023
    Applicant: DENKA COMPANY LIMITED
    Inventors: Kosuke WADA, Kiyotaka FUJI, Yoshitaka TANIGUCHI
  • Publication number: 20230212332
    Abstract: A PVA excellent in resistance to melting at high temperature is provided. The polyvinyl alcohol-based polymer is a saponificated product of a homopolymer composed of a vinyl ester monomer, a copolymer of a vinyl ester monomer and a monofunctional monomer other than the vinyl ester, a copolymer of a vinyl ester monomer and a polyfunctional monomer, or a copolymer of a vinyl ester monomer, a monofunctional monomer other than vinyl ester, and a polyfunctional monomer has a particle size of 50 nm or more at a cumulative frequency of 50% in particle size distribution by dynamic light scattering measurement of a 0.4 mass % aqueous solution of the polyvinyl alcohol-based polymer at 25° C.
    Type: Application
    Filed: July 15, 2021
    Publication date: July 6, 2023
    Applicant: DENKA COMPANY LIMITED
    Inventor: Akihiro YAMASHITA
  • Publication number: 20230215679
    Abstract: An electron source according to the present disclosure includes a columnar portion made of a first material having an electron emission characteristic; and a tubular portion that is disposed to surround the columnar portion and made of a second material having a higher work function than the first material, wherein a hole that extends in a direction from one end face toward the other end face and has a substantially circular cross-sectional shape is formed in the tubular portion, and the columnar portion has a substantially triangular or substantially quadrangular cross-sectional shape and is fixed to the tubular portion in an abutting engagement with an inner surface of the hole.
    Type: Application
    Filed: April 14, 2021
    Publication date: July 6, 2023
    Applicant: Denka Company Limited
    Inventors: Dai TSUKADA, Hiromitsu CHATANI, Daisuke ISHIKAWA
  • Patent number: 11691919
    Abstract: A powdered quick-setting agent containing a calcium aluminate and a sodium silicate, preferably further containing at least one selected from the group consisting of an alkali metal sulfate, an alkaline earth metal sulfate, and an aluminum sulfate.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: July 4, 2023
    Assignee: Denka Company Limited
    Inventors: Takamitsu Murokawa, Masahiro Iwasaki, Shunichi Mishima, Katsuichi Miyaguchi, Akitoshi Araki, Yasuhiro Ishii, Kenji Hatta, Takanori Sakakibara
  • Publication number: 20230203599
    Abstract: The present invention provides a primer set for detecting the presence of Staphylococcus argenteus in a specimen, the primer set comprising: a first primer; and a second primer, in which the first primer and the second primer target a nuc gene of Staphylococcus argenteus.
    Type: Application
    Filed: March 31, 2021
    Publication date: June 29, 2023
    Applicants: Denka Company Limited, Toho University
    Inventors: Kazuhiro TATEDA, Yuya MIYATAKE
  • Publication number: 20230202921
    Abstract: A cement admixture containing one kind or two or more kinds of non-hydraulic compound(s) selected from ?-2CaO·SiO2, 3CaO·2SiO2, ?-CaO·SiO2, and calcium magnesium silicate, wherein the non-hydraulic compound contains Li, and the content rate of the Li is 0.001 to 1.0% by mass in terms of oxide. Such admixtures may contain, as chemical components, 0.001 to 1.0 parts by mass of Li2O, 45 to 70 parts by mass of CaO, 30 to 55 parts by mass of SiO2, and 0 to 10 parts by mass of Al2O3 in 100 parts by mass of the cement admixture.
    Type: Application
    Filed: April 16, 2021
    Publication date: June 29, 2023
    Applicant: DENKA COMPANY LIMITED
    Inventors: Taiichiro MORI, Maho YOSHIOKA, Daiki SHIMAZAKI, Noriyuki ARANO
  • Patent number: 11685815
    Abstract: To provide a vinylidene-fluoride resin film having low cloudiness and good visibility of a pattern and the like of a decorative film of a lower layer although having a matte tone with low glossiness. The vinylidene-fluoride resin film comprises crosslinked acrylic acid ester resin particles, in which the crosslinked acrylic acid ester resin particles have an average particle diameter of 5% or more and 40% or less to the thickness of the vinylidene-fluoride resin film and the arithmetic average surface roughness (Ra) of the vinylidene-fluoride resin film is 0.4 ?m or more and less than 2 ?m.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: June 27, 2023
    Assignee: DENKA COMPANY LIMITED
    Inventors: Kouta Nagaoka, Tadashi Sawasato, Keiji Takano
  • Publication number: 20230200242
    Abstract: An n-type material for thermoelectric conversion obtained by doping a p-type material for thermoelectric conversion with a dopant, the p-type material for thermoelectric conversion containing a carbon nanotube and a conductive resin, in which the dopant contains an anion that is a complex ion, an alkali metal cation, and a cation scavenger.
    Type: Application
    Filed: May 20, 2021
    Publication date: June 22, 2023
    Applicant: Denka Company Limited
    Inventors: Yasuaki SAKURAI, Masahide YAMADA, Jun WATANABE
  • Publication number: 20230193103
    Abstract: The alumina powder contains: a first alumina particle having an average particle diameter of 0.1 µm or more and less than 1 µm; a second alumina particle having an average particle diameter of 1 µm or more and less than 10 µm; and a third alumina particle having an average particle diameter of 10 µm or more and 100 µm or less, wherein each of the average particle diameters is a particle diameter measured using laser light diffraction scattering particle size distribution analyzer, average sphericity of first alumina particle having projected area equivalent circle diameter of 0.1 µm or more and 1 µm or less as determined by microscopy is 0.80 or more and 0.98 or less, a specific surface area of first alumina particle is 1.9 m2/g or more and 20.0 m2/g or less, and content ratio of an ? crystal phase is 80% by mass or more.
    Type: Application
    Filed: March 24, 2021
    Publication date: June 22, 2023
    Applicant: DENKA COMPANY LIMITED
    Inventors: Takafumi KOMAKI, Junya NITTA, Yoshiaki OKAMOTO, Masakazu HIRATA, Genta KARINO
  • Publication number: 20230193090
    Abstract: A composition for temporary bonding, includes: (A) a (meth)acrylate having the following (A-1) and (A-2): (A-1) a monofunctional (meth)acrylate whose side chain is an alkyl group having 18 or more carbon atoms and homopolymer has a Tg of ?100° C. to 60° C., and (A-2) a polyfunctional (meth)acrylate; (B) a polyisobutene homopolymer and/or a polyisobutene copolymer; and (C) a photo radical polymerization initiator.
    Type: Application
    Filed: May 17, 2021
    Publication date: June 22, 2023
    Applicant: DENKA COMPANY LIMITED
    Inventors: Tometomo UCHIDA, Toru ARAI, Takashi DOMOTO, Takako TANIGAWA, Jun WATANABE, Megumi SUDO, Jun YOSHIDA
  • Patent number: 11682604
    Abstract: To provide a method for manufacturing a heat dissipation component having excellent heat dissipation properties, in which there is minimal return of warping after the bonding of a circuit board, and to provide a heat dissipation component manufactured using the method. Provided is a method for manufacturing a warped flat-plate-shaped heat dissipation component containing a composite part that comprises silicon carbide and an aluminum alloy, wherein the method for manufacturing the heat dissipation component is characterized in that the heat dissipation component is sandwiched in a concave-convex mold having a surface temperature of at least 450° C. and having a pair of opposing spherical surfaces measuring 7000-30,000 mm in curvature radius, and pressure is applied for 30 seconds or more at a stress of 10 kPa or more such that the temperature of the heat dissipation component reaches at least 450° C.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: June 20, 2023
    Assignee: DENKA COMPANY LIMITED
    Inventors: Daisuke Goto, Takeshi Miyakawa, Yosuke Ishihara
  • Publication number: 20230183480
    Abstract: A maleimide-based copolymer which allows to obtain a resin composition having balanced heat resistance providing property and impact resistance, superior flowabillty, and low yellowness (YI); a maleimide-based copolymer composition using such maleimide-based copolymer; a resin composition.; and an injection molded body are provided. A maleimide-based copolymer, including: aromatic vinyl monomer unit, vinyl cyanide monomer unit, and maleimide monomer unit; wherein: the maleimide-based copolymer has a weight average molecular weight of 50,000 to 110,000; and the maleimide-based copolymer has a mid-point glass transition temperature measured in accordance with JIS K-7121 of 165° C. to 200° C., is provided.
    Type: Application
    Filed: July 20, 2021
    Publication date: June 15, 2023
    Applicant: DENKA COMPANY LIMITED
    Inventors: Soichiro NAKANISHI, Masanori MATSUMOTO, Kohei NISHINO
  • Publication number: 20230176052
    Abstract: An immunoassay utilizing a monoclonal antibody which specifically reacts with both of P1 protein and P30 protein of Mycoplasma pneumoniae, which monoclonal antibody has a higher affinity with P1 protein and P30 protein of Mycoplasma pneumoniae than the known monoclonal antibodies, is disclosed. The immunoassay utilizes an antigen-antibody reaction between a monoclonal antibody which specifically reacts with P1 protein and P30 protein of Mycoplasma pneumoniae and which specifically reacts with a peptide containing an amino acid sequence composed of PPQPG or antigen-binding fragment thereof, and P1 protein and P30 protein derived from Mycoplasma pneumoniae.
    Type: Application
    Filed: April 6, 2021
    Publication date: June 8, 2023
    Applicant: Denka Company Limited
    Inventors: Risa KOHIYAMA, Tomomi TAKANO, Takashi MIYAZAWA
  • Publication number: 20230176055
    Abstract: An object of the present invention is to provide: a monoclonal antibody that makes it possible that adenovirus contained in a test specimen is detected and measured rapidly, simply, and with high-sensitivity; and an immunoassay for adenovirus and an immunoassay device therefor, for both of which the monoclonal antibody is used. The present invention provides: a monoclonal antibody or an antigen-binding fragment thereof, which undergoes antigen-antibody reaction with a polypeptide having the sequence of the 21st to 944th amino acids in the amino acid sequence of SEQ ID NO: 1; and an immunoassay and an immunoassay device, for both of which the monoclonal antibody or an antigen-binding fragment thereof is used.
    Type: Application
    Filed: April 15, 2021
    Publication date: June 8, 2023
    Applicant: Denka Company Limited
    Inventors: Takashi MIYAZAWA, Miwa KUWAHARA
  • Publication number: 20230175076
    Abstract: The present invention provides a primer set for detecting the presence of Klebsiella variicola in a specimen, wherein the primer set consists of a first primer and a second primer that target the gyrB gene of Klebsiella variicola.
    Type: Application
    Filed: March 31, 2021
    Publication date: June 8, 2023
    Applicants: Denka Company Limited, Toho University
    Inventors: Kazuhiro TATEDA, Yuya MIYATAKE, Kazuaki YAMAUCHI
  • Publication number: 20230176056
    Abstract: An object of the present invention is to provide: a monoclonal antibody that makes it possible that adenovirus contained in a test specimen is detected and measured rapidly, simply, and with high-sensitivity; and an immunoassay for adenovirus and an immunoassay device therefor, for both of which the monoclonal antibody is used. The present invention provides: a monoclonal antibody or an antigen-binding fragment thereof, which undergoes antigen-antibody reaction with each subtype of adenovirus: type 1, type 2, type 3, type 4, type 5, type 6, type 7 type 8, type 11, type 19, type 31, type 37, type 53, type 54, type 56, type 64, type 79, type 81, and type 85; and an immunoassay and an immunoassay device, for both of which the monoclonal antibody or an antigen-binding fragment thereof is used.
    Type: Application
    Filed: April 15, 2021
    Publication date: June 8, 2023
    Applicant: DENKA COMPANY LIMITED
    Inventors: Takashi MIYAZAWA, Miwa KUWAHARA
  • Publication number: 20230176044
    Abstract: An examination kit includes a flow channel (2) provided on a substrate formed of resin and transporting a liquid sample from one end side to the other end side, a solid-phase part (50) provided on the other end side of the flow channel (2), in which an antibody is set to a solid-phase, a detection unit (two electrodes (20)) provided with an electrode portion to detect a reaction of the liquid sample with respect to the antibody, and a fine uneven structure having a plurality of protrusions formed integrally with the flow channel (2), in which the fine uneven structure has a first fine structure region (31) in which the plurality of protrusions are provided relatively loosely, and a second fine structure region (32) in which the plurality of protrusions are provided relatively densely, and the first fine structure region (31) and second fine structure region (32) are provided further toward the one end side of the flow channel (2) than the solid-phase part (50).
    Type: Application
    Filed: April 23, 2021
    Publication date: June 8, 2023
    Applicant: DENKA COMPANY LIMITED
    Inventors: Yuto AKIYAMA, Shuhei AOYAMA
  • Publication number: 20230159742
    Abstract: The heat-shrinkable film includes a block copolymer comprising a vinyl aromatic hydrocarbon-derived structural unit and a conjugated diene-derived structural unit as a main component.
    Type: Application
    Filed: January 9, 2023
    Publication date: May 25, 2023
    Applicant: Denka Company Limited
    Inventors: Yuya Nakamura, Jun Yoshida
  • Publication number: 20230159725
    Abstract: An alumina powder containing alumina particles, wherein among the alumina particles, an average sphericity of an alumina particle having a projected area equivalent circle diameter of 50 nm or more as determined by microscopy is 0.80 or more, a content ratio of an alumina particle having a particle diameter of 75 ?m or more is 0.05% by mass or less, an average particle diameter of the alumina powder is 0.2 ?m or more and 15 ?m or less, the average particle diameter is a particle diameter measured using a laser light diffraction scattering particle size distribution analyzer, and an amount of water included in the alumina powder measured by a specific measurement method is 30 ppm or more and 500 ppm or less.
    Type: Application
    Filed: March 24, 2021
    Publication date: May 25, 2023
    Applicant: DENKA COMPANY LIMITED
    Inventors: Junya NITTA, Jun YAMAGUCHI, Tomohiro KAWABATA, Hideaki HIRAI, Yasuhisa NISHI