Patents Assigned to Denkenberger Thermal, LLC
  • Patent number: 9618278
    Abstract: A microchannel heat exchanger (800) is manufactured by bonding a first sheet (802a) of material and a second sheet (802b) of material in a first connection pattern for integral formation of a core portion (801) and a manifold portion (808) for the first and second sheets (802a, 802b) of material. A third sheet (802c) of material is then superposed on to the second sheet (802b) of material and bonded in a second connection pattern to the second sheet of material for integral formation of the core portion (801) and the manifold portion (808) for the second and third sheets (802b, 802c) of material. The second and third sheets (802b, 802c) of material are bonded without bonding the second sheet (802b) of the material to the first sheet (802a) of material. The core portion (801) and the manifold portion (808) of the heat exchanger (800) are thus integrally created. The interstices between the first, second, and third sheets (802a, 802b, 802c) of material are then expanded to create fluid flow channels (806).
    Type: Grant
    Filed: December 2, 2010
    Date of Patent: April 11, 2017
    Assignee: Denkenberger Thermal, LLC
    Inventor: David C. Denkenberger