Patents Assigned to Denko Corporation
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Publication number: 20100129986Abstract: The present invention relates to a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer of the dicing film has a laminated structure of a heat-expandable pressure-sensitive adhesive layer containing a foaming agent and an active energy ray-curable antifouling pressure-sensitive adhesive layer, which are laminated on the base material in this order, and in which the die-bonding film is constituted by a resin composition containing an epoxy resin. Moreover, the present invention provides a process for producing a semiconductor device which includes using the above-described dicing die-bonding film.Type: ApplicationFiled: November 25, 2009Publication date: May 27, 2010Applicant: NITTO DENKO CORPORATIONInventors: Katsuhiko KAMIYA, Hironao OOTAKE, Takeshi MATSUMURA, Shuuhei MURATA
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Publication number: 20100129988Abstract: The present invention provides a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer of the dicing film is a pressure-sensitive adhesive layer which contains a gas-generating agent in a ratio of 10 to 200 parts by weight based on 100 parts by weight of a base polymer, the base polymer is an acrylic polymer A composed of a monomer composition containing 50% by weight or more of an acrylic acid ester represented by CH2?CHCOOR (in which R is an alkyl group having 6 to 10 carbon atoms) and 1% by weight to 30% by weight of a hydroxyl group-containing monomer and containing no carboxyl group-containing monomer, and the die-bonding film is formed of a die-adhering layer.Type: ApplicationFiled: November 25, 2009Publication date: May 27, 2010Applicant: NITTO DENKO CORPORATIONInventors: Hironao OOTAKE, Katsuhiko KAMIYA
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Publication number: 20100129036Abstract: An opto-electric hybrid board which includes an optical waveguide portion 2, an electric circuit board 1, and optical elements mounted on this electric circuit board 1. In the optical waveguide portion 2, a linear core 22 for an optical path and protruding alignment marks 24 for positioning of the optical elements and each having a surface formed with a recessed portion 24a for identification are formed on a surface of a translucent under cladding layer 21. The above-mentioned core 22 is covered with an over cladding layer 23. The above-mentioned alignment marks 24 are covered with a translucent resin film 25 so that the recessed portion 24a of each of the above-mentioned alignment marks 24 is formed as a hollow portion A filled with air.Type: ApplicationFiled: November 20, 2009Publication date: May 27, 2010Applicant: NITTO DENKO CORPORATIONInventor: Masayuki HODONO
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Publication number: 20100129987Abstract: The present invention relates to a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer of the dicing film is a heat-expandable pressure-sensitive adhesive layer formed of a heat-expandable pressure-sensitive adhesive containing an acrylic polymer A and a foaming agent. The acrylic polymer A is an acrylic polymer composed of a monomer composition containing 50% by weight or more of an acrylic acid ester represented by CH2?CHCOOR (wherein R is an alkyl group having 6 to 10 carbon atoms) and 1% by weight to 30% by weight of a hydroxyl group-containing monomer and containing no carboxyl group-containing monomer. The heat-expandable pressure-sensitive adhesive layer has a surface free energy of 30 mJ/m2 or less. The die-bonding film is constituted by a resin composition containing an epoxy resin.Type: ApplicationFiled: November 25, 2009Publication date: May 27, 2010Applicant: NITTO DENKO CORPORATIONInventors: Katsuhiko KAMIYA, Hironao OOTAKE, Takeshi MATSUMURA, Shuuhei MURATA
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Publication number: 20100128216Abstract: A liquid-crystalline coating fluid comprises: a lyotropic liquid crystal compound; a vinyl alcohol-based polymer; and a solvent, wherein 0.05 to 1.5 weight parts of vinyl alcohol-based polymer is contained with respect to 100 weight parts of the lyotropic liquid-crystal compound.Type: ApplicationFiled: November 18, 2008Publication date: May 27, 2010Applicant: NITTO DENKO CORPORATIONInventors: Toru Umemoto, Toshimasa Nishimori, Tadayuki Kameyama
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Publication number: 20100128006Abstract: An optical waveguide 30 having a bending groove 34 parallel to two long sides of a rectangular shape thereof. The optical waveguide 30 is bent along the bending groove 34 so as to come into close contact with a frame of an optical touch panel. This makes it possible to attach the optical waveguide 30 to the frame without misalignment during assembly. Therefore, the optical waveguide 30 can emit light beams in a direction perpendicular to one side of a rectangular display screen opposed to one long side of the rectangular shape thereof. Further, the width of the frame of the optical touch panel 30 can be made smaller than that of the optical waveguide 30. This makes it possible to achieve reduction in the width of the frame of the optical touch panel.Type: ApplicationFiled: November 25, 2009Publication date: May 27, 2010Applicant: NITTO DENKO CORPORATIONInventor: Yusuke Shimizu
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Patent number: 7723211Abstract: An arithmetic processing part in a controller detects a position of a defect such as a chip or a crack that occurs at an outer periphery of a semiconductor wafer, and then a memory in the controller stores position information of the defect. The controller reads the position information of the defect through a network in each process. On the basis of this position information, the controller determines a direction of joining a dicing tape to the semiconductor wafer or a direction of separating a protective tape from a front face of the semiconductor wafer.Type: GrantFiled: July 1, 2008Date of Patent: May 25, 2010Assignee: Nitto Denko CorporationInventors: Masayuki Yamamoto, Satoshi Ikeda
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Patent number: 7722935Abstract: A modified polymer which can serve as a raw material of novel reverse dispersion retardation films is provided, the modified polymer having no need to select a plurality of monomers or polymers in order to realize a reverse dispersion and having no problems concerning glass transition temperature or the like in drawing treatment. A polymer having a polyol skeleton as its main chain is caused to react with a compound for modification such as an aromatic carboxylic acid hydride. Through this reaction, a modified polymer in which a chemical group such as an aromatic carbonyl group is bonded to an oxygen atom in a side chain of the polyol skeleton is prepared. For example, polyvinyl alcohols and benzoyl chloride can be used as the polymer and the compound for modification, respectively. The chemical group may be a benzoyl group. When this modified polymer is formed into a film and then subjected to drawing treatment, a retardation film which exhibits a reverse wavelength dispersion characteristic can be obtained.Type: GrantFiled: June 14, 2005Date of Patent: May 25, 2010Assignee: Nitto Denko CorporationInventors: Seiji Umemoto, Yutaka Ohmori, Michie Sakamoto, Takashi Kamijou, Junzou Miyazaki
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Patent number: 7723617Abstract: A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 ?m, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer.Type: GrantFiled: August 20, 2007Date of Patent: May 25, 2010Assignee: Nitto Denko CorporationInventors: Jun Ishii, Yasunari Ooyabu
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Patent number: 7722965Abstract: The present invention provides an organic electroluminescence device including an organic layer comprising an emissive layer; a pair of electrodes comprising an anode and a cathode, and sandwiching the organic layer, wherein at least one of the electrodes is transparent; a transparent layer provided adjacent to a light extracting surface of the transparent electrode; and a region substantially disturbing reflection and retraction angle of light provided adjacent to a light extracting surface of the transparent layer or in an interior of the transparent layer, wherein the transparent layer has a refractive index substantially equal to or more than the refractive index of the emissive layer.Type: GrantFiled: September 7, 2004Date of Patent: May 25, 2010Assignee: Nitto Denko CorporationInventors: Noriyuki Juni, Toshitaka Nakamura, Yuji Hotta
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Publication number: 20100123682Abstract: A touch panel 30 of the present invention comprises: a light-emitting sided-optical waveguide 33; a light-receiving sided-optical waveguide 34; and an electromagnetic induction-type digitizer 36. In the touch panel of the present invention, a position coordinate is recognized using an electronic pen by an electromagnetic induction-type digitizer 36 when high resolution is required. A position coordinate is recognized using a finger by the optical waveguides 33 and 34 when high resolution is not required. This makes it possible to materialize the touch panel 30 having a high resolution and a lower power consumption regardless of its narrow frame.Type: ApplicationFiled: November 3, 2009Publication date: May 20, 2010Applicant: NITTO DENKO CORPORATIONInventor: Noriyuki Juni
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Publication number: 20100124657Abstract: An object of the present invention is to provide a thermally conductive sheet having an improved electrical insulating property and a method of producing the same. A thermally conductive sheet includes a resin composition that contains a silicone resin and inorganic particles, wherein the inorganic particles include metal oxide particles that have a particle diameter of 1-100 nm and are dispersed in the silicone resin while being chemically bonded to the silicone resin.Type: ApplicationFiled: November 16, 2009Publication date: May 20, 2010Applicant: NITTO DENKO CORPORATIONInventor: Keisuke Hirano
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Publication number: 20100124627Abstract: Disclosed is a double-coated pressure-sensitive adhesive sheet adopted to fix a hard disk drive component, which includes a pressure-sensitive adhesive unit including a plastic film base having a thickness of 20 ?m or less and pressure-sensitive adhesive layers arranged on or above both sides of the plastic film base; and non-silicone release liners arranged on both surfaces of the pressure-sensitive adhesive unit. The pressure-sensitive adhesive unit has a thickness of 60 ?m or less, and the double-coated pressure-sensitive adhesive sheet shows an outgassing of 1 ?g/cm2 or less when the double-coated pressure-sensitive adhesive sheet is heated at a temperature of 120° C. for 10 minutes. The double-coated pressure-sensitive adhesive sheet is free from silicone, thereby causes less contamination, evolves less outgas, and is superior in workability. It has further improved followability to difference in level by controlling the thickness of the plastic film base to 13 ?m or less.Type: ApplicationFiled: August 20, 2008Publication date: May 20, 2010Applicant: Nitto Denko CorporationInventors: Takahiro Nonaka, Noritsugu Daigaku, Masahiro Ooura
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Publication number: 20100123943Abstract: Provided is a multilayer reflector about which a complicated step is not required when the molecular alignment of a retardation film is partially relaxed to form a latent image of authentication information, and about which the latent image is not made visible by the generation of unevenness in the surface. A multilayer reflector 1 has a retardation film 10 in which the phase difference ?nd1 to an observation wavelength ? is set to be m×?/4???/16??nd1?m×?/4+?/16 wherein m is a positive odd number, and a metallic reflector 11 laminated on the rear face side of this retardation film 10, wherein an authentication region 10a where predetermined authentication information is beforehand formed in the retardation film 10 is formed to give a phase difference ?nd2 set to be n×?/4??/8??nd2?n×?/4+?/8 wherein n is 0 or a positive even number provided that n<m, and further a light diffusing layer 12 is formed on the front face side of the retardation film 10.Type: ApplicationFiled: June 21, 2006Publication date: May 20, 2010Applicants: NITTO DENKO CORPORATION, NHK SPRING CO., LTD.Inventors: Seiji Umemoto, Kazuhito Kouno, Kazumasa Shibata, Itsuo Takeuchi, Tokio Sakauchi, Tohru Ida
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Patent number: 7718257Abstract: A heat-peelable pressure-sensitive adhesive sheet comprises: a base material; and a thermo-expandable pressure-sensitive adhesive layer containing thermo-expandable microspheres, the thermo-expandable pressure-sensitive adhesive layer having a surface to be adhered to an adherend, wherein the surface of the thermo-expandable pressure-sensitive adhesive layer before subjecting to heating has a centerline average roughness of greater than 0.4 ?m, and has a convex portion resulting from the thermo-expandable microspheres.Type: GrantFiled: November 7, 2001Date of Patent: May 18, 2010Assignee: Nitto Denko CorporationInventors: Akihisa Murata, Toshiyuki Oshima, Yukio Arimitsu, Kazuyuki Kiuchi
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Patent number: 7718284Abstract: A base insulating layer of an FPC board includes a rectangular first insulating portion and a second insulating portion that outwardly extends from one side of the first insulating portion. A conductor layer is formed on one surface of the base insulating layer. The conductor layer includes a pair of rectangular collector portions and a pair of extraction conductor portions that extend in a long-sized shape from the collector portions. One collector portion is formed in a first region of the first insulating portion of the base insulating layer, and the other collector portion is formed in a second region of the first insulating portion. One extraction conductor portion extends from the one collector portion to the second insulating portion, and the other extraction conductor portion extends from the other collector portion to the second insulating portion.Type: GrantFiled: April 17, 2008Date of Patent: May 18, 2010Assignee: Nitto Denko CorporationInventors: Taiki Sueyoshi, Hiroshi Yamazaki
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Patent number: 7718255Abstract: The invention provides cleaning sheets for use in cleaning, e.g., various substrate-processing apparatus, systems for conveying exposure masks (reticles) in microfabrication, etc., and a method of cleaning these with the cleaning sheets. A cleaning sheet which comprises a sheet material comprising a thermoset resin layer having porosity and, formed on one side of the sheet material, a pressure-sensitive adhesive layer comprising a thermoplastic resin.Type: GrantFiled: August 19, 2003Date of Patent: May 18, 2010Assignee: Nitto Denko CorporationInventors: Makoto Namikawa, Yoshio Terada
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Publication number: 20100116432Abstract: Provided is an adhesive method of pressure-sensitive adhesive sheet for vehicle coatings, giving a pressure-sensitive adhesive sheet highly adhesive even to a coating surface easily causing the low adhesion by bleed-out of leveling agent or the like. The adhesive method of pressure-sensitive adhesive sheet for vehicle coatings according to the present invention is characterized in that the difference (absolute value) between the solubility parameter (SP value) of a pressure-sensitive adhesive layer (X) formed on the side of the pressure-sensitive adhesive sheet in contact with the vehicle coating and the solubility parameter (SP value) of the surface control agent contained in the vehicle coating is 0.6 (cal/cm3)1/2 or less.Type: ApplicationFiled: April 22, 2008Publication date: May 13, 2010Applicant: NITTO DENKO CORPORATIONInventors: Masanori Uesugi, Mitsuyoshi Shirai, Takashi Kondou, Masayuki Okamoto, Masahito Niwa
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Publication number: 20100119791Abstract: Disclosed is a heat-peelable pressure-sensitive adhesive sheet which satisfactorily fits a rough surface, develops a sufficient adhesive strength even when a bonding face of adherend is rough, less causes chip scattering when used for holding, during dicing, a semiconductor substrate having a rough surface typically of an encapsulation resin, and, after the completion of working, can be smoothly peeled off from the adherend by heating, without applying stress on the adherend. Also disclosed are a method for working an adherend and a method for producing an electronic component using the heat-peelable pressure-sensitive adhesive sheet. The heat-peelable pressure-sensitive adhesive sheet includes a base material, an organic rubber-like elastic layer and a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres.Type: ApplicationFiled: May 28, 2008Publication date: May 13, 2010Applicant: Nitto Denko CorporationInventors: Yukio Arimitsu, Daisuke Shimokawa
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Publication number: 20100119812Abstract: The present invention relates to a light-reflecting member including a polyolefin resin foam as a light-reflecting layer, the polyolefin resin foam being obtained by foam molding a resin composition containing a polyolefin resin. According to the light-reflecting member of the invention, since it has the above-mentioned constitution, the light-reflecting member is excellent in light reflection, impact-absorbing property, and lightness in weight. Moreover, the process for producing a light-reflecting member of the invention can provide a light-reflecting member excellent in light reflection, impact-absorbing property, and lightness in weight by using a polyolefin resin foam.Type: ApplicationFiled: April 11, 2008Publication date: May 13, 2010Applicant: NITTO DENKO CORPORATIONInventors: Hiroki Fujii, Tomohiro Taruno, Makoto Saitou, Takio Itou, Itsuhiro Hatanaka