Patents Assigned to Denko Corporation
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Patent number: 12127336Abstract: A suspension board with circuit extending in a predetermined direction includes a base insulating layer, and a conductive layer disposed on one side in a thickness direction of the base insulating layer. The base insulating layer includes a first body base and a second body base disposed spaced apart from each other in a width direction, and a connection portion connecting a portion of the first body base in the longitudinal direction to a portion of the second body base in the longitudinal direction. The suspension board with circuit further includes a reinforcing portion disposed on the surface of the connection portion and reinforcing the connection portion. The reinforcing portion includes two or more resin layers laminated in the thickness direction, or a metal member.Type: GrantFiled: December 18, 2020Date of Patent: October 22, 2024Assignee: NITTO DENKO CORPORATIONInventors: Takahito Azuma, Yoshito Fujimura
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Patent number: 12122630Abstract: An adhesive body delivery device includes a main body, a turning portion, and a press-bonding portion; the turning portion is mounted to the main body to be relatively turnable around a first turning axis A1; the press-bonding portion is mounted to the turning portion at a predetermined mounting position, and is turnable in conjunction with the turning portion; the press-bonding portion is configured to deliver an adhesive body at a predetermined delivery position P, and is configured to stick the adhesive body to a target object while press-bonding the adhesive body; a predetermined distance D is ensured between the first turning axis A1 of the turning portion and the mounting position; and the press-bonding portion is configured to turn around a second turning axis A2 passing through the mounting position and being parallel to the first turning axis A1.Type: GrantFiled: December 23, 2019Date of Patent: October 22, 2024Assignee: NITTO DENKO CORPORATIONInventors: Ginji Mizuhara, Atsushi Takashima
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Publication number: 20240342018Abstract: An acquisition and distribution composite has a liquid acquisition side formed of first nonwoven fibers, a hydrophilic core, and a liquid delivery side comprising second nonwoven fibers. The composite has an asymmetric structure, such that the linear density measured in dtex of the first nonwoven fibers is at least 0.7 dtex greater than that of the second nonwoven fibers. In addition, an absorbent hygiene article is formed from the acquisition and distribution composite. A method for producing the acquisition and distribution composite includes providing the three layers and hydroentangling the three-layer structure.Type: ApplicationFiled: April 16, 2024Publication date: October 17, 2024Applicant: Nitto Denko CorporationInventors: Jan Michael TRINKAUS, Patricia RODRIGUEZ
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Publication number: 20240343949Abstract: A pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer of which adhesive face has wettability difficult to change even when exposed to an atmospheric environment, and on which positional deviation or drop is difficult to occur in conveying an electronic component. The pressure-sensitive adhesive layer has an adhesive face protected by a release liner and has a displacement of water contact angles ?1 and ?2 against the adhesive face 10a under the following conditions T1 and T2 of 5° or less: T1: immediately after separating the release liner R1 under an environment of 23° C. T2: after 2 hour exposure of the adhesive face 10a to an atmospheric environment after separating the release liner R1 under an environment of 23° C. ?1: water contact angle (°) of the adhesive face 10a under T1 ?2: water contact angle (°) of the adhesive face 10a under T2 Displacement R(°)=?2??1.Type: ApplicationFiled: December 16, 2021Publication date: October 17, 2024Applicant: NITTO DENKO CORPORATIONInventors: Kazumichi KATO, Shusaku UENO, Takamasa HIRAYAMA
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Publication number: 20240348898Abstract: This infrared security system comprises: at least one detection unit which is provided with an optical laminate and an infrared detection device that is disposed so as to receive infrared light via the optical laminate; and a security system which operates on the basis of output from the infrared detection device. The L* value at the surface of the optical laminate as measured by an ICE method is not less than 4. The infrared detection device is disposed on the opposite side from the surface of the optical laminate so that the position of the infrared detection device is not identified.Type: ApplicationFiled: June 30, 2022Publication date: October 17, 2024Applicant: NITTO DENKO CORPORATIONInventors: Mami KAWAGUCHI, Yudai NUMATA, Shoichi MATSUDA, Ryu YAMAMOTO
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Publication number: 20240347229Abstract: A shield tape is provided in a hybrid cable. The shield tape includes one pair of differential wirings and a shield tape. The shield tape surrounds the one pair of differential wirings. The shield tape includes a substrate layer and a shield layer. The substrate layer has insulating properties. The shield layer is disposed at the opposite side of the one pair of differential wirings with respect to the substrate layer.Type: ApplicationFiled: April 10, 2024Publication date: October 17, 2024Applicants: NITTO DENKO CORPORATION, OKI ELECTRIC CABLE CO., LTD.Inventors: Koichi TSUDA, Kyohei INAMOTO, Naoyuki TANAKA, Hideharu KAJIZUKA, Takuya KOIZUMI
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Publication number: 20240346869Abstract: The present invention strengthens the security level of an infrared security system. The infrared security system for managing unlocking of a lock includes: at least one detection unit that includes an optical laminate and an infrared detection device which is disposed so as to receive infrared light via the optical laminate; and a security system that operates on the basis of output from the infrared detection device. The security system is configured to generate time-series data that indicates motion of a subject on the basis of a subject signal generated when the infrared detection device receives, via the optical laminate, infrared light which has been emitted from a light-emitting device toward the subject and which has been reflected by the subject, and to unlock the lock on the basis of the time-series data.Type: ApplicationFiled: March 29, 2022Publication date: October 17, 2024Applicant: NITTO DENKO CORPORATIONInventors: Mami KAWAGUCHI, Yudai NUMATA, Shoichi MATSUDA, Ryu YAMAMOTO
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Patent number: 12115483Abstract: A ventilation component (1a) includes a supporting portion (10), a gas-permeable membrane (20), and a sealing member (30). The supporting portion (10) has a ventilation path (12) and an annular surface (14). When the ventilation component (1a) is attached to a housing (2), the ventilation path (12) extends in a direction perpendicular to an opening plane of an opening (2a), and extends through the supporting portion (10). The annular surface (14) faces an outer surface (2e) of the housing (2), and surrounds the ventilation path (12) in plan view. The gas-permeable membrane (20) closes the ventilation path (12) in a ventilatable manner. The gas-permeable membrane (20) allows a gas to pass therethrough in a thickness direction of the gas-permeable membrane (20). The sealing member (30) is sandwiched between the outer surface (2e) of the housing (2) and the annular surface (14) to seal a gap between the outer surface (2e) of the housing (2) and the annular surface (14).Type: GrantFiled: June 2, 2020Date of Patent: October 15, 2024Assignee: NITTO DENKO CORPORATIONInventors: Youzou Yano, Takumi Takahashi, Kenichi Nishikawa
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Patent number: 12120960Abstract: A piezoelectric speaker (10) includes a piezoelectric film (35), a first joining layer (51), and an interposed layer (40). The piezoelectric film (35) includes a first electrode (61), a second electrode (62), and a piezoelectric body (30) sandwiched by the first electrode (61) and the second electrode (62). The first joining layer (51) is a layer having pressure-sensitive adhesiveness or adhesiveness. The interposed layer (40) is disposed between the piezoelectric film (35) and the first joining layer (51). Both principal surfaces of the piezoelectric film (35) vibrate up and down as a whole.Type: GrantFiled: November 20, 2018Date of Patent: October 15, 2024Assignee: NITTO DENKO CORPORATIONInventors: Yusuke Komoto, Kohei Oto, Saori Yamamoto, Ryohei Oban, Tomoaki Hishiki
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Patent number: 12120829Abstract: An assembly sheet as a wiring circuit board assembly sheet includes a metal substrate, a wiring circuit structure portion, and a dummy structure portion. The metal substrate includes a product region and a frame region adjacent thereto. The wiring circuit structure portion is disposed on one surface in a thickness direction of the metal substrate in the product region, and includes a terminal portion. The dummy structure portion is disposed on one surface in the thickness direction of the metal substrate in the frame region, includes a plurality of conductive layers aligned in the thickness direction, and has a greater height above the metal substrate than the terminal portion.Type: GrantFiled: March 5, 2021Date of Patent: October 15, 2024Assignee: NITTO DENKO CORPORATIONInventors: Shusaku Shibata, Shun Shiga, Teppei Niino
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Patent number: 12120832Abstract: A member of the present invention is to be placed to cover a ventilation hole in order to allow passage of gas between an outside and an inside of a housing through the ventilation hole of the housing and prevent dust and/or a liquid from entering the inside from the outside through the ventilation hole. The member of the present invention includes a porous membrane having air permeability in a thickness direction and a provisional protective film joined to the porous membrane to cover the porous membrane from the outside side. The provisional protective film is air-impermeable in a thickness direction or has lower air permeability in the thickness direction than the air permeability of the porous membrane. The provisional protective film and the porous membrane are joined to each other in such a manner that the provisional protective film is removable from the porous membrane.Type: GrantFiled: March 18, 2020Date of Patent: October 15, 2024Assignee: NITTO DENKO CORPORATIONInventor: Hiroki Kigami
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Publication number: 20240339335Abstract: A sinter bonding sheet includes a sinter bonding layer that includes sinterable particles containing a conductive metal, and an organic binder, in which the sinter bonding layer has a first adhesive surface for being adhered to an adherend and a second adhesive surface for being adhered to another adherend, and when the value of the minimum load reached during an unloading step in a load-displacement measurement according to the nanoindentation method to the first adhesive surface is b1, and the value of the minimum load reached during the unloading step in the load-displacement measurement according to the nanoindentation method to the second adhesive surface is b2, b1 satisfies ?100 ?N?b1??35 ?N and b2 satisfies ?100 ?N?b2??35 ?N.Type: ApplicationFiled: April 2, 2024Publication date: October 10, 2024Applicant: NITTO DENKO CORPORATIONInventors: Ryota MITA, Yuichi OKOBA
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Publication number: 20240335797Abstract: An object of the present invention is to provide a gas separation membrane containing a novel sulfonated polyimide and having superior gas separation performance. The gas separation membrane of the present invention contains a sulfonated polyimide represented by the following general formula (1): wherein Ar is an aryl group, X is more than 0 and 1 or less, and M+ is H+ or a metal cation.Type: ApplicationFiled: May 16, 2022Publication date: October 10, 2024Applicant: NITTO DENKO CORPORATIONInventors: Toshiyuki KAWASHIMA, Shunsuke NOMI, Yasuyuki SAKAKIBARA, Jianhua FANG, Jingqiu YU, Xiaoxia GUO
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Publication number: 20240336760Abstract: Provided are a method for producing a water-soluble polymer in which a water-soluble polymer can be produced from a pressure-sensitive adhesive as waste under a mild condition, a method for producing a water-absorbent polymer in which a water-absorbent polymer can be produced from a pressure-sensitive adhesive under a mild condition, a water-soluble polymer that can be produced from a pressure-sensitive adhesive, and a water-absorbent polymer that can be produced from a pressure-sensitive adhesive. A method for producing a water-soluble polymer according to an embodiment of the present invention includes bringing a pressure-sensitive adhesive treatment liquid which contains a liquid having a Hansen solubility parameter value of 31 or less and an alkaline compound and in which a concentration of the alkaline compound in the pressure-sensitive adhesive treatment liquid is from 0.001 wt % to 20 wt %, into contact with a pressure-sensitive adhesive.Type: ApplicationFiled: June 28, 2022Publication date: October 10, 2024Applicant: NITTO DENKO CORPORATIONInventors: Yosuke Yamada, Akiyoshi Yamamoto, Takayuki Nomura
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Patent number: 12111530Abstract: According to the present invention, provided is a PDLC film, which includes a PDLC layer excellent in thickness uniformity and is suppressed from causing liquid crystal leakage from the PDLC layer. A method of producing a polymer dispersed liquid crystal film of the present invention includes: applying, to a first transparent conductive film, an emulsion including a solvent, and polymer particles and liquid crystal particles dispersed in the solvent to form an applied layer; drying the applied layer to form a polymer dispersed liquid crystal layer containing a polymer matrix and the liquid crystal particles dispersed in the polymer matrix; and laminating a second transparent conductive film on the polymer dispersed liquid crystal layer, wherein the polymer particles include first polymer particles and second polymer particles, and wherein an average particle diameter of the second polymer particles is larger than an average particle diameter of the first polymer particles.Type: GrantFiled: March 29, 2021Date of Patent: October 8, 2024Assignee: NITTO DENKO CORPORATIONInventors: Hiroyuki Takemoto, Jin Yoshikawa, Masanori Otsuka, Mariko Hirai
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Patent number: 12111009Abstract: Provided is a flame retardant and heat insulating sheet having high flame retardancy and a high heat insulating property. Also provided is a flame retardant heat insulator including such flame retardant and heat insulating sheet. A flame retardant and heat insulating sheet according to one embodiment includes: a flame retardant and heat insulating layer formed from a resin composition (A); and a heat insulating layer, wherein the resin composition (A) contains: a binder resin; a low-melting point inorganic substance; a high-melting point inorganic substance; and voids. A flame retardant and heat insulating sheet according to one embodiment includes: a flame retardant and heat insulating layer formed from a resin composition (B); and a heat insulating layer, wherein the resin composition (B) contains: a binder resin that produces a high-melting point inorganic substance when heated; a low-melting point inorganic substance; and voids and/or a void-forming agent.Type: GrantFiled: November 6, 2020Date of Patent: October 8, 2024Assignee: NITTO DENKO CORPORATIONInventor: Yusuke Sugino
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Patent number: 12114438Abstract: A method for manufacturing a double-sided wiring circuit board includes a first step of preparing a laminate and a second step. The laminate includes a metal core layer, insulating layers, and conductor layers. The insulating layer has a region and an opening that are adjacent to each other. The insulating layer has a region including a part facing the region in a thickness direction, and an opening adjacent to the region. The conductor layer includes a wiring portion and a conductive portion. In the second step, the first and second etching treatments for etching the metal core layer through the openings are carried out to form a via portion having a periphery surrounded by a space, extending between the regions, and connected to the conductive portions.Type: GrantFiled: November 12, 2020Date of Patent: October 8, 2024Assignee: NITTO DENKO CORPORATIONInventors: Shusaku Shibata, Rihito Fukushima, Teppei Niino
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Publication number: 20240329296Abstract: A plastic optical fiber of the present disclosure includes a core and a trench disposed on an outer circumference of the core. The core includes a first region and a second region, the first region having a refractive index n1 decreasing in a direction from a center of the core toward an outer edge of the core, the second region being positioned on an outer circumference of the first region, the second region including the outer edge of the core, the second region having a refractive index n2 being constant. The refractive index n2 of the second region is equal to or lower than the refractive index n1 of the first region, a thickness of the second region is 2 ?m or more and less than 5 ?m, and a refractive index n3 of the trench is lower than the refractive index n2 of the second region.Type: ApplicationFiled: March 26, 2024Publication date: October 3, 2024Applicant: NITTO DENKO CORPORATIONInventors: Toru Moriya, Kazuya Takayama, Hiroshi Ohmura
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Publication number: 20240329295Abstract: A plastic optical fiber of the present disclosure includes: a core including a first region having a refractive index decreasing in a direction from a center of the core toward an outer edge of the core; and a trench disposed on an outer circumference of the core. When a refractive index difference between a refractive index n1 at the outer edge of the core and a refractive index n2 of the trench is defined as ?n and a thickness of the trench is defined as d (?m), a value of ?n×d is 0.010 or more and 0.06 or less.Type: ApplicationFiled: March 26, 2024Publication date: October 3, 2024Applicant: NITTO DENKO CORPORATIONInventors: Takashi Shimizu, Toru Moriya, Kazuya Takayama, Hiroshi Ohmura
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Publication number: 20240329343Abstract: A photoelectric composite transmission module includes: a photoelectric hybrid substrate including: the substrate; a photoelectric conversion unit on a first surface of the substrate; and an optical waveguide provided on a second surface of the substrate; a first housing on one surface side of the photoelectric hybrid substrate, the one surface side corresponding to a surface of the photoelectric hybrid substrate on which the photoelectric conversion unit is provided; a second housing on the other surface side of the photoelectric hybrid substrate, the other surface side corresponding to a surface of the photoelectric hybrid substrate on which the optical waveguide is provided; and a heat-transfer member provided between the surface of the photoelectric hybrid substrate on which the photoelectric conversion unit is provided and the first housing. The photoelectric conversion unit is covered with resin. A surface of the resin and the first housing abut the heat-transfer member.Type: ApplicationFiled: March 21, 2024Publication date: October 3, 2024Applicant: NITTO DENKO CORPORATIONInventors: Atsushi Yamagishi, Masataka Yamaji, Naoto Konegawa