Abstract: This optical filter 10 has an L* of at least 20 as measured by the SCE method, wherein the linear transmittance is at least 60% with respect to light the wavelength of which falls at least partially within the wavelength range of 760 nm-2,000 nm, and the temperature, at which the optical filter contracts by being heated, is at least 85° C.

Abstract: An optical stack includes: a first optical sheet having a first principal face with a concavo-convex structure and a second principal face at an opposite side from the first principal face; and an adhesive layer that is disposed on the first principal face of the first optical sheet. The concavo-convex structure includes a plurality of dents and flat portions between adjacent ones of the plurality of dents. A surface of the adhesive layer and the first principal face of the first optical sheet together define an internal space within each of the plurality of dents. Each of the plurality of dents satisfies 0.10?(C?A)/C 1.00 and 0.75?(C?A)/(C?B), where A is a maximum height value of the adhesive layer existing in that dent; B is a minimum height value of the adhesive layer existing in that dent; and C is a depth of that dent.

Abstract: Provided are a photon up-conversion film, which is capable of high-efficiency up-conversion even in air and even when low-intensity light is used, and a simple method of producing the film. The photon up-conversion film according to one embodiment of the present invention includes: a matrix including a resin; and a pore portion, wherein the photon up-conversion film includes at least a sensitizing component capable of absorbing light in a first wavelength region ?1, and a light-emitting component capable of radiating light in a second wavelength region ?2 including wavelengths shorter than those of the first wavelength region ?1, and wherein the sensitizing component and the light-emitting component are present at an interface between the matrix and the pore portion.

Abstract: Provided is a method of producing a thin glass resin laminate piece, which includes cutting a thin glass resin laminate through laser processing, and by which a thin glass resin laminate piece capable of preventing the occurrence of air bubbles when bonded to an adherend can be obtained. The method of producing a thin glass resin laminate piece of the present invention includes a step of subjecting a thin glass resin laminate including a thin glass, a resin layer, and a pressure-sensitive adhesive layer in the stated order to laser processing to cut the laminate, wherein a thickness (?m) of the pressure-sensitive adhesive layer and a creep characteristic (?m/Hr) of the pressure-sensitive adhesive layer have a relationship of (thickness (?m))2×creep characteristic (?m/Hr)?50×103 (?m2·?m/Hr).

Abstract: A transparent conductive layer 3 includes a first main surface 5 exposed to the outside, and a second main surface 6 opposite to the first main surface 5 in a thickness direction. The transparent conductive layer 3 is single layer extending in a plane direction. The transparent conductive layer 3 has a first grain boundary 7 in which two end edges 23 in a cross-sectional view are open to the first main surface 5, and an intermediate region 25 between both end edges 23 is not in contact with the second main surface 6, and has a first crystal grain 31 partitioned by the first grain boundary 7 and facing only the first main surface 5.

Abstract: A wired circuit board includes a metal supporting layer, an insulating base layer and a conductor layer from bottom to top. A peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer. The metal supporting layer has a thickness T1 of 50 ?m or more.

Abstract: An optical stack includes: a first optical sheet having a first principal face with a concavo-convex structure and a second principal face at an opposite side from the first principal face; and an adhesive layer that is disposed on the first principal face of the first optical sheet. The concavo-convex structure includes a plurality of dents and flat portions between adjacent ones of the plurality of dents. The adhesive layer is in contact with the flat portions. A surface of the adhesive layer and the first principal face of the first optical sheet together define an internal space within each of the plurality of dents. In a plan view from a normal direction of the first principal face of the first optical sheet, an area ratio of air voids existing at interfaces between the flat portions and the adhesive layer to an area of the first optical sheet is 3% or less.

Abstract: A method of manufacturing a glass resin laminated body includes a step of sticking a glass film on a resin film via an adhesive layer while holding the glass film and the resin film between a first roller that presses against the resin film and a second roller that is disposed opposite to the first roller and that presses against the glass film. A ratio of an elastic modulus P1 of a surface layer of the first roller to an elastic modulus P2 of the resin film P1/P2 satisfies a relation of 3×10?3?P1/P2?1.0.

Abstract: Provided is a pressure-sensitive adhesive sheet for semiconductor wafer processing that is excellent in adhesiveness with a semiconductor wafer, and that has light peelability and suppresses adhesive residue. The pressure-sensitive adhesive sheet for semiconductor wafer processing includes in this order: a base material; an intermediate layer; and a UV-curable pressure-sensitive adhesive layer. The intermediate layer has a storage modulus of elasticity at room temperature, G?1RT, of from 300 kPa to 2,000 kPa, and a storage modulus of elasticity at 80° C., G?180, of from 10 kPa to 500 kPa. The UV-curable pressure-sensitive adhesive layer has a storage modulus of elasticity at room temperature, G?2RT, of from 100 kPa to 1,000 kPa, and a storage modulus of elasticity at 80° C., G?280, of from 10 kPa to 1,000 kPa. G?1RT/G?2RT is 1 or more.

Abstract: A double-sided pressure-sensitive adhesive tape having excellent impact resistance, excellent reworkability, and excellent alcohol resistance. The double-sided pressure-sensitive adhesive tape includes: a base material layer; and pressure-sensitive adhesive layers arranged on both surface sides of the base material layer, wherein the pressure-sensitive adhesive layers are each formed from a pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive composition contains at least one kind selected from the group consisting of a monomer component (m) and a polymer component (P) obtained by polymerizing the monomer component (m), wherein the monomer component (m) contains 50 wt % or more of butyl (meth)acrylate, wherein a ratio of a thickness of the base material layer to a total thickness of the double-sided pressure-sensitive adhesive tape is less than 35%, and wherein the double-sided pressure-sensitive adhesive tape has a force, which is generated at 100% strain at 23° C.

Abstract: There is provided an optical laminate with pressure-sensitive adhesive layers on both surfaces, which is suppressed damage from occurring to a low-refractive index layer in vacuum lamination while maintaining excellent characteristics of the low-refractive index layer. An optical laminate with pressure-sensitive adhesive layers on both surfaces according to an embodiment of the present invention comprises: a substrate; a low-retractive index layer formed on the substrate; a first pressure-sensitive adhesive layer arranged so as to be adjacent to the low-refractive index layer; and a second pressure-sensitive adhesive layer serving as one outermost layer. The low-refractive index layer has a porosity of 50% or more, the first pressure-sensitive adhesive layer has a storage modulus of elasticity of from 1.3×105 (Pa) to 1.0×107 (Pa), and the second pressure-sensitive adhesive layer has a storage modulus of elasticity of 1.0×105 (Pa) or less.

Abstract: Provided is a sealant sheet formed as a sheet. The sealant sheet comprises an epoxy group-containing polysulfide. The epoxy group-containing polysulfide has a disulfide structure and an epoxy group in its molecule.

Abstract: A wiring circuit board assembly sheet includes a wiring circuit board including a conductive pattern and a frame including a dummy conductive pattern. The frame includes a dummy formation region. The dummy formation region includes the dummy conductive pattern. The dummy formation region has a width of 5 mm from an edge of the wiring circuit board and a length identical to that of the wiring circuit board in a direction in which the edge extends. The difference between the percentage of the area of the conductive pattern to the area of the insulating base layer and the percentage of the area of the dummy conductive pattern to the area of the dummy formation region is 50% or less.

Abstract: Provided is a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board. Specifically, a plate-like composite material including polytetrafluoroethylene and a predetermined filler, and satisfying a predetermined condition serves as a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics even when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board.

Abstract: A radio wave absorber 1a includes a resistive layer 10, a reflector 30, and a dielectric layer 20. The resistive layer 10 includes multilayer carbon nanotubes 11. Moreover, the resistive layer 10 has a specific resistance of 1.5 ?·cm or less. The reflector 30 reflects a radio wave. The dielectric layer 20 is disposed between the resistive layer and the reflector in a thickness direction of the resistive layer 10.

Abstract: A polymer dispersion type liquid crystal device includes a pair of transparent substrates; a pair of transparent electrodes provided between the pair of transparent substrates; a liquid crystal layer formed by filling a polymer dispersion type liquid crystal between the pair of transparent electrodes; and a driving circuit that applies a voltage between the pair of transparent electrodes to set the liquid crystal layer to a non-scattering state or a scattering state. The driving circuit applies a direct current voltage that periodically inverts a polarity between the pair of transparent electrodes.

Abstract: A porous resin film for a metal layer laminate board and a metal layer laminate board are provided to suppress damage to a metal layer disposed on an inner peripheral surface of a through hole and to have excellent electrical connection reliability even under the high temperature environment. The porous resin film for a metal layer laminate board is used in lamination of a metal layer. The porous resin film for a metal layer laminate board has a minimum thermal expansion coefficient X in a plane direction perpendicular to a thickness direction and a thermal expansion coefficient Z in the thickness direction. In the porous resin film for a metal layer laminate board, a ratio (Z/X) of the thermal expansion coefficient Z in the thickness direction to the minimum thermal expansion coefficient X is 3.5 or less.

Abstract: The present multi-layered structure includes: a resin layer; and a glass layer stacked via an adhesive layer on the resin layer. A thickness of the glass layer is 10 ?m or more and 300 ?m or less. A thickness of an outer peripheral portion of the resin layer is 5 ?m or more.

Abstract: A wiring circuit board includes a first insulating layer and a conductive pattern. The conductive pattern has a first terminal, and a wiring connected to the first terminal. The wiring has a first portion disposed away from the first terminal, and a second portion disposed between the first terminal and the first portion. The first portion of the wiring and the first terminal include a portion consisting of the first conductive layer and the second conductive layer. The second portion of the wiring consists of the first conductive layer.

Abstract: A method of conveying a glass film composite uses a roll-to-roll process for winding a glass film composite wound on a feed roller by a winding roller through a plurality of conveyance rollers. The glass film composite includes an elongated glass film, and linear resin tapes disposed on one side of the glass film along a longitudinal direction of the glass film at both ends in a width direction of the glass film. The method includes a step of conveying the glass film composite from the feed roller to the winding roller through the plurality of conveyance rollers without passing a state in which the glass film composite is bent so that the resin tapes are directed to the inside.