Patents Assigned to Density Inc.
  • Patent number: 12223790
    Abstract: A depth sensing device, situated above a threshold to a room, collects asynchronous, non-personally-identifiable data regarding a count of people entering and exiting across the threshold. Phase shift of modulated infrared light reflected from a light source to an object is measured and converted into depth data indicating the depth of the pixels therein. The depth data is used to classify detected objects as human, and to track their movement bi-directionally through the threshold. A running count of humans entering or exiting the room is streamed to a remote server, which aggregates data collected from a number of depth sensing devices. The server then makes that data available at various levels of visualization corresponding to different levels of a hierarchy of nested virtual spaces, such as a multi-entrance room, or a building. Entities that access this data may see a real-time, accurate count of humans currently occupying the virtual space, as well as historical data.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: February 11, 2025
    Assignee: Density, Inc.
    Inventors: Andrew Farah, Casey Kelso, Brian Weinreich, Benjamin Redfield, Garrett Bastable, Matthew Merati, Siu Kwong Mok
  • Publication number: 20250044436
    Abstract: A positional sensing system includes a plurality of positional sensing devices which are situated at regular intervals within an environment and collect data for tracking objects moving within the environment. The positional sensing system is used to determine the occupancy and trajectories of people within the environment. The system can determine whether certain areas of the environment need to be cleaned based on occupancy. When a threshold level of use is detected for one or more areas of the environment, the positional sensing system dynamically determines that one or more areas require cleaning, and can generate a cleaning plan for the one or more areas. The positional sensing system can determine an optimal cleaning route through the environment based on the location of one or more areas. Once the cleaning plan is generated, the system can provide the cleaning plan to a user of the positional sensing system for utilization.
    Type: Application
    Filed: May 6, 2024
    Publication date: February 6, 2025
    Applicant: Density, Inc.
    Inventors: Andrew Farah, Zach Brand, Emre Sonmez, John Shanley
  • Publication number: 20250044434
    Abstract: A positional sensing system includes a plurality of positional sensing devices which are situated at regular intervals within an environment and collect data for tracking objects moving within the environment. The positional sensing system is used to determine the occupancy and trajectories of people within the environment. The system can determine whether certain areas of the environment need to be cleaned based on occupancy. When a threshold level of use is detected for one or more areas of the environment, the positional sensing system dynamically determines that one or more areas require cleaning, and can generate a cleaning plan for the one or more areas. The positional sensing system can determine an optimal cleaning route through the environment based on the location of one or more areas. Once the cleaning plan is generated, the system can provide the cleaning plan to a user of the positional sensing system for utilization.
    Type: Application
    Filed: April 22, 2024
    Publication date: February 6, 2025
    Applicant: Density, Inc.
    Inventors: Andrew Farah, Zach Brand, Emre Sonmez, John Shanley
  • Publication number: 20250044437
    Abstract: A plurality of positional sensing devices are situated at regular intervals within an environment and collect data for tracking objects moving within the environment. Phase shift of modulated Doppler pulses reflected from the sensing devices to objects are measured and converted into positional data indicating positions of detected objects within the environment. Associated timestamp data is also collected by the positional sensing devices. The positional data and associated timestamp data is aggregated from the plurality of positional sensors, and the aggregated positional data and is clustered to determine point clouds which are associated with the detected objects. The clusters are tracked by tracklets that track the position of each cluster over time. Trajectories for each detected object are determined by connecting tracklets together that are associated with the same detected object.
    Type: Application
    Filed: February 1, 2024
    Publication date: February 6, 2025
    Applicant: Density, Inc.
    Inventors: Andrew Farah, Casey Kelso, Christian Ayerh, John Shanley, Robert Grazioli, Benjamin Redfield, Garrett Bastable, Brian Weinreich, Kyle Hay
  • Patent number: 11994574
    Abstract: A positional sensing system includes a plurality of positional sensing devices which are situated at regular intervals within an environment and collect data for tracking objects moving within the environment. The positional sensing system is used to determine the occupancy and trajectories of people within the environment. The system can determine whether certain areas of the environment need to be cleaned based on occupancy. When a threshold level of use is detected for one or more areas of the environment, the positional sensing system dynamically determines that one or more areas require cleaning, and can generate a cleaning plan for the one or more areas. The positional sensing system can determine an optimal cleaning route through the environment based on the location of one or more areas. Once the cleaning plan is generated, the system can provide the cleaning plan to a user of the positional sensing system for utilization.
    Type: Grant
    Filed: November 6, 2023
    Date of Patent: May 28, 2024
    Assignee: Density, Inc.
    Inventors: Andrew Farah, Zach Brand, Emre Sonmez, John Shanley
  • Patent number: 11914025
    Abstract: A plurality of positional sensing devices are situated at regular intervals within an environment and collect data for tracking objects moving within the environment. Phase shift of modulated Doppler pulses reflected from the sensing devices to objects are measured and converted into positional data indicating positions of detected objects within the environment. Associated timestamp data is also collected by the positional sensing devices. The positional data and associated timestamp data is aggregated from the plurality of positional sensors, and the aggregated positional data and is clustered to determine point clouds which are associated with the detected objects. The clusters are tracked by tracklets that track the position of each cluster over time. Trajectories for each detected object are determined by connecting tracklets together that are associated with the same detected object.
    Type: Grant
    Filed: August 4, 2023
    Date of Patent: February 27, 2024
    Assignee: Density, Inc.
    Inventors: Andrew Farah, Casey Kelso, Christian Ayerh, John Shanley, Robert Grazioli, Benjamin Redfield, Garrett Bastable, Brian Weinreich, Kyle Hay
  • Patent number: 11776342
    Abstract: A depth sensing device, situated above a threshold to a room, collects asynchronous, non-personally-identifiable data regarding a count of people entering and exiting across the threshold. Phase shift of modulated infrared light reflected from a light source to an object is measured and converted into depth data indicating the depth of the pixels therein. The depth data is used to classify detected objects as human, and to track their movement bi-directionally through the threshold. A running count of humans entering or exiting the room is streamed to a remote server, which aggregates data collected from a number of depth sensing devices. The server then makes that data available at various levels of visualization corresponding to different levels of a hierarchy of nested virtual spaces, such as a multi-entrance room, or a building. Entities that access this data may see a real-time, accurate count of humans currently occupying the virtual space, as well as historical data.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: October 3, 2023
    Assignee: Density Inc.
    Inventors: Andrew Farah, Casey Kelso, Brian Weinreich, Benjamin Redfield, Garrett Bastable, Matthew Merati, Siu Kwong Mok
  • Patent number: 11227458
    Abstract: A depth sensing device, situated above a threshold to a room, collects asynchronous, non-personally-identifiable data regarding a count of people entering and exiting across the threshold. Phase shift of modulated infrared light reflected from a light source to an object is measured and converted into depth data indicating the depth of the pixels therein. The depth data is used to classify detected objects as human, and to track their movement bi-directionally through the threshold. A running count of humans entering or exiting the room is streamed to a remote server, which aggregates data collected from a number of depth sensing devices. The server then makes that data available at various levels of visualization corresponding to different levels of a hierarchy of nested virtual spaces, such as a multi-entrance room, or a building. Entities that access this data may see a real-time, accurate count of humans currently occupying the virtual space, as well as historical data.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: January 18, 2022
    Assignee: Density Inc.
    Inventors: Andrew Farah, Casey Kelso, Brian Weinreich, Benjamin Redfield, Garrett Bastable, Matthew Merati, Siu Kwong Mok
  • Patent number: 6846184
    Abstract: An electrical contact having transmission-coil sections with at least two tightly wound turns. Active-coil sections are integral with, and positioned between the transmission-coil sections so as to provide electrical signal communication between the two transmission-coil sections, and spring characteristics. The transmission-coil sections are over coated with a conductive noble metal so as to fuse each of the tightly wound turns together to thereby provide for a shortened electrical transmission pathway through the electrical contact. An LGA interposer for providing data communication between a first and a second array of contact pads is also provided having a dielectric housing with an array of cavities; and a plurality of electrical contacts positioned within the cavities.
    Type: Grant
    Filed: January 24, 2003
    Date of Patent: January 25, 2005
    Assignee: High Connection Density Inc.
    Inventors: Zhineng Fan, Che-Yu Li
  • Patent number: 6742426
    Abstract: A method for cutting an elastomer cable into ultra-precise, defect-free segments of consistent length, and an apparatus to perform the same. The invented apparatus comprises cable advancement, cable clamping and cable shearing systems. The cable advancement system comprises rollers with a groove substantially matching the diameter of the cable. The cable clamping system comprises a pair of dies with a preferably conical feed hole and a clamping hole substantially matching the diameter of the cable. The cable shearing system comprises a preferably extra keen coated cryo treated movable razor blade that is held at an adjustable angle against the face of the clamping dies and slides in a linear path at a low sawing angle. In one embodiment, a second razor blade for nicking the cable prior to shearing—on substantially the opposite side of the cable from where shearing begins—is used to prevent tears in cable slices. The invented apparatus can be manually operated, or it can be motorized.
    Type: Grant
    Filed: June 1, 2001
    Date of Patent: June 1, 2004
    Assignee: High Connection Density, Inc.
    Inventors: Douglas E. Cote, Che-yu Li
  • Patent number: 6722893
    Abstract: An interconnection device is provided for temporary connection of a first electronic system to a second electronic system having a support substrate that includes an ordered array of conductive solder pads. A plurality of coil signal contacts are mounted to the conductive solder pads. Each one of the coil signal contacts comprises a central longitudinal axis, a top turn and a bottom turn that are arranged in spaced relation to one another. In this way, the bottom turn of one of the plurality of coil signal contacts is fastened to each of the conductive pads such that the top turns are spaced away from the support substrate.
    Type: Grant
    Filed: December 2, 2002
    Date of Patent: April 20, 2004
    Assignee: High Connection Density, Inc.
    Inventors: Che-Yu Li, Zhineng Fan, Linh Van
  • Patent number: 6723927
    Abstract: An interposer provides a high reliability interface between an LGA connector and a motherboard. The interposer includes a stepped spacer for each solder interconnection which prevents the relaxation of mechanical contact force while ensuring the integrity of each solder interconnection. The interposer provides noble metal plated contact pads on a first surface to receive the contact members of an LGA connector, and contact pads for BGA solder connections for attachment to a motherboard. A description of the processes to manufacture the interposer is also disclosed.
    Type: Grant
    Filed: May 29, 2001
    Date of Patent: April 20, 2004
    Assignee: High Connection Density, Inc.
    Inventors: Zhineng Fan, Ai D. Le, Che-Yu Li
  • Patent number: 6712621
    Abstract: The present invention provides a heat spreading connector suitable for use with electronic components including those using land grid arrays and pin grid arrays and a method for its use. The connector of the present invention includes at least one dielectric layer and at least one thermally conductive layer.
    Type: Grant
    Filed: January 23, 2002
    Date of Patent: March 30, 2004
    Assignee: High Connection Density, Inc.
    Inventors: Che-Yu Li, Zhineng Fan, Dirk D. Brown
  • Patent number: 6712620
    Abstract: A board-to-board connector system is provided that may be used with a flex circuit, interposer, or polymer housing that includes a plurality of contacts that are arranged in an array. Each of the plurality of contacts includes a resilient body. A first conductor is provided that includes at least one wire formed in a spiral extending continuously through the resilient body, and having electrically accessible first and second ends. The first conductor is electrically connected to at least one of a plurality of signal conductor traces on a printed wiring board or the like. A second conductor is provided that includes at least one wire formed in a spiral extending continuously through the resilient body, and having electrically accessible first and second ends. The first conductor and the second conductor are in spaced apart relation to one another, and the second conductor is electrically connected to at least one of the plurality of ground path conductors arranged on the printed wiring board.
    Type: Grant
    Filed: September 12, 2002
    Date of Patent: March 30, 2004
    Assignee: High Connection Density, Inc.
    Inventors: Che-Yu Li, Zhineng Fan, Dirk D. Brown
  • Patent number: 6705877
    Abstract: The present invention is a family of memory modules. In one embodiment a memory module with granularity and upgradeability of bandwidth, and a low profile uses 256 MB SDRAM or DDR SDRAM memory devices in chip scale packages (CSPs) to support a memory data bus width of up to at least 512 bits. Each module includes an impedance-controlled substrate having contact pads, memory devices, and other components on its surfaces. In one embodiment, the inclusion of spaced apart multiple area array interconnections allows a row of memory devices to be symmetrically mounted on each side of each of the area array interconnections, thereby reducing the interconnect lengths and facilitating matching of interconnect lengths. Short area array interconnections, including ball grid array (BGA) and land grid array (LGA) options, provide electrical communication between modules and the rest of the system. Thermal control structures may be included to maintain reliable operating temperatures.
    Type: Grant
    Filed: January 17, 2003
    Date of Patent: March 16, 2004
    Assignee: High Connection Density, Inc.
    Inventors: Che-yu Li, Sharon Laura Moriarty, Zhineng Fan
  • Patent number: 6663399
    Abstract: The present invention is a cost effective, reworkable, LGA-based interconnection for use between two circuit members such as a ceramic module and an FR4-based system board. The resilient contact members allow the reliable interconnection of two circuit members, even though the circuit members may have significantly different CTEs and have interconnections where the distance from neutral point is great enough to crack BGA or CGA solder connections. For factory reworkable applications, the ends of the contact members are semi-permanently attached to both the module and the system board. For certain field separable applications, semi-permanently attaching only one of the ends of an LGA to either the module or the system board provides increased reliability.
    Type: Grant
    Filed: January 29, 2002
    Date of Patent: December 16, 2003
    Assignee: High Connection Density, Inc.
    Inventors: Hassan O. Ali, Che-Yu Li, Zhineng Fan, Ai D. Le
  • Patent number: 6661690
    Abstract: A memory module with any combination of driver line terminators, power supply circuits, and components integral to a memory control subsystem mounted directly on the memory module for use with high speed, impedance-controlled memory buses. The memory module may be formed on a conventional printed circuit card with unpacked or packed memory chips attached directly to the memory module. Including the additional functionality directly on the memory modules improves the EMC/EMI performance as well as signal quality and integrity, thereby enhancing the memory subsystem performance. Such designs may also eliminate the need for bus exit connections, thereby allowing the freed-up connection capacity to be used to address additional memory capacity on the module. Another embodiment features a module with the additional features but without memory devices.
    Type: Grant
    Filed: February 19, 2002
    Date of Patent: December 9, 2003
    Assignee: High Connection Density, Inc.
    Inventors: Sharon L. Moriarty, Zineng Fan, Dirk D. Brown, Che-Yu Li
  • Patent number: 6659778
    Abstract: The present invention provides an electrical contact comprising a first member having spring properties and a second member wrapped around at least a portion of the first member wherein the second member has a greater electrical conductivity than the first member. In one embodiment, a conductor is wrapped around at least a portion of a spring. In another embodiment, the spring is formed into a coil or helix with a wire wrapped around at least a portion of the helical spring. In one form of this embodiment, the spring has a plurality of turns and the wire is wrapped around at least two of the turns. In another form of this embodiment, the spring has a plurality of turns and the wire is wrapped around all of the turns. An interposer connector is also provided having a frame including a top surface and a bottom surface and a plurality of apertures arranged in a pattern and opening onto the top and bottom surfaces of the frame.
    Type: Grant
    Filed: August 1, 2002
    Date of Patent: December 9, 2003
    Assignee: High Connection Density, Inc
    Inventor: Che-Yu Li
  • Patent number: 6638077
    Abstract: A shielded carrier with electrical components is provided, resulting in LGA interposer connectors with improved electrical performance and enhanced functionality. The carrier includes components such as resistors and capacitors on and/or in the carrier. The components are preferably of the surface mount variety or are imbedded within the carrier, due to the inherent lower profile of these form factors. Decoupling capacitors and terminating resistors are two examples of components that may improve performance.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: October 28, 2003
    Assignee: High Connection Density, Inc.
    Inventors: Zhineng Fan, Ai D. Le, Che-Yu Li
  • Patent number: 6597062
    Abstract: The present invention is a family of memory modules. In one embodiment a memory module with granularity, upgradeability, and high throughput of at least 4.2 gigabytes per second using two channels of RAMBUS memory devices in a typical volume of just 2.2 inches by 1.1 inches by 0.39 inch. Each module includes an impedance-controlled substrate having contact pads, memory devices and other components, including optional driver line terminators, on its surfaces. The inclusion of spaced, multiple area array interconnections allows a row of memory devices to be serially mounted between each of the area array interconnections, thereby minimizing the interconnect lengths and facilitating matching of interconnect lengths. Short area array interconnections, including BGA, PGA, and LGA options or interchangeable alternative connectors provide interconnections between the modules and the rest of the system.
    Type: Grant
    Filed: August 5, 2002
    Date of Patent: July 22, 2003
    Assignee: High Connection Density, Inc.
    Inventors: Che-yu Li, Sharon L. Moriarty