Patents Assigned to DePuy Synthesis Products, Inc.
  • Patent number: 11006949
    Abstract: An apparatus for fixating bone includes an orthopedic implant. The orthopedic implant may be manufactured from a shape memory material such that the orthopedic implant is moveable between a natural shape and an insertion shape. The orthopedic implant defines at least a first cannulation therethrough adapted to deliver a bone augmentation material to the bone. The orthopedic implant implants into the bone in its insertion shape. After implantation of the orthopedic implant, the first cannulation facilitates delivery into the bone of a bone augmentation material that augments the bone. The orthopedic implant once implanted attempts to transition from its insertion shape to its natural shape such that the orthopedic implant fixates the bone.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: May 18, 2021
    Assignee: DePuy Synthesis Products, Inc.
    Inventor: Steffan Daniel
  • Patent number: 10959759
    Abstract: A posterior vertebral plating system comprising a plate and a plurality of attachment members. The plate has a plurality of holes extending through the plate from an upper surface to a lower surface, and the plate is configured to extend along the posterior side of at least two vertebrae adjacent at least one boney structure of each of the vertebrae. The holes are spaced in such a way that a first plurality of holes is positionable over a boney structure of a first vertebra to define a plurality of fixation points to the first vertebra and a second plurality of holes is positionable over boney structure of a second vertebra to define a plurality of fixation points to the second vertebra. The attachment members are insertable through the holes of the plate and into the boney structure of a corresponding vertebra to fix the plate to the vertebra.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: March 30, 2021
    Assignee: DePuy Synthesis Products, Inc.
    Inventors: Albert A. Montello, Hyun W. Bae, William L. Strausbaugh, Christopher M. Bonner, William P. McDonough, David K. Koch, Jordan N. Milford