Abstract: A system for burn-in testing of integrated circuits and semiconductors at the wafer level and apparatus and method utilizing the system. The cascading heat control system of the invention has connected first and second heat transfer circuits to regulate the temperature of and the environment around semiconductor wafers under test. A low temperature gas is circulated, as a heat transfer gas, through the cascading heat control system. The heat transfer gas serves as a heat transfer medium and provides a low dew point environment, or both a low dew point and low oxidation environment, within the system. At least one wafer chuck incorporating a heat exchanger, or a series of such wafer chucks, and containing a semiconductors for testing is connected to the cascading heat control system through the heat exchanger. In the apparatus, a burn-in oven, the wafer chuck or series of wafer chucks are contained within a chamber environment.

Abstract: An oven for magnetic annealing of magnetic media, along with methods for using the same. The oven has a vacuum chamber with vacuum port for loading and unloading magnetic media. The vacuum port is sealed by a vacuum seal or door adapted for movement between open and closed positions. A vacuum pump is connected to the chamber to provide a vacuum within the chamber. The oven includes a heat exchanger adapted to receive magnetic media and a heat transfer gas unit connected to the heat exchanger to form a closed, hermetically sealed heat transfer gas circuit for heating and cooling magnetic media loaded in the heat exchanger. A magnet located exterior to the vacuum chamber provides the magnetic field to magnetic media.