Patents Assigned to Destiny Copper Inc.
  • Processes for producing granular copper
    Patent number: 11806789
    Abstract: Processes for producing copper granules on a surface of a reducing metal. The process can include contacting the reducing metal with an aqueous solution comprising a copper(II) salt and a halide. The molar ratio of the halide to the copper(II) in the copper (II) salt can be at least about 3:1. The granular copper can be produced on a surface of the reducing metal, and is optionally removed from the surface of the reducing metal by shaking, washing, and/or brushing, and/or optionally with stirring and/or circulating of the aqueous solution.
    Type: Grant
    Filed: July 11, 2022
    Date of Patent: November 7, 2023
    Assignee: Destiny Copper Inc.
    Inventors: Ian David Brindle, Molina Audrey Lorraine Sheepwash