Abstract: The invention relates to a method for dividing silicon blocks, including the following steps: providing a cuboidal silicon block, dividing the silicon block into at least two bars in a first dividing step, turning the bars in a turning step by 90° respectively around a rotational axis perpendicular to the longitudinal direction of the block and dividing the bars into silicon ingots in a second dividing step.
Abstract: A device for detecting electrical properties of a sample of an excitable material, in particular of a silicon wafer, comprises a microwave source for generating a microwave field, a resonance system which is coupled to the microwave source in a microwave-transmitting manner, the resonance system comprising a microwave resonator with at least one opening and a sample to be examined which is arranged next to the at least one opening, at least one excitation source which is arranged in the surroundings of the sample for controlled electrical excitation of the sample, and a measuring device for measuring at least one physical parameter of the resonance system.
Type:
Grant
Filed:
October 13, 2007
Date of Patent:
December 11, 2012
Assignee:
Deutsche Solar GmbH
Inventors:
Jürgen Niklas, Kay Dornich, Gunter Erfurt
Abstract: A sawing device for sawing silicon blocks comprises at least one cutting element for sawing silicon blocks, the cutting element being drivable by means of a drive device, at least one guide device, with the at least one cutting element being alignable along a predetermined path by means of the at least one guide device, and at least one monitoring device for monitoring the position of the at least one cutting element.
Abstract: The invention relates to a device for catching a plurality of slices to be detached from a holding element, having a frame, a holder, attached to the frame, for accommodating the holding element holding the slices, at least two guiding elements on the sides and at least one bottom catching element, the guiding elements on the sides each being arranged on the frame in pairs on the right and the left.
Abstract: The invention relates to a device for manufacturing semiconductor material wafers with a sawing device for the sawing of slices attached to a saw holder, a pre-cleaning device arranged in the process direction downstream of the sawing device for pre-cleaning the surfaces of the slices hanging on the saw holder, and a degluing device arranged downstream in the process direction for detaching the slices from the saw holder.
Abstract: In the case of a device for the melting and/or crystallizing of non-ferrous metals, especially of silicon, provision is made, for improving the quality of the crystallized and block-shaped non-ferrous metal, for there to be arranged around a container for receiving the non-ferrous metal at least one controllable cooling element for the active removal of heat from the non-ferrous metal.
Type:
Grant
Filed:
March 11, 2006
Date of Patent:
July 19, 2011
Assignee:
Deutsche Solar GmbH
Inventors:
Armin Müller, Michael Ghosh, Jens Seidel, Bert Geyer
Abstract: Directionally solidified, multicrystalline silicon having a low proportion of electrically active grain borders, its manufacturing and utilisation, as well as solar cells comprising said silicon and a method of manufacturing said cells.
Type:
Grant
Filed:
November 14, 2001
Date of Patent:
June 10, 2003
Assignee:
Deutsche Solar GmbH
Inventors:
Peter Woditsch, Gunther Stollwerck, Christian Hässler, Wolfgang Koch