Patents Assigned to Development of Earthquake Prediction
  • Patent number: 9027411
    Abstract: A stress and strain sensing device capable of continuously sensing stress received from bedrock and strain of the bedrock over a long period of time is provided. A stress and strain sensing device has a pillar-shaped case to be buried and installed in bedrock, a pressure receiving member that has two pressure receiving surfaces for sensing stress received from the bedrock and strain of the bedrock, wherein the two pressure receiving surfaces are both arranged on a common axis orthogonal to an axial direction of the case such that the two pressure receiving surfaces are exposed to an outside through an outer peripheral wall of the case and wherein the two pressure receiving surfaces are not connected with the case mechanically, and a displacement sensor that senses the stress received from the bedrock and the strain of the bedrock based on a displacement amount between the two pressure receiving surfaces.
    Type: Grant
    Filed: April 3, 2012
    Date of Patent: May 12, 2015
    Assignees: Public Interest Incorporated Foundations Association for the Development of Earthquake Prediction, Techno Sugaya Co., Ltd.
    Inventors: Hiroshi Ishii, Yasuhiro Asai, Hideo Sugaya
  • Publication number: 20130255394
    Abstract: A stress and strain sensing device capable of continuously sensing stress received from bedrock and strain of the bedrock over a long period of time is provided. A stress and strain sensing device has a pillar-shaped case to be buried and installed in bedrock, a pressure receiving member that has two pressure receiving surfaces for sensing stress received from the bedrock and strain of the bedrock, wherein the two pressure receiving surfaces are both arranged on a common axis orthogonal to an axial direction of the case such that the two pressure receiving surfaces are exposed to an outside through an outer peripheral wall of the case and wherein the two pressure receiving surfaces are not connected with the case mechanically, and a displacement sensor that senses the stress received from the bedrock and the strain of the bedrock based on a displacement amount between the two pressure receiving surfaces.
    Type: Application
    Filed: April 3, 2012
    Publication date: October 3, 2013
    Applicants: Techno Sugaya Co., Ltd., Development of Earthquake Prediction
    Inventors: Hiroshi Ishii, Yasuhiro Asai, Hideo Sugaya