Abstract: The present disclosure relates to a treatment liquid spray nozzle including: a body having a mixing space portion formed therein to mix a first treatment liquid and a second treatment liquid, a first inlet communicating with the mixing space portion in such a way as to allow the first treatment liquid to flow into the mixing space portion, a second inlet communicating with the mixing space portion in a misaligned direction with the first inlet in such a way as to allow the second treatment liquid to flow into the mixing space portion, and a spray hole formed on the bottom thereof in such a way as to communicate with the mixing space portion; and a rotational flow guiding part disposed in the mixing space portion in such a way as to allow both ends thereof to face the first inlet and the spray hole, while allowing the sectional area toward the spray hole to be smaller than the sectional area toward the first inlet.

Abstract: The present disclosure relates to a substrate treatment apparatus having a heating part, including: a chuck base disposed rotatable around a rotational axis and having a ring-shaped spin chuck with chuck pins disposed on top thereof to support a substrate and a chuck support part located on the lower portion of the inner peripheral surface of the spin chuck; a back nozzle assembly mounted through a hollow portion formed at the center of the chuck base to spray a treatment liquid onto the underside of the substrate; cover glass disposed between top of the spin chuck and the back nozzle assembly, when viewed in plan view, and having a through hole formed at the center thereof to pass the back nozzle assembly therethrough; and the heating part disposed inside the spin chuck in a space between the cover glass and the chuck support part, wherein when viewed in plan view, the cover glass has a slant refracting surface formed with a given width around the through hole, and when viewed on a front section, the slant r

Abstract: The present disclosure relates to a substrate treatment apparatus including: a chuck base having a ring-shaped spin chuck with chuck pins disposed on top thereof to support a substrate and a chuck support part located on the lower portion of the inner peripheral surface of the spin chuck; a back nozzle assembly mounted through a hollow portion formed at the center of the chuck base to spray treatment liquid onto the underside of the substrate; cover glass disposed between top of the spin chuck and the back nozzle assembly; and a heating part located inside the inner peripheral surface of the spin chuck in a space between the cover glass and the chuck support part, wherein the spin chuck is separably coupled to the chuck support part in an up-down direction.

Abstract: The present disclosure relates to a substrate treatment apparatus including: a chuck base connected to a driving shaft in such a way as to be rotatable together with the driving shaft and having a spin chuck with chuck pins disposed on top thereof to support a substrate and a chuck support part; a fluid supply unit for supplying treatment liquid to top of the substrate; a back nozzle assembly mounted through a hollow portion formed at the center of the chuck base to spray treatment liquid onto the underside of the substrate; cover glass disposed between the spin chuck and the back nozzle assembly; a heating part disposed between the spin chuck and the back nozzle assembly in a space between the cover glass and the chuck support part; and a heat sink located to come into contact with the underside of the heating part.

Abstract: The present disclosure relates to a treatment liquid spray nozzle including: a body having a mixing space portion formed therein to mix a first treatment liquid and a second treatment liquid, a first inlet formed on top thereof in such a way as to communicate with the mixing space portion to allow the first treatment liquid to flow into the mixing space portion, a second inlet formed on the side peripheral surface thereof in such a way as to communicate with the mixing space portion to allow the second treatment liquid to flow into the mixing space portion, and a spray hole formed on the bottom thereof in such a way as to communicate with the mixing space portion; and a rotational flow guiding part disposed in the mixing space portion in such a way as to allow both ends thereof to face the first inlet and the spray hole.

Abstract: The present invention relates to a substrate edge etching apparatus including: a substrate support assembly having a horizontally rotatable chuck base, chuck pins disposed on top of the chuck base, a purge gas inlet hole extending from an underside center of the chuck base to an interior of the chuck base, and a purge gas outlet hole extending radially from the purge gas inlet hole and then extending upwardly to penetrate top of the chuck base; a spin motor having a hollow tube-shaped driving shaft adapted to rotate the substrate support assembly; and a purge gas supply assembly connected to the driving shaft through a magnetic bearing in a state of not rotating, extending vertically from the underside center of the chuck base in a state of being spaced apart from an underside of the chuck base.

Abstract: The present disclosure relates to a substrate support assembly for a substrate treatment apparatus, including: a chuck base disposed to face a substrate, when the substrate is installed, and rotatable around a rotational axis; chuck pins protruding from top of the chuck base to hold or separate the substrate thereonto or therefrom; a mechanism being connected to the chuck pins; and driving parts for driving the mechanism, wherein the mechanism may include: first operating parts each having a pusher cam movable ascendably/descendably and restorably in a direction of the rotational axis; a second operating part interlocking with the pusher cams in such a way as to reciprocatingly rotate around the rotational axis; and first restoring members each connecting the chuck base and the second operating part to each other.

Abstract: The present disclosure relates to a substrate treatment apparatus including: a substrate treatment apparatus including: a chuck base rotating together with a substrate in a state of supporting the substrate thereagainst; a fluid supply unit for supplying treatment liquid to the substrate; a bowl assembly having a plurality of bowls that overlap outward in a radial direction with respect to the center of the substrate in such a way as to surround the chuck base; an ascending and descending unit for moving the bowl assembly up and down; and a shutter unit disposed on top of the outermost bowl of the bowl assembly to adjust a radius of an air flow inlet through which air flow passes toward the substrate.

Abstract: The present invention relates to a substrate support assembly for a substrate treatment apparatus, including: a chuck base supporting the substrate to be treated, disposed rotatable around a rotation axis, and having an installation accommodation portion formed near the outer peripheral surface thereof in a circumferential direction thereof and a receiving recess formed open on the top thereof at the inside surrounded by the installation accommodation portion; chuck pins disposed on the top of the installation accommodation portion of the chuck base and movable along directions away from and approaching the substrate; a mechanism unit disposed in the installation accommodation portion and connected to the chuck pins to move the chuck pins; a driving unit for transmitting power to the mechanism unit; and an ultrasonic cleaning unit disposed in the receiving recess.

Abstract: The present invention relates to a substrate edge etching apparatus including: a substrate support assembly having a horizontally rotatable chuck base with a light through hole vertically penetrating a center thereof and chuck pins disposed on top of the chuck base; a spin motor for rotating the substrate support assembly; a purge gas supply assembly connected to the driving shaft through a bearing, extending vertically from the underside center of the chuck base, and having a hollow hole penetratingly extending therealong to supply a purge gas to the light through hole; and a substrate sensing unit having a light transmission part disposed inside the hollow hole of the purge gas supply assembly and a light reception part disposed apart above the light through hole of the chuck base.

Abstract: The present invention relates to a substrate treatment apparatus including: a substrate support assembly having a spin head adapted to seat a substrate thereonto; fluid supply unit for supplying fluid to the substrate; a bowl assembly having a plurality of bowls overlaid another outwardly in a radial direction thereof and surrounding the substrate support assembly; an ascending and descending unit for moving up and down the bowl assembly; and a chamber for accommodating the substrate support assembly, the fluid supply unit, the bowl assembly, and the ascending and descending unit, wherein the chamber is configured to have a plurality of process exhaust parts for performing exhaust from the inside of the bowl assembly and an environment exhaust part for performing exhaust from the outside of the bowl assembly.

Abstract: The present invention relates to a substrate treatment apparatus including: a chuck base rotatably disposed around a rotating shaft; chuck pins disposed on top of the chuck base to fix a substrate thereto; and an ultrasonic cleaning unit disposed on top of the chuck base to perform ultrasonic cleaning for the underside of the substrate.

Abstract: A wafer container cleaning device for cleaning container bodies and container covers of wafer containers includes a housing having a cleaning chamber defined therein, a rotor rotatably installed within the cleaning chamber of the housing, a plurality of container holders mounted to the rotor to removably hold the container bodies and the container covers, and a cleaning solution sprayer nozzle for spraying a cleaning solution toward the container bodies and the container covers held by the container holders. Each of the container holders includes a support tray having a body support portion for supporting each of the container bodies in an upside down state and a cover support portion for supporting each of the container covers.

Abstract: A wafer container cleaning device for cleaning container bodies and container covers of wafer containers includes a housing having a cleaning chamber defined therein, a rotor rotatably installed within the cleaning chamber of the housing, a plurality of container holders mounted to the rotor to removably hold the container bodies and the container covers, and a cleaning solution sprayer nozzle for spraying a cleaning solution toward the container bodies and the container covers held by the container holders. Each of the container holders includes a support tray having a body support portion for supporting each of the container bodies in an upside down state and a cover support portion for supporting each of the container covers.