Patents Assigned to DEVLINKS, LTD.
  • Patent number: 11034077
    Abstract: A thermoforming mold trimming system, apparatus, and method of use are disclosed. The thermoforming mold trimming apparatus includes a robot support structure with at least one robot secured to the robot support structure. The apparatus also includes a contact probe removably secured to the robot, the contact probe being configured to generate a trim path for a thermoformed molded part. The robot is programmed to follow the trim path generated by the contact probe. The robot then uses a blade to trim excess material of a finished molded part within the housing by following the trim path.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: June 15, 2021
    Assignee: DEVLINKS, LTD.
    Inventors: Robert Devlin, Scott Jackson, David Findlay, Adin Kay Goings
  • Publication number: 20130258034
    Abstract: A disclosed method relates to creating labels for in-mold labeling. A first portion is advanced from rolled labeling material to a label making area of an in-mold labeling apparatus. First label information is printed on the first portion. The first portion is cut by applying a first laser beam to the first portion based on a first pattern. A second portion is advanced from the rolled labeling material to the label making area. Second label information is printed on the second portion. The second portion is cut by applying a second laser beam to the second portion based on a second pattern. The second pattern can be different from the first pattern.
    Type: Application
    Filed: March 31, 2012
    Publication date: October 3, 2013
    Applicant: DEVLINKS, LTD.
    Inventors: Robert Joseph Devlin, Vladislav Valentinov Dimitrov, Scott Ryan Jackson, Jerry John Handzlik, James Scott Adams, Michael Lee Horn