Abstract: Provided are a master in which a more complicated microstructure is formed, a transferred object obtained by using the master, and a method of producing the master. A plurality of concave-convex groups each including a plurality of concavities or convexities are provided on a base material apart from each other. Average widths of areas occupied by the concavities or convexities at a surface of the base material are smaller than or equal to a wavelength belonging to a visible light band. Formed lengths of the concavities or convexities from the surface of the base material in each of the concave-convex groups each belong to any of at least two or more groups having different central values.

Abstract: A method of manufacturing a connection structure, connection structure, film structure, and a method of manufacturing a film structure capable of mounting an electronic component having a plurality of terminal rows on a mounting surface by using existing equipment, including: a pasting step of pasting, from a film structure including a tape-shaped base material and a connection film formed thereon, connection films having a unit region of a predetermined length in the length direction of the base material and a predetermined width in the width direction to a first or second electronic component having a plurality of terminal rows; and a connecting step of connecting terminals of the first and second electronic components through the connection films, wherein the film structure includes, in the unit region, in addition to portions corresponding to the plurality of terminal rows, a non-pasting portion in which the connection film is not pasted.

Abstract: Provided is a wire-grid polarizer comprising: a transparent substrate; and lattice-shaped protrusions which, on one surface of the transparent substrate, extend in prescribed direction and are arrayed at a pitch which is shorter than the wavelength of light in a band to be used. The lattice-shaped protrusions each include, in order from the transparent substrate side, the following: a reflective layer; a dielectric layer; and an absorption layer. In a prescribed region of the transparent substrate, a region is provided in which the lattice-shaped protrusions are divided.

Abstract: Provided is a wire grid polarizing element comprising: a transparent substrate; and latticed projections which are arrayed, on one-side surface of the transparent substrate, at a pitch shorter than the wavelength of light in a band to be used and extend in a prescribed direction. The latticed projections each include a reflection layer, a dielectric layer, and an absorption layer in the stated order from the transparent substrate side. The reflection layer contains an AlNd alloy.

Abstract: There is provided a master for micro flow path creation, a transfer copy, and a method for producing a master for micro flow path creation by which transfer copies having an area with high hydrophilicity can be easily mass-produced, the master for micro flow path creation including: a base material; a main concave-convex portion provided on a surface of the base material and extending in a planar direction of the base material; and a fine concave-convex portion provided on a surface of the main concave-convex portion and having a narrower pitch than the main concave-convex portion. The fine concave-convex portion has an arithmetic average roughness of 10 nm to 150 nm and has a specific surface area ratio of 1.1 to 3.0.

Abstract: This optical laminate includes a transparent substrate; an adhesion layer provided on at least one surface of the transparent substrate; and an optical layer provided on a surface of the adhesion layer on a side opposite to the transparent substrate, wherein the adhesion layer is formed of a metal material, and the metal material has a melting point in a range of 100° C. or more and 700° C. or less.

Abstract: Provided is a roll mold that has a plurality of linear grooves arranged side by side on its outer peripheral surface and in which an optical step between adjacent linear grooves is sufficiently small. A roll mold comprising, on an outer peripheral surface thereof, n linear grooves extending in a roll axial direction or a direction inclined with respect to the roll axial direction and arranged side by side, where n is 800 or more, wherein the n linear grooves are arranged in a manner that a gradual decrease and a gradual increase in groove depth are repeated, and the number of points at which a transition from the decrease to the increase in groove depth occurs is m or less, where m is selected from 2 to 8.

Abstract: Generation of outgassing is restrained to restrain deterioration in optical properties of a cover glass. A method for manufacturing an electronic device includes baking step of heating the cover glass on which an antireflection layer made of a cured product of a light-curing resin has been formed, an assembling step of installing the cover glass after the baking step at a position opposed to a light receiving surface of a sensor element to assemble a sensor module, and a reflow step of placing the sensor module on a mounting substrate and applying heat at a temperature of more than or equal to 250° C. to solder the sensor module to the mounting substrate. The baking step is performed before the reflow step to make a rate of generation of outgassing derived from a monomer having a monofunctional (meth)acryloyl group in outgassing generated from the antireflection layer of the cover glass in the reflow step less than or equal to 0.5% by mass relative to a mass of the antireflection layer.

Abstract: Provided is a protection circuit capable of reliably preventing an overcurrent or a sneak current after cutoff to improve safety, implementing cost reduction with a device configuration simpler than conventional device configurations, and further reducing a failure rate of a device. In a protection circuit, after one of two fuse elements provided in each of a plurality of protection elements is blown due to an overcurrent flowing along a current-carrying path, a heater provided in at least one of the plurality of protection elements generates heat due to a sneak current flowing via the plurality of protection elements on the current-carrying path which is remained and blows the other of the two fuse elements provided in the at least one of the plurality of protection elements.

Abstract: A liquid leakage repair material includes: an inorganic filler in an amount of 20% by mass or greater but 95% by mass or less; and a curable composition that includes a monofunctional (meth) acrylate; a multifunctional (meth) acrylate; and a radical initiator. The target liquid to be prevented from leakage by the liquid leakage repair material is an oil. An oil absorption rate of the liquid leakage repair material after being cured is lower than 10%.

Abstract: In a semiconductor light receiving element having a light receiving part having a light absorption layer on a first surface side of a semiconductor substrate that is transparent to light with wavelengths in the infrared region for optical communication, a second surface side opposite to the first surface is provided with an inclined portion inclined at a predetermined angle with respect to the first surface in a region where transmitted light that has passed through the light absorption layer of incident light that has entered the light receiving part from the opposite side to the semiconductor substrate reaches, and a rough surface having irregularities with a height equal to or greater than the wavelength of the transmitted light is formed on the inclined portion, thereby reducing re-entry of the transmitted light into the light receiving part.

Abstract: A protective element includes: a fuse element cuttable by energization in a first direction; a slider made of an insulating material, including: a plate-shaped portion extending in the first direction; a shielding portion erected in a second direction on the plate-shaped portion, having a shielding-portion through hole penetrating the shielding portion; and a case made of an insulating material, including a housing portion which houses a slider and a portion of the fuse element. The housing portion includes: a shielding-portion housing space which houses the shielding portion such that the shielding portion is movable in the second direction; and a plate-shaped-portion moving space which houses the plate-shaped portion such that the plate-shaped portion is movable in the second direction Prior to the fuse element being cut, the slider and the fuse element are housed such that the fuse element is inserted into the shielding-portion through hole.

Abstract: Provided is a wire grid polarizing element excellent in heat dissipation and excellent in transmissivity and polarization splitting properties for oblique incident light at wide-range incident angles. A wire grid polarizing element 1 includes a substrate 10 made of an inorganic material, a grid structural body 20 made of an organic material and including a base part 21 provided on the substrate 10 and a plurality of ridge portions 22, the base part and the ridge portions being integrally formed, and a functional film 30 made of a metal material and covering part of the ridge portion 22. The base part has a thickness (TB) of less than or equal to 0.15 mm. The ridge portion 22 has an upward narrowing shape that narrows in width with distance from the base part 21. The functional film 30 covers and wraps the top of the ridge portion 22, and does not cover a bottom side of the ridge portion 22 and the base part 21.

Abstract: A semiconductor light receiving device (1) has a light receiving portion (6) with a light absorbing layer (4) on a first surface (2a) side of a semiconductor substrate (2) transparent to incident light in an infrared range for optical communications, a reflecting portion (11) in a region where light that was incident on the light receiving portion (6) and passed through the light absorbing layer (4) is reached on a second surface (2b) side opposite the first surface (2a) to reflect the light toward the second surface (2b), and end surfaces (2c, 2d) of the semiconductor substrate (2), where light reflected by the reflecting portion (11) and reflected by the second surface (2b) reaches, are formed as a rough surface having roughness with a height equal to or greater than the wavelength of the incident light.

Abstract: A protective element includes: a fuse element including a first end portion and a second end portion; an insulating member having an opening or a separation part, the insulating member being disposed in a state proximal to or in contact with the fuse element; a shielding member movable in an insertion direction to be inserted into the opening or the separation part of the insulating member so as to divide the fuse element; a pressing member that press the shielding member; a locking member that is fixed between the insulting case and the shielding member, optionally using a fixing member, and suppresses movement of the shielding member; and a heat-generating body configured to heat the locking member or the fixing member.

Abstract: A thin image display device is provided which is free from display defects caused by the deformation of an image display part and can display high brightness and high contrast images. The image display device includes an image display part, a light-transmitting protective part arranged on the image display part, and a cured resin layer interposed between the image display part and the protective part. The cured resin layer has a light transmittance in the visible region of 90% or more and a refractive index (nD) of 1.45 or more and 1.55 or less.

Abstract: This optical laminate includes a transparent substrate; an adhesion layer provided on at least one surface of the transparent substrate; and an optical layer provided on a surface of the adhesion layer on a side opposite to the transparent substrate, wherein the adhesion layer is formed of a metal material, and the metal material has a melting point in a range of 100° C. or more and 700° C. or less.

Abstract: A protective element includes: a fuse element including a first end portion and a second end portion; first and second insulating members each having an opening or a separation part, the first and second insulating members being disposed in a state proximal to or in contact with the fuse element; a shielding member movable in a moving direction that allows the shielding member to insert into the opening or the separation part so as to divide the fuse element; a locking member that suppresses movement of the shielding member; a pressing member that press the shielding member; and a heat-generating body configured to heat the locking member or a fixing member of the locking member.

Abstract: A method of manufacturing a connection structure, connection structure, film structure, and a method of manufacturing a film structure capable of mounting an electronic component having a plurality of terminal rows on a mounting surface by using existing equipment, including: a pasting step of pasting, from a film structure including a tape-shaped base material and a connection film formed thereon, connection films having a unit region of a predetermined length in the length direction of the base material and a predetermined width in the width direction to a first or second electronic component having a plurality of terminal rows; and a connecting step of connecting terminals of the first and second electronic components through the connection films, wherein the film structure includes, in the unit region, in addition to portions corresponding to the plurality of terminal rows, a non-pasting portion in which the connection film is not pasted.

Abstract: A semiconductor light receiving element in which a photodiode is formed on the main surface side of a first semiconductor substrate, and a cone ave mirror reflecting an incident light toward the light receiving element. The concave mirror comprises a flat first surface of the second semiconductor substrate that is transparent to the incident light, a convex surface formed in a convex shape toward the side opposite to the first surface on the second surface side opposite to the first surface, and a reflective film formed on the convex surface, and the incident light entering from the first surfaceside is reflected by the reflective film to a condensing positionnear the first surface, and the light receiving element was fixed to the first surface so as to overlap the light focusing position of the concave mirror.