Abstract: Provided is a wire grid polarizing element excellent in heat dissipation and excellent in transmissivity and polarization splitting properties for oblique incident light at wide-range incident angles. A wire grid polarizing element 1 includes a substrate 10 made of an inorganic material, a grid structural body 20 made of an organic material and including a base part 21 provided on the substrate 10 and a plurality of ridge portions 22, the base part and the ridge portions being integrally formed, and a functional film 30 made of a metal material and covering part of the ridge portion 22. The base part has a thickness (TB) of less than or equal to 0.15 mm. The ridge portion 22 has an upward narrowing shape that narrows in width with distance from the base part 21. The functional film 30 covers and wraps the top of the ridge portion 22, and does not cover a bottom side of the ridge portion 22 and the base part 21.

Abstract: A protective element includes: a fuse element including a first end portion and a second end portion; an insulating member having an opening or a separation part, the insulating member being disposed in a state proximal to or in contact with the fuse element; a shielding member movable in an insertion direction to be inserted into the opening or the separation part of the insulating member so as to divide the fuse element; a pressing member that press the shielding member; a locking member that is fixed between the insulting case and the shielding member, optionally using a fixing member, and suppresses movement of the shielding member; and a heat-generating body configured to heat the locking member or the fixing member.

Abstract: A semiconductor light receiving device (1) has a light receiving portion (6) with a light absorbing layer (4) on a first surface (2a) side of a semiconductor substrate (2) transparent to incident light in an infrared range for optical communications, a reflecting portion (11) in a region where light that was incident on the light receiving portion (6) and passed through the light absorbing layer (4) is reached on a second surface (2b) side opposite the first surface (2a) to reflect the light toward the second surface (2b), and end surfaces (2c, 2d) of the semiconductor substrate (2), where light reflected by the reflecting portion (11) and reflected by the second surface (2b) reaches, are formed as a rough surface having roughness with a height equal to or greater than the wavelength of the incident light.

Abstract: This optical laminate includes a transparent substrate; an adhesion layer provided on at least one surface of the transparent substrate; and an optical layer provided on a surface of the adhesion layer on a side opposite to the transparent substrate, wherein the adhesion layer is formed of a metal material, and the metal material has a melting point in a range of 100° C. or more and 700° C. or less.

Abstract: A thin image display device is provided which is free from display defects caused by the deformation of an image display part and can display high brightness and high contrast images. The image display device includes an image display part, a light-transmitting protective part arranged on the image display part, and a cured resin layer interposed between the image display part and the protective part. The cured resin layer has a light transmittance in the visible region of 90% or more and a refractive index (nD) of 1.45 or more and 1.55 or less.

Abstract: A protective element includes: a fuse element including a first end portion and a second end portion; first and second insulating members each having an opening or a separation part, the first and second insulating members being disposed in a state proximal to or in contact with the fuse element; a shielding member movable in a moving direction that allows the shielding member to insert into the opening or the separation part so as to divide the fuse element; a locking member that suppresses movement of the shielding member; a pressing member that press the shielding member; and a heat-generating body configured to heat the locking member or a fixing member of the locking member.

Abstract: A method of manufacturing a connection structure, connection structure, film structure, and a method of manufacturing a film structure capable of mounting an electronic component having a plurality of terminal rows on a mounting surface by using existing equipment, including: a pasting step of pasting, from a film structure including a tape-shaped base material and a connection film formed thereon, connection films having a unit region of a predetermined length in the length direction of the base material and a predetermined width in the width direction to a first or second electronic component having a plurality of terminal rows; and a connecting step of connecting terminals of the first and second electronic components through the connection films, wherein the film structure includes, in the unit region, in addition to portions corresponding to the plurality of terminal rows, a non-pasting portion in which the connection film is not pasted.

Abstract: A semiconductor light receiving element in which a photodiode is formed on the main surface side of a first semiconductor substrate, and a cone ave mirror reflecting an incident light toward the light receiving element. The concave mirror comprises a flat first surface of the second semiconductor substrate that is transparent to the incident light, a convex surface formed in a convex shape toward the side opposite to the first surface on the second surface side opposite to the first surface, and a reflective film formed on the convex surface, and the incident light entering from the first surfaceside is reflected by the reflective film to a condensing positionnear the first surface, and the light receiving element was fixed to the first surface so as to overlap the light focusing position of the concave mirror.

Abstract: An image display device including an image display panel and a front panel that are laminated via a transparent resin layer, when a photocurable material for forming the transparent resin layer is used as a dam agent or a fill agent, the photocurable material includes a component (a), which is a (meth)acrylic acid ester component; a component (b), which is a plasticizer component; and a component (c), which is a photopolymerization initiator component in order to make it difficult to visually recognize a knit line between the dam portion and the fill portion of the transparent resin layer after curing. A difference between the refractive index of the photocured product of the component (a), which is the (meth)acrylic acid ester component and the refractive index of the plasticizer component as the component (b) is 0.02 or less.

Abstract: A protective element includes: an insulating substrate; first and second electrodes provided on the insulating substrate; a heating element formed on the insulating substrate; a heating-element extraction electrode electrically connected to the heating element; a fusible conductor mounted from the first electrode to the second electrode with the heating-element extraction electrode interposed between the first and second electrodes; and an insulating protective layer which covers the heating element and includes a thermally conductive filler.

Abstract: A silicon nitride film is formed on the surface of the semiconductor substrate by supplying a raw material gas containing SiH4, NH3 and N2 into a reaction chamber by a plasma-accelerated chemical vapor deposition method, the ratio of the binding energy of the Si—H bond to the binding energy of the N—H bond in the silicon nitride film is defined as the binding energy ratio, and the ratio of the supply flow rate of NH3 to SiH4 is defined as the supply flow rate ratio, the supply flow rate ratio is set so that the sum of the concentration of the N—H bond multiplied by the binding energy ratio and the concentration of the Si—H bond is minimized.

Abstract: Provided are a cylindrical base, a master and a method for manufacturing a master enabling a uniform transfer of a fine pattern. A cylindrical base of a quartz glass having an internal strain in terms of birefringence of less than 70 nm/cm is used. A resist layer is deposited to an outer circumference surface of this cylindrical base, a latent image is formed on the resist layer, the latent image formed on the resist layer is developed and the pattern of the developed resist layer is used as a mask for etching to form a structure including concaves or convexes arranged in a plurality of rows on the outer circumference surface of the cylindrical base.

Abstract: An optical filter includes a transmission portion transmitting light and an absorption portion absorbing light between a plane of incidence and a plane of emission, and the volume of the transmission portion is larger than the volume of the absorption portion. For the optical filter, when the transmission spectrum S0 of light incident at an incidence angle of 0° and the transmission spectrum S60 of light incident at an incidence angle of 60° are superimposed, the transmittance (%) at an incidence angle of 60° is lower than the transmittance (%) at an incidence angle of 0° by 15% or more for a first wavelength band, and the difference between the transmittance (%) at an incidence angle of 60° and the transmittance (%) at an incidence angle of 0° is 10% or less for a second wavelength band.

Abstract: Provided is a protection circuit capable of reliably preventing an overcurrent or a sneak current after cutoff to improve safety, implementing cost reduction with a device configuration simpler than conventional device configurations, and further reducing a failure rate of a device. In a protection circuit, after one of two fuse elements provided in each of a plurality of protection elements is blown due to an overcurrent flowing along a current-carrying path, a heater provided in at least one of the plurality of protection elements generates heat due to a sneak current flowing via the plurality of protection elements on the current-carrying path which is remained and the current-carrying path which is remained is cut off due to destruction of the heater.

Abstract: This protective element includes a fusible conductor (1a), three or more electrodes (2a), (2b), (2c) electrically connected to each other via the fusible conductor (1a), and a heating element configured to heat and fuse the fusible conductor (1a).

Abstract: A protection element includes: a fuse element configured to be energized in a first direction, which is a direction from a first end portion of the fuse element to a second end portion of the fuse element; a shielding member including a plate-shaped part, configured to rotate around a rotation axis extending in a second direction orthogonal to the first direction, wherein the plate-shaped part viewed from the fuse element is divided to a first portion and a second portion at a contact position between the plate-shaped part and the rotation axis, and an area of the first portion and an area of the second portion are different from each other; and a case having therein a housing portion. Pressure elevation in the housing portion due to an arc discharge causes the shielding member to rotate around the rotation axis and the shielding member divides the housing portion.

Abstract: There are provided a master and a method for manufacturing the master, the master having, on its outer peripheral surface, a concave-convex structure in which concavities or convexities are continuously arranged with high precision. The master includes: a substrate with a hollow cylindrical shape or cylindrical shape; and a concave-convex structure on an outer peripheral surface of the substrate. The concave-convex structure has concavities or convexities continuously arranged at a predetermined pitch in a circumferential direction of the substrate. The concavities or convexities are arranged with a predetermined phase difference between circumferential rows adjacent in an axial direction of the substrate.

Abstract: An anisotropic electrically conductive film has a structure wherein the electrically conductive particles are disposed on or near the surface of an electrically insulating adhesive base layer, or a structure wherein an electrically insulating adhesive base layer and an electrically insulating adhesive cover layer are laminated together and the electrically conductive particles are disposed near the interface therebetween. Electrically conductive particle groups configured from two or more electrically conductive particles are disposed in a lattice point region of a planar lattice pattern. A preferred lattice point region is a circle centered on a lattice point. A radius of the circle is not less than two times and not more than seven times the average particle diameter of the electrically conductive particles.

Abstract: An optical device producing method includes: Step A of forming a wall portion surrounding an application region for a photocurable resin composition on an optical member or a transparent panel; Step B of applying a photocurable resin composition to the application region; Step C of forming a laminate by laminating the optical member and the transparent panel via the photocurable resin composition under a reduced-pressure atmosphere lower than atmospheric pressure; and Step D of removing babbles in the photocurable resin composition by pressurizing the laminate. In Step B, at least the height of the photocurable resin composition on the side of the wall portion is made higher than the height of the wall portion, and the photocurable resin composition is applied so that the laminate formed in Step C has a plurality of separated spaces separated by bubbles formed in the thickness direction of the photocurable resin composition.

Abstract: A reflective optical sensor (1) has first and second cases (11, 21) each equipped with first and second paraboloid mirrors (14, 24) and the symmetry axes (A1, A2) which intersect on the opposite side to the vertice (V1, V2) with respect to the focal points (F1,F2), and the light emitting element (12) is fitted at or near the focal point (F1) so as to face the first paraboloid mirror (14), the light receiving element (22) is fitted at or near the focal point (F2) so as to face the second paraboloid mirror (24), and the first and second cases (11, 21) are filled with sealing resin (2).