Abstract: An article of manufacture comprising an expandable sag-resistant nucleus-forming monolithic composite capable of being located within a hollow interior portion of a structural material and being expanded therein. Also, articles of manufacture comprising open-cellular structural material containing within the open-cell or cell thereof, at least one expandable sag-resistant nucleus-forming monolithic composite. The composite is desirably in the shape of a plug that is similar or close to similar to the shape of the hollow interior. In addition, there is described a process that comprises forming a pre-shaped expandable sag-resistant nucleus-forming. monolithic composite for use in reinforcing and stiffening a normally open-cellular structural material.

Abstract: In accordance with the present invention, there are provided low viscosity acrylate monomers, and compositions based on same having low moisture resistance (and, hence are much less prone to give rise to “popcorning”), excellent handling properties (i.e., generally existing as a fluid material which does not require the addition of solvent to facilitate the use thereof), and excellent performance properties (e.g., good dielectric properties).

Abstract: In accordance with the present invention, methods have been developed for the reduction of the chloride content of epoxy compound starting materials. Invention methods comprise subjecting specifically defined combinations comprising an epoxy resin starting material and other components to conditions sufficient to produce a treated epoxy compound (i.e., an epoxy compound having a chloride content which is reduced relative to that of the epoxy resin starting material), and separating the treated epoxy compound from the combination. Other components contemplated for use in the practice of the present invention comprise, alternatively, mixtures of crown ether, organic solvent and suitable base; mixtures of crown ether-like solvent and suitable base; mixtures of aprotic solvents and hydrides (other than tin hydride); mixtures of nonhalogenated organic solvent and reducing metal; and the like. In accordance with a further aspect of the present invention, products (i.e.

Abstract: In accordance with the present invention, there are provided novel hydrophobic compositions comprising a defined hydrophobic maleimide moiety and optionally, a hydrophobic cyanate ester moiety. Invention compositions have excellent moisture resistance (and, hence are much less prone to give rise to “popcorning”), excellent handling properties (i.e., generally existing as a fluid material which does not require the addition of solvent to facilitate the use thereof), and excellent performance properties (e.g., good dielectric properties).

Abstract: Solid extrusion coating compositions for metal substrates, a method of extrusion coating a metal substrate, and a metal article are disclosed. The extrusion coating composition is a thermoplastic material and comprises: (a) a polyester having a weight average molecular weight of 10,000 to 50,000 and optionally, (b) a modifying resin, selected from epoxy resins having an epoxy equivalent weight of 500 to 15,000, acrylic resins or polyolefin resins. The extrusion coating composition is applied to a metal substrate in an extrusion process to provide a composition film having a thickness of about 1 to about 40 microns.

Abstract: In accordance with the present invention, there are provided compositions based on defined hydrophobic vinyl monomers have excellent moisture resistance (and, hence are much less prone to give rise to "popcorning"), excellent handling properties (i.e., generally existing as a fluid material which does not require the addition of solvent to facilitate the use thereof), and excellent performance properties (e.g., good dielectric properties).

Abstract: In accordance with the present invention, there are provided novel adhesive compositions which do not require solvent to provide a system having suitable viscosity for convenient handling and cure rapidly. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and good adhesion to both the substrate and the device attached thereto.

Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

Abstract: A waterborne coating composition for metal containers, a method of coating a metal container, and a metal article useful as a food or beverage container are disclosed. The waterborne coating compositions are thermoplastic and self-crosslinkable materials and comprise: (a) an epoxy resin; (b) a water-dispersible acrylic resin; (c) an optional solid filler; (d) a fugitive base; and an aqueous carrier, wherein the waterborne coating composition contains 450 grams or less of volatile organic compounds per kilogram of nonvolatile material.

Abstract: A solid coating composition for use in powder coating and extrusion coating applications is disclosed. The coating composition contains about 70 to about 95% of a base resin, such as a polyester, and about 1 to about 50% of a low-to-medium molecular weight end-capped epoxy resin, and is essentially free of a bisphenol-A diglycidyl ether monomer. The solid coating composition is applied to a metal substrate in a powder coating or an extrusion process to provide a metal article having a composition film having a thickness of about 1 to about 200 microns. The metal articles can be used to package food and beverages.

Abstract: A composition that enhances the acid resistance of copper oxide. The composition includes a solution of an alkali metal borohydride and a quaternary ammonium ion in amounts selected such that when the composition is applied to copper oxide, the composition enhances the acid resistance of the copper oxide. The preferred alkali metal borohydride is sodium borohydride or potassium borohydride, and the preferred quaternary ammonium ion has the formula ##STR1## wherein each R1, R2, R3, R4 independently comprises a lower alkyl, hydroxylalkyl or carboxyalkyl group.

Abstract: In accordance with the present invention, there are provided improved methods for the preparation of maleimide monomers. This new method for the synthesis of maleimides is clearly superior to those documented in the prior art. Furthermore, the invention method utilizes materials with reduced toxicity, thus the overall process has a minimal impact on the environment. Thus, in accordance with the present invention, it has been discovered that certain amine salts can be successfully used to replace the polar, aprotic solvents cited in the prior art for the cyclodehydration of maleamic acids. The use of these salts provides competitive reaction times and product yields relative to results obtained with the polar, aprotic solvents. These salts have the advantage of having no vapor pressure and, therefore, have no possibility to co-distill with the water produced by the cyclodehydration reaction. Furthermore, such salts can be tailored to have desirable solubility characteristics (i.e.

Abstract: In accordance with the present invention, there are provided novel compositions for attaching semiconductor devices to substrates. Invention compositions comprise liquid monomer vehicle comprising hydrophobic cyanate ester monomer(s) and epoxy monomer(s), electrically and/or thermally conductive filler, a metal catalyst, and an imidazole, preferably in the substantial absence of non-reactive diluents.

Abstract: Solid extrusion coating compositions for metal substrates, a method of extrusion coating a metal substrate, and a metal article are disclosed. The extrusion coating composition is a thermoplastic material and comprises: (a) a polyester having a weight average molecular weight of about 10,000 to about 35,000, and (b) a modifying resin, such as an epoxy resin having an epoxy equivalent weight of about 500 to about 15,000. The extrusion coating composition is applied to a metal substrate in an extrusion process to provide a composition film having a thickness of about 1 to about 40 microns.

Abstract: A thin film printed board precursor containing a laminate of a dielectric thermosetting resin film layer and a heat and electrically conductive metal foil layer in direct adhesive bonding with a side of the resin film, optionally containing a supporting layer comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer, wherein the dielectric thermosetting resin layer has an unimpeded thickness that is at least equal to that of the foil layer bonded to it.

Abstract: A water-dispersible polymer and a coating composition containing the water-dispersible polymer are disclosed. The water-dispersible polymer is prepared from: (a) an epoxy compound having about two epoxy groups, such as an epoxy resin, (b) a linking compound having (i) conjugated carbon--carbon double bonds or a carbon--carbon triple bond and (ii) a moiety capable of reacting with an epoxy group, such as sorbic acid, and (c) acrylic monomers, at least a portion of which are capable of rendering the polymer water dispersible, such as acrylic acid, wherein the epoxy portion (a) of the polymer is covalently linked to the polymerized acrylic portion (c) by linking compound (b). The coating composition contains the water-dispersible polymer, a fugitive base to solubilize the polymer, a curing agent, and a carrier containing water.

Abstract: In accordance with the present invention, alternate lead-on-chip assembly methodologies have been developed which eliminate the use of a three layer film bonded to the leadframe, as currently employed in the art. According to the present invention, a dielectric paste is dispensed directly onto the top surface of the silicon die instead of the thermoplastic tape currently employed in the art. This approach required the development of apparatus and methods which meet the following requirements, e.g., 1) the method (and apparatus employed therefor) must provide comparable units/hour throughput to existing LOC assembly methods, and 2) the method must provide equivalent or superior package reliability when compared with tape bonded LOC packages. The invention method (and apparatus suitable for use therefor) satisfies these needs.

Abstract: A method and apparatus that prevents premature drying of a layer of a water-based coating composition on a substrate are disclosed.

Abstract: A water-dispersible polymer and a coating composition containing the water-dispersible polymer are disclosed. The water-dispersible polymer is prepared from: (a) an epoxy compound having about two epoxy groups, such as an epoxy resin, (b) a linking compound having (i) conjugated carbon-carbon double bonds or a carbon-carbon triple bond and (ii) a moiety capable of reacting with an epoxy group, such as sorbic acid, and (c) acrylic monomers, at least a portion of which are capable of rendering the polymer water dispersible, such as acrylic acid, wherein the epoxy portion (a) of the polymer is covalently linked to the polymerized acrylic portion (c) by linking compound (b). The coating composition contains the water-dispersible polymer, a fugitive base to solubilize the polymer, a curing agent, and a carrier containing water.

Abstract: In accordance with the present invention, it has been discovered that arylpropargyl ethers can readily be isomerized to produce benzopyrans, by subjecting a defined group of aryl propargyl compounds to isomerization conditions in suitable solvent. Invention isomerization process allows the production of a good yield of a variety of benzopyran materials, free of contaminating diluent. Benzopyrans prepared in accordance with the present invention are useful for the preparation of adhesive compositions, microelectronic devices, and the like.