Patents Assigned to Dexter-Hysol Aerospace, Inc.
  • Polyimide composition
    Patent number: 5296559
    Abstract: A composition that includes a finely divided, fully imidized, polyimide dispersed in a non-volatile, fluidizing resin that is a liquid or low viscosity semi-solid at room temperature. The fluidizing resin is substantially insoluble in the polyimide at room temperature, but soluble in the polyimide at the elevated temperatures during thermal processing. The composition has the flow characteristics of a highly filled liquid. The composition if useful, e.g., as an adhesive.
    Type: Grant
    Filed: December 19, 1991
    Date of Patent: March 22, 1994
    Assignee: Dexter-Hysol Aerospace, Inc.
    Inventors: Manette M. Gebhardt, Yesh P. Sachdeva