Patents Assigned to DFI, Inc.
  • Patent number: 7474527
    Abstract: A thermal module adapted for a desktop personal computer is provided. The desktop personal computer comprises a housing, a power supply, and a motherboard, the power supply being located inside the housing, and including a fan having an outlet oriented toward an outside of the housing, and the motherboard being located inside the housing, and including thereon a plurality of electronic elements. The thermal module comprises a first heat sink, an adjustment device, a first heat pipe, a second heat sink, and a second heat pipe. The first heat sink is disposed on one of the electronic elements. The adjustment device is slidably and thermally connected to the first heat sink by the first heat pipe, and is slidably and thermally connected to the second heat sink, located outside the housing at the outlet of the fan, by the second heat pipe.
    Type: Grant
    Filed: September 19, 2007
    Date of Patent: January 6, 2009
    Assignee: DFI, Inc.
    Inventor: Chih-Wei Wu
  • Publication number: 20080301346
    Abstract: A mother board module suitable for being disposed in a housing of a personal computer (PC) host is provided. The housing has expansion port openings at a rear wall of the housing. The mother board module includes a mother board, a sound card and a signal transmission cable. The mother board includes a circuit board and interface card slots. The interface card slots are juxtaposed on the circuit board and disposed corresponding to the expansion port openings respectively. The sound card has a fixing plate and audio jacks disposed thereon. Each of the audio jacks has a plug-in hole. The fixing plate is suitable for being removably fixed on one of the expansion port openings, which exposes the plug-in holes of the audio jacks beyond the rear wall. Two ends of the signal transmission cable are connected with the sound card and the circuit board respectively.
    Type: Application
    Filed: April 24, 2008
    Publication date: December 4, 2008
    Applicant: DFI, INC.
    Inventors: Chih-Wei Wu, Chia-Yi Chang
  • Publication number: 20080294886
    Abstract: A method for resetting a basic input/output system (BIOS) suitable for a desktop computer having the BIOS is provided. The BIOS is reset when a reset or power button of the desktop computer is pressed. Accordingly, the problem that the desktop computer cannot be booted up can be resolved quickly.
    Type: Application
    Filed: December 11, 2007
    Publication date: November 27, 2008
    Applicant: DFI, Inc.
    Inventor: Chia-Yi Chang
  • Publication number: 20080218963
    Abstract: A thermal module adapted for a desktop personal computer is provided. The desktop personal computer comprises a housing, a power supply, and a motherboard, the power supply being located inside the housing, and including a fan having an outlet oriented toward an outside of the housing, and the motherboard being located inside the housing, and including thereon a plurality of electronic elements. The thermal module comprises a first heat sink, an adjustment device, a first heat pipe, a second heat sink, and a second heat pipe. The first heat sink is disposed on one of the electronic elements. The adjustment device is slidably and thermally connected to the first heat sink by the first heat pipe, and is slidably and thermally connected to the second heat sink, located outside the housing at the outlet of the fan, by the second heat pipe.
    Type: Application
    Filed: September 19, 2007
    Publication date: September 11, 2008
    Applicant: DFI, INC.
    Inventor: Chih-Wei Wu
  • Publication number: 20080218964
    Abstract: A thermal module adapted for a desktop personal computer is provided. The desktop personal computer comprises a motherboard including a central processing unit and electronic elements. The thermal module comprises a first heat sink, at least one second heat sink, and a heat conductive plate. The first heat sink is disposed above the central processing unit. The second heat sink is disposed above one of the electronic elements. The heat conductive plate is coupled to the second heat sink, extends from the second heat sink to the central processing unit, and is engagingly sandwiched between the central processing unit and the first heat sink.
    Type: Application
    Filed: September 29, 2007
    Publication date: September 11, 2008
    Applicant: DFI, INC.
    Inventor: Chia-Yi Chang
  • Publication number: 20080218961
    Abstract: A heat dissipation module suitable for a desktop host includes a case, a power supply with a fan, and a mother board. The power supply and the mother board are disposed in the case. The mother board includes a work components. The heat dissipation module includes a first heat sink, a second heat sink and a heat pipe. The first heat sink is disposed on the work components. The second heat sink is disposed outside the case and at the outlet port of the fan. The heat pipe is connected between the first heat sink and the second heat sink. Hence, the heat dissipation module can dissipate the heat generated by the work component.
    Type: Application
    Filed: May 11, 2007
    Publication date: September 11, 2008
    Applicant: DFI, INC.
    Inventors: Chih-Wei Wu, Chia-Yi Chang
  • Publication number: 20080186666
    Abstract: A motherboard suitable for a desktop host is provided. The motherboard includes a circuit carrier that has a work area and an expanded area adjacent to the work area. The motherboard further includes a plurality of first power input connectors mounted on the circuit carrier and located in the expanded area for connecting to a plurality of first power output connectors of a power supply of the desktop host respectively. The motherboard further includes a plurality of second power output connectors mounted on the circuit carrier and located in the expanded area for connecting to a plurality of second power input connectors of disk drives of the desktop host respectively. The second power output connectors are electrically connected to the first power input connectors through an inner circuits of the expanded area.
    Type: Application
    Filed: June 4, 2007
    Publication date: August 7, 2008
    Applicant: DFI, INC.
    Inventor: Chih-Wei Wu