Patents Assigned to Diacon Inc.
  • Manufacturing process for package for electronic devices
    Patent number: 4141712
    Abstract: Semiconductor packages are manufactured according to a method which eliminates or greatly reduces the occurrence of short circuited or otherwise badly positioned leads. The method utilizes a leadframe having a bonding tip support connecting the bonding tips of the leads. After the leadframe is affixed to a ceramic element, the connecting element is removed.
    Type: Grant
    Filed: July 18, 1977
    Date of Patent: February 27, 1979
    Assignee: Diacon Inc.
    Inventor: Bryant C. Rogers