Abstract: A die apparatus for assembling a part carried by a part strip onto a carrier strip is disclosed. The die apparatus includes a die housing defining an assembly station, with a portion of the die housing including a punch generally aligned with the assembly station. A part strip conveyor is provided and is adapted to convey the part strip to a position adjacent the assembly station, while a carrier strip conveyor is also provided and is adapted to convey the carrier strip to a position aligned with the assembly station. Accordingly, upon operation of the punch a part is separated from the part strip and inserted into a part receiving aperture of the carrier strip during a single punch stroke.