Patents Assigned to DIC Corporation
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Publication number: 20250145825Abstract: Provided is a PAS molded article in which an increase in tackiness due to retention is suppressed and generated gas is reduced. Specifically, provided are a PAS resin composition obtained by mixing a PAS resin with a thermoplastic elastomer and/or a silane coupling agent, wherein the PAS resin is a crosslinked PAS resin, and has a region where tan ? at 280° C. to 330° C. is less than 1 at an angular frequency 1/s in the measurement of dynamic viscoelasticity, the amount of the thermoplastic elastomer mixed is 12 parts by mass or less relative to 100 parts by mass of the PAS resin, and/or the amount of the silane coupling agent mixed is 1.0 part by mass or less relative to 100 parts by mass of the PAS resin, and the viscosity change rate is 150% or less, a molded article, and methods for producing these.Type: ApplicationFiled: June 2, 2022Publication date: May 8, 2025Applicant: DIC CorporationInventors: Keisuke Yamada, Taku Ibaraki, Toshio Hinokimori, Hirokiyo Nakase
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Publication number: 20250145768Abstract: It is an object of the present invention to provide a cross-linked poly(aspartic acid) product that can retain the gel shape, water absorbency, water retentivity, and other performance because it does not undergo hydrolysis over time owing to the absence of an ester bond, and a method for producing the cross-linked poly(aspartic acid) product. The cross-linked poly(aspartic acid) product according to an embodiment of the present invention is a reaction product of a polysuccinimide (PSI), a compound (A: a1-A1-a2) containing a first functional group (a1) and a second functional group (a2), and a polyfunctional epoxy compound (B). The cross-linked poly(aspartic acid) product contains a cross-linked structure (PABAP) represented by PSI-a1-A1-a2-B-a2-A1-a1-PSI, the cross-linked structure (PABAP) is partially hydrolyzed, and the second functional group of the compound (A) does not react with the polysuccinimide (PSI) or is less reactive with the polysuccinimide (PSI) than the first functional group.Type: ApplicationFiled: November 24, 2022Publication date: May 8, 2025Applicant: DIC CorporationInventors: Tomoki Dohi, Manabu Kambara, Xin Jiang, Qing-Zhang Cui, Jin Guo, Chang-Jun Deng
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Patent number: 12291644Abstract: The present invention provides an urethane resin composition containing an urethane resin (A), water (B), and a film forming auxiliary (C), wherein the film forming auxiliary (C) is a polyethylene glycol (c1) and/or a polyethylene glycol (c2) having an alkoxy group having 11 or less carbon atoms. Further, the present invention provides a layered product having at least a substrate (i) and a foamed layer (ii) which is formed from the above-mentioned urethane resin composition. The polyethylene glycol (c1) and the polyethylene glycol (c2) preferably have a weight average molecular weight in the range of from 100 to 4,000. The urethane resin (A) preferably has an anionic group.Type: GrantFiled: April 7, 2020Date of Patent: May 6, 2025Assignee: DIC CorporationInventors: Norie Fujishita, Ryo Maeda
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Patent number: 12293983Abstract: Provided is a method for manufacturing a conductive pillar capable of bonding a substrate and a bonding member with high bonding strength via a bonding layer without employing an electroplating method, and a method for manufacturing a bonded structure by employing this method. A method for manufacturing a conductive pillar 1 includes, in sequence, the steps of forming a resist layer 16 on a substrate 11 provided with an electrode pad 13, the resist layer 16 including an opening portion 16a on the electrode pad 13, forming a thin Cu film 17 by sputtering or evaporating Cu on a surface of the substrate 11 provided with the resist layer 16 including the opening portion 16a, filling the opening portion 16a with a fine particle copper paste 12c, and sintering the fine particle copper paste 12c by heating the substrate 11 filled with the fine particle copper paste 12c.Type: GrantFiled: December 17, 2020Date of Patent: May 6, 2025Assignee: DIC CORPORATIONInventors: Ryota Yamaguchi, Makoto Yada
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Patent number: 12291605Abstract: The invention is directed to a composite structure in which a metal member having a roughened surface and a resin member are joined in a state in which at least a portion of the roughened surface is included. The resin member is made of a molded article obtained by melt-molding a polyarylene sulfide resin composition containing a polyarylene sulfide resin. In the roughened surface, a cumulative pore volume of a pore diameter in a range of 0.1 ?m to 20 ?m is in a range of 0.5 nL/mm2 or more and 5 nL/mm2 or less measured by mercury porosimetry. According to the invention, it is possible to provide a composite structure that is obtained by joining a metal member and a molded article made of polyarylene sulfide resin composition and is more excellent in joining strength, heat cycle resistance, and sealing properties, and a method for producing the composite structure.Type: GrantFiled: December 11, 2020Date of Patent: May 6, 2025Assignee: DIC CorporationInventors: Kenji Nakamura, Tomomichi Kanda
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Publication number: 20250129251Abstract: Provided is an active-energy-ray-curable coating composition containing components (A) to (D): as the component (A), a compound represented by a general formula (1) or (2), as the component (B), a compound represented by a general formula (3), as the component (C), a compound represented by a general formula (4), (5), or (6), and as the component (D), a compound represented by a general formula (7) or (8). In the total solid content of the components (A) to (D), a content of the component (A) is 1 to 40% by mass, a content of the component (B) is 30 to 85% by mass, a content of the component (C) is 1 to 30% by mass, and a content of the component (D) is 1 to 40% by mass.Type: ApplicationFiled: September 22, 2022Publication date: April 24, 2025Applicant: DIC CorporationInventors: Kenichirou Oka, Hiroki Futagawa, Yasuhiro Takada
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Publication number: 20250132413Abstract: The present invention relates to a secondary battery module including a heat-absorbing sheet including a heat-absorbing agent and sandwiched between battery cells. The configuration of the present invention can suppress a rapid temperature rise of a secondary battery due to heat generation during high-speed charging and high-output discharging, internal short circuits, or the like, minimize damage such as ignition and smoking due to thermal runaway, and prevent or delay the chain explosion to other battery cells by absorbing and extinguishing the heat from battery cells that have reached abnormally high temperature. In addition, the expansion of the battery cell itself caused by the heat generation and temperature rise described above can be suppressed.Type: ApplicationFiled: September 15, 2022Publication date: April 24, 2025Applicant: DIC CorporationInventors: Kenichi Fujisaki, Kyouichi Toyomura
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Publication number: 20250132314Abstract: [Object] To provide a secondary battery material that is used in a lithium ion battery, a negative electrode active material including the secondary battery material, and a secondary battery including the negative electrode active material. The secondary battery material gives a secondary battery having high charge and discharge capacity, initial efficiency, and capacity retention rate as a whole and having an excellent balance of these characteristics. [Solution]A secondary battery material contains Si (silicon), O (oxygen), and C (carbon), and the content ratio x of O to Si satisfies 0.1?x?2, and the content ratio y of C to Si satisfies 0.3?y?11.Type: ApplicationFiled: June 30, 2022Publication date: April 24, 2025Applicant: DIC CorporationInventors: Toru Takehisa, Peixin Zhu, Satoshi Katano, Hirotomo Sasaki, Tetsuya Tamura, Kenichi Kawase, Takanori Baba, Tatsuhiko Arai
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Patent number: 12281201Abstract: A polyarylene ether ketone resin includes repeating units represented by general formulae (1-1), (2-1), and (3-1) below. (In the formula (1-1), m1 is an integer of any one of 1 to 3). (In the formula (2-1), m2 is an integer of any one of 1 to 3). (In the formula (3-1), n is an integer of any one of 0 to 2).Type: GrantFiled: June 8, 2020Date of Patent: April 22, 2025Assignee: DIC CORPORATIONInventors: Noriyuki Iwadate, Naoto Yagi
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Publication number: 20250122320Abstract: An object of the present invention is to provide a curable resin composition having excellent solvent solubility, heat resistance (high glass transition temperature), and dielectric properties (low dielectric properties), and a cured article thereof. Specifically, the curable resin composition includes a curable resin (A) that has a repeating unit represented by General Formula (1) and contains one or more reactive groups selected from the group consisting of a (meth)acryloyloxy group, a vinylbenzyl ether group, and an allyl ether group as a terminal structure, and a curable compound (B) represented by General Formula (2). The details of the substituent represented by General Formula (1) and the number of substituents are as described in the specification. The details of the substituent represented by General Formula (2) and the number of substituents are as described in the specification.Type: ApplicationFiled: July 28, 2022Publication date: April 17, 2025Applicant: DIC CorporationInventors: Ryuichi Matsuoka, Lichen Yang, Hiroyoshi Kannari
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Publication number: 20250121302Abstract: Provided is a hollow fiber deaeration module excellent in both smoothness of a wetted surface and deaeration performance. More specifically, the hollow fiber deaeration module includes: a closed container; a tube unit disposed in the closed container and composed by bundling a plurality of tubes; a first connector part disposed at a liquid introduction port of the closed container so as to penetrate through the inside and the outside of the closed container and engaged with the closed container; and a second connector part disposed at a liquid discharge port of the closed container so as to penetrate through the inside and the outside of the closed container and engaged with the closed container. The tube in the hollow fiber deaeration module is an amorphous fluoropolymer, polytetrafluoroethylene, or polymethyl pentene.Type: ApplicationFiled: October 20, 2022Publication date: April 17, 2025Applicant: DIC CorporationInventors: Kazuyasu Kawashima, Akira Sato, Kazumi Oi, Mana Koyama
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Publication number: 20250122411Abstract: The present invention can provide an epoxy resin composition that can have flexibility, toughness, adhesiveness, and high disassemblability by heating, and can provide a cured product and a laminate thereof. An epoxy resin composition according to the present invention contains an epoxy resin (A) with an epoxy equivalent in the range of 500 to 10,000 g/eq, an epoxy resin (B) with an epoxy equivalent in the range of 100 to 300 g/eq, and a compound (C) with an anthracene dimer skeleton. The epoxy resin (A) is represented by the following general formula (1), and the compound (C) has two or more groups containing an epoxy group or two or more groups containing a curable group.Type: ApplicationFiled: November 9, 2022Publication date: April 17, 2025Applicants: DIC Corporation, KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATIONInventors: Masato OTSU, Kazuo ARITA, Eriko SATO
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Patent number: 12275877Abstract: An adhesive tape with high high-load holding power, initial adhesive strength, and repeelability is provided. An adhesive layer of the adhesive tape contains filler particles and a triblock copolymer with a repeating unit represented by the following general formula (1): A, B, and C independently denote a repeating unit. A and C independently denote an alkyl methacrylate monomer unit and B denotes an alkyl acrylate monomer unit. p, q, and r independently denote the degree of polymerization of their monomer units respectively. A and C may be the same or may denote an alkyl methacrylate monomer unit with a different chemical structure, and * denotes a bonding arm to another atom. A relationship D50/T between an average particle size D50 of the filler particles and an average thickness T of the adhesive layer ranges from 0.05 to 1.0.Type: GrantFiled: July 20, 2022Date of Patent: April 15, 2025Assignee: DIC CorporationInventors: Daisuke Watanabe, Kota Suetsugu, Akira Yamakami, Yumi Kagiyama
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Publication number: 20250115550Abstract: Provided is a method for producing sulfurized olefin, the method including reacting an olefin compound (a) represented by R1R2C?CHR3 . . . (1) (in Formula (1), R1 and R2 each are alkyl groups, respectively, R3 is a hydrogen atom or an alkyl group, and the total number of carbon atoms of R1, R2 and R3 is 2 to 20) with sulfur in the presence of hydrogen to give a dialkyl polysulfide (A).Type: ApplicationFiled: February 15, 2023Publication date: April 10, 2025Applicants: DIC Corporation, Kyushu University, National University CorporationInventors: Hironobu Matsueda, Hiroshi Sakata, Shujiro Otsuki, Eiji Yamamoto, Makoto Tokunaga, Haruno Murayama, Yuta Takaki, Yasutaka Kawai, Kei Takakura, Moemi Kimura
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Patent number: 12269912Abstract: Provided is a fiber-reinforced molding material containing a thickening substance (A) containing a vinyl ester resin (a1), an unsaturated monomer (a2), a polyisocyanate (a3), and a polymerization initiator (a4) as essential raw materials and carbon fibers (B) with a fiber length of 2.5 mm to 50 mm. The thickening substance (A) satisfies conditions (1) to (3) below as measured with a rheometer. (1) The maximum value of the rate of change in viscosity in a temperature region lower than a temperature Xa indicating the lowest melt viscosity A is 100 Pa·s/° C. to 1,500 Pa·s/° C. (2) The maximum value of the rate of change in viscosity in a temperature region higher than or equal to the temperature Xa is 1,000 Pa·s/° C. to 10,000 Pa·s/° C. (3) The lowest melt viscosity A is 10 Pa·s to 1,000 Pa·s and the temperature Xa is 70° C. to 140° C.Type: GrantFiled: May 1, 2020Date of Patent: April 8, 2025Assignee: DIC CorporationInventors: Chikara Yoshioka, Kazutoshi Hitomi
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Publication number: 20250109255Abstract: Provided is a silicone chain-containing polymer functioning as a leveling agent which imparts high smoothness and the effect of suppressing pin unevenness to a coating film. Specifically, a silicone chain-containing polymer includes, as polymerization components, a polymerizable monomer (1) having a group containing a structure represented by general formula (A) below and a polymerizable monomer (2) having one or more selected from an alkyl group having 1 to 18 carbon atoms, an aromatic group having 6 to 18 carbon atoms, and a group containing a polyoxyalkylene chain.Type: ApplicationFiled: December 22, 2022Publication date: April 3, 2025Applicant: DIC CorporationInventors: Junpei Ueno, Masaki Hatase, Jun Noguchi, Ryohei Shimizu, Yuuki Noguchi, Shin Sasamoto, Hideya Suzuki
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Publication number: 20250112237Abstract: A negative electrode active material giving a secondary battery having high initial discharge capacity, capacity retention rate, and charge-discharge capacity and having an excellent balance of these characteristics is provided. The negative electrode active material has a granular structure having a surface uneven part and mainly contains graphite and a surface layer with silicon particles with an average particle size of 20 nm to 200 nm dispersed in a matrix phase at least on part of the surface of the granular structure. The silicon particles are flake-like and crystalline, and a crystallite size with 2? of 28.4° in X-ray diffraction is 40 nm or less.Type: ApplicationFiled: October 27, 2022Publication date: April 3, 2025Applicant: DIC CorporationInventors: Peixin Zhu, Kenichi Kawase
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METHOD FOR PRODUCING POLYSUCCINIMIDE, POLYSUCCINIMIDE COMPOSITION, AND POLYASPARTIC ACID COMPOSITION
Publication number: 20250109247Abstract: Provided is a method for producing a polysuccinimide that can simply produce a high molecular weight polysuccinimide. The method for producing a polysuccinimide is a method for producing a polysuccinimide in which a second polysuccinimide is produced using a polysuccinimide composition containing a first polysuccinimide. The method includes: performing a chain elongation reaction of the first polysuccinimide to obtain the second polysuccinimide. The first polysuccinimide has a weight average molecular weight (Mw) falling within a range of 25,000 to 50,000. The polysuccinimide composition contains dicarboxylic acid at a ratio of 1.5 mol % to 4 mol %.Type: ApplicationFiled: September 30, 2024Publication date: April 3, 2025Applicant: DIC CorporationInventors: Hisakazu Tanaka, Manabu Kambara -
Patent number: 12264108Abstract: It relates to zirconia particles containing molybdenum and each having a polyhedron shape. The molybdenum is preferably unevenly distributed in surface layers of the zirconia particles. It also relates to a method for producing the zirconia particles. The method includes mixing a zirconium compound and a molybdenum compound to form a mixture and firing the mixture.Type: GrantFiled: December 16, 2020Date of Patent: April 1, 2025Assignee: DIC CorporationInventors: Shaowei Yang, Minoru Tabuchi, Jianjun Yuan, Cheng Liu, Meng Li, Wei Zhao, Jian Guo
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Patent number: 12264251Abstract: A task to be achieved by the present invention is to provide a method for producing a printed matter. The ink has excellent adhesion to an ink unabsorbent or non-absorbent recording medium, such as a resin film or coated paper, which is unlikely to absorb a solvent contained in an ink, and excellent setting property. The present invention is directed to a method for producing a printed matter, using an ink including a binder (A) having a carbonyl group, a compound (B) having a structure capable of reacting with the carbonyl group, and an aqueous medium in which the binder (A) and the compound (B) are dissolved or dispersed.Type: GrantFiled: November 3, 2023Date of Patent: April 1, 2025Assignee: DIC CORPORATIONInventors: Maiko Kitade, Yoshinosuke Shimamura, Masaki Hosaka