Patents Assigned to DIC Corporation
  • Publication number: 20220259472
    Abstract: A two-component curing adhesive using a curing reaction between a polyisocyanate composition (X) and a polyol composition (Y), wherein the polyisocyanate composition (X) includes a polyisocyanate (A), the polyol composition (Y) includes a polyol (B), and the polyisocyanate composition. (X) and the polyol composition (Y) each have an elongational viscosity of 0.1 to 10 Pa·s.
    Type: Application
    Filed: February 15, 2021
    Publication date: August 18, 2022
    Applicant: DIC Corporation
    Inventors: Kenji Nakamura, Atsumi Sano, Tomoo Okubo, Masahiro Niwa
  • Publication number: 20220259460
    Abstract: A two-component curing adhesive using a curing reaction between a polyisocyanate composition (X) and a polyol composition (Y), wherein the polyisocyanate composition (X) includes a polyisocyanate (A), the polyol composition (Y) includes a polyol (B), and the polyisocyanate composition. (X) and the polyol composition (Y) each have a Trouton ratio within a range of 4.0 to 8.0.
    Type: Application
    Filed: February 15, 2021
    Publication date: August 18, 2022
    Applicant: DIC Corporation
    Inventors: Kenji Nakamura, Atsumi Sano, Tomoo Okubo, Masahiro Niwa
  • Patent number: 11415840
    Abstract: The present invention provides a liquid crystal display device that includes a first substrate having an electrode A formed thereon; a second substrate having an electrode B formed thereon and being disposed to oppose the first substrate; and a liquid crystal layer disposed between the first substrate and the second substrate and substantially vertically aligned with respect to the first and second substrates when no voltage is applied between electrodes, in which the electrode A has a fishbone pattern having a branched portion, and a space (S ?m) between adjacent branches of branches of the fishbone pattern and an inter-substrate distance (d ?m) between the first substrate and the second substrate satisfy a relationship of formula (1): (d?0.6)/1.25<S<(d+1.1)/1.25??formula (1).
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: August 16, 2022
    Assignee: DIC CORPORATION
    Inventors: Kazuki Kurisawa, Yuichi Inoue
  • Patent number: 11414567
    Abstract: Provided are a resin material that is superior in coating appearance and adhesion to substrates and can be used not only under organic solvent-diluted conditions but also under aqueous solvent-diluted conditions; an undercoat agent for an inorganic-material thin film containing the same; and a molded body produced by using the undercoat agent for an inorganic-material thin film. Provided are a (meth)acryloyl group-containing acrylic-modified alkyd resin, an active-energy-ray-curable resin composition containing the same, the undercoat agent for an inorganic-material thin film, and a molded body produced by using the undercoat agent for an inorganic-material thin film.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: August 16, 2022
    Assignee: DIC Corporation
    Inventors: Akio Umino, Hirotake Fukuoka
  • Publication number: 20220251426
    Abstract: The invention relates to a method for peeling a pressure-sensitive adhesive tape including: a pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape has a thickness greater than 150 ?m and smaller than 1,500 ?m, an elongation at break of 600% to 3,000%, and a stress at break of 2.5 to 80.0 MPa. According to the invention, the conformity and the adhesion with respect to an adherend, particularly, a hard adherend, are excellent, and excellent re-peeling properties are obtained, so that the pressure-sensitive adhesive tape can be stretched and peeled off in a horizontal direction, without necessity for embrittling the pressure-sensitive adhesive tape by heating or by using an organic solvent or the like or without remaining of the pressure-sensitive adhesive on the adherend, in a case of peeling the pressure-sensitive adhesive tape.
    Type: Application
    Filed: May 2, 2022
    Publication date: August 11, 2022
    Applicant: DIC CORPORATION
    Inventors: Daisuke Watanabe, Takamine Sugiura, Akira Yamakami
  • Publication number: 20220251423
    Abstract: An object of the present invention is to provide an adhesive tape that can be removed from an adherend more easily and more rapidly. The adhesive tape of the present invention includes a base material layer, and adhesive layers on both sides of the base material layer, the base material layer has a thickness of 10 to 100 ?m, a breaking strength of 20 to 90 MPa, a breaking elongation of 400% to 1,500%, and a 100% modulus of 1 to 5 MPa, and an adhesive composition forming the adhesive layers contains 1% to 40% by mass of filler particles having an average particle diameter of 0.1 to 40 ?m with respect to 100% by mass of the adhesive composition.
    Type: Application
    Filed: August 27, 2020
    Publication date: August 11, 2022
    Applicant: DIC Corporation
    Inventor: Daisuke Watanabe
  • Publication number: 20220251378
    Abstract: In the present invention, there is provided a moisture-curable polyurethane hot-melt resin composition containing an urethane prepolymer (i) having an isocyanate group, which is a reaction product of a polyol (A) and a polyisocyanate (B), the polyol (A) comprising a polyester polyol (al) which uses a polybasic acid (x) derived from biomass and a glycol (y) derived from biomass as raw materials. Further, the present invention provides an adhesive containing the moisture-curable polyurethane hot-melt resin composition. The biomass-derived polybasic acid (x) is preferably sebacic acid and/or succinic acid. The biomass-derived glycol (y) is preferably 1,3-propanediol and/or 1,4-butanediol. The moisture-curable polyurethane resin composition preferably has a biomass degree of 40% or more.
    Type: Application
    Filed: June 18, 2020
    Publication date: August 11, 2022
    Applicant: DIC Corporation
    Inventor: Kunihiko Komatsuzaki
  • Publication number: 20220251466
    Abstract: The present invention provides a lubricating oil additive, including: a molybdenum compound (A) represented by the following general formula (1); and a sulfur-based composition (B) containing a sulfur-based compound (b-1) represented by the following general formula (2) and at least one kind of sulfur-based compound (b-2) represented by the following general formula (3) or (4), and a lubricating oil composition containing the additive. In the formula (1), R1 to R4 each represent alkyl groups having 6 to 18 carbon atoms, the groups being identical to or different from each other, and X1 to X4 each independently represent an oxygen atom or a sulfur atom. In the formula (2), R5 represents an alkyl group having 1 to 22 carbon atoms, R6 represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms, R7 represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms, and “a” represents a number from 1 to 10.
    Type: Application
    Filed: July 14, 2020
    Publication date: August 11, 2022
    Applicants: ADEKA CORPORATION, DIC CORPORATION
    Inventors: Shinji IINO, Akihiro KOTAKA, Eiji KATSUNO, Hironobu MATSUEDA, Hiroshi SAKATA
  • Publication number: 20220251276
    Abstract: Provided is a polycarbonate-modified acrylic resin that is a reaction product of a polycarbonate diol (A) obtained from 1,4-butanediol as an essential raw material and an unsaturated monomer mixture (B) comprising as essential components methyl methacrylate, an unsaturated monomer (b1) having a hydroxyl group, and an unsaturated monomer (b2) having a carboxyl group, in which a mass ratio of the unsaturated monomer (b2) in the unsaturated monomer mixture (B) is in a range of 2 to 10%. The polycarbonate-modified acrylic resin can form a coating film having high adhesion to a plastic base material, excellent water resistance adhesion, and fragrance resistance, so that it can be suitably used as a coating material for coating various articles.
    Type: Application
    Filed: June 11, 2020
    Publication date: August 11, 2022
    Applicant: DIC Corporation
    Inventors: Mio Himeno, Taku Murakawa
  • Publication number: 20220251285
    Abstract: The present invention provides a curable composition containing a urethane-modified epoxy resin (A) as an essential component of a main agent and an acid anhydride (B) as an essential component of a curing agent, the urethane-modified epoxy resin (A) being a reaction product obtained by using a polyisocyanate compound (a1), a polyether polyol (a2), and a hydroxy group-containing epoxy resin (a3) as essential reaction materials; a cured product thereof; a fiber-reinforced composite material; a fiber-reinforced resin molded article; and a method for producing a fiber-reinforced resin molded article. The curable composition can form a cured product having excellent fracture toughness and tensile strength in the cured product.
    Type: Application
    Filed: July 30, 2020
    Publication date: August 11, 2022
    Applicant: DIC Corporation
    Inventors: Atsuko Kobayashi, Makoto Kimura, Shigeki Matsui
  • Publication number: 20220251428
    Abstract: The adhesive tape has excellent drop impact resistance. It can be removed more easily and more rapidly from an adherend in addition to the excellent drop impact resistance. The adhesive tape includes an adhesive layer, the adhesive layer contains particles having an average particle diameter of 4 to 40 ?m and a surface of which is a silicone resin, and an adhesive resin, and the particles has a content of 3 to 50 parts by mass with respect to 100 parts by mass of the adhesive resin. In addition, the adhesive tape of the present invention includes the adhesive layers on one side or both sides of a base material layer, and the base material layer has a thickness of 10 to 500 ?m, a breaking strength of 10 to 90 MPa, and a breaking elongation of 400 to 1,500%.
    Type: Application
    Filed: August 27, 2020
    Publication date: August 11, 2022
    Applicant: DIC Corporation
    Inventor: Daisuke Watanabe
  • Publication number: 20220251254
    Abstract: To provide a curable resin composition of which a cured product has excellent heat-resistance and dielectric properties, and a cured product thereof, and a prepreg, a circuit board, a build-up film, a semiconductor sealing material, and a semiconductor apparatus having both excellent heat resistance and dielectric properties. The invention has an indane scaffold represented by the following general formula (1): in formula (1), Ra's are each independently an alkyl group, an alkyloxy group or an alkylthio group, which has 1 to 10 carbon atoms, an aryl group, an aryloxy group or an arylthio group, which has 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group, and q represents an integer value of 0 to 4.
    Type: Application
    Filed: February 20, 2020
    Publication date: August 11, 2022
    Applicant: DIC Corporation
    Inventors: Tomohiro Shimono, Tatsuya Okamoto
  • Publication number: 20220250393
    Abstract: A hollow fiber degassing module includes: a hollow fiber membrane bundle including a plurality of hollow fiber membranes bundled into a cylindrical shape; a housing that houses the hollow fiber membrane bundle, includes a liquid supply port and a liquid discharge port that are formed in communication with spaces between the plurality of hollow fiber membrane, and further includes a suction port formed in communication with inner spaces of the plurality of hollow fiber membranes; and an outer support having a plurality of openings formed therein and disposed between the hollow fiber membrane bundle and the housing.
    Type: Application
    Filed: June 23, 2020
    Publication date: August 11, 2022
    Applicant: DIC Corporation
    Inventors: Naruhito SUZUKI, Youhei SUGANUMA, Kazumi OI
  • Patent number: 11407708
    Abstract: The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided are an active ester compound represented by chemical formula (1): (where in chemical formula (1), Ar1 is a substituted or unsubstituted first aromatic ring group, and each Ar2 is independently a substituted or unsubstituted second aromatic ring group, in which at least one of Ar1 and Ar2 has an unsaturated bond-containing substituent, and n is an integer of 2 or 3), a curable composition containing the active ester compound, and a cured product thereof.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: August 9, 2022
    Assignee: DIC Corporation
    Inventors: Yutaka Satou, Kazuhisa Yamoto
  • Patent number: 11407920
    Abstract: An object of the present invention is to provide a paint which is excellent in various performances such as resistance to various organic solvents and hydraulic fluid, corrosion resistance, weather resistance, heat resistance, adhesion to substrates, and coating film appearance, and which in particular, can be suitably used for aircraft applications. Specifically, the invention provides a paint which contains, as an essential component of a main agent, a polyester resin (A) having a hydroxyl value in a range of 150 to 400 mg KOH/g and a weight average molecular weight (Mw) in a range of 500 to 5,000, and a polyisocyanate compound (B) as an essential component of a curing agent; an aircraft paint using the paint; and an aircraft using the aircraft paint.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: August 9, 2022
    Assignee: DIC Corporation
    Inventors: Kan Takeuchi, Ikue Hamamoto
  • Publication number: 20220242067
    Abstract: Provided are a method for producing a carbon fiber-reinforced molding material including a step of detecting the presence of metal in a molding material by a magnetic sensor-type metal detection method, and a method for producing a molded article including subjecting the carbon fiber-reinforced molding material produced by the production method to hot press molding. The method for producing a carbon fiber-reinforced molding material involves accurately detecting foreign metal in the carbon fiber-reinforced molding material and efficiently produces a carbon fiber-reinforced molding material without damaging a mold or causing other problems. The production method is thus suitably used to produce various molded articles, such as automobile parts.
    Type: Application
    Filed: June 2, 2020
    Publication date: August 4, 2022
    Applicant: DIC Corporation
    Inventors: Mikihiko Nakano, Kouji Nagata, Daisuke Nishikawa, Kenichi Hamada
  • Publication number: 20220243043
    Abstract: The multilayer film of the present disclosure has at least a heat-sealing layer and a support layer formed on one side of the heat-sealing layer, wherein the first resin composition forming the heat-sealing layer comprises (a) high-density polyethylene, (b) a propylene random copolymer, and (c) a 1-butene polymer, wherein the content of the component (a) is 30 to 60% by mass, the content of the component (b) is 8 to 42% by mass, and the content of the component (c) is 16 to 56% by mass, wherein the component (a) has a melt flow rate of 10 to 30 g/10 minutes at 190° C., the component (b) has a melt flow rate of 8 to 20 g/10 minutes at 230° C., and the component (c) has a melt flow rate of 0.3 to 3 g/10 minutes at 190° C.
    Type: Application
    Filed: July 7, 2020
    Publication date: August 4, 2022
    Applicant: DIC Corporation
    Inventors: Takashi Moriya, Tomohisa Kida
  • Patent number: 11401169
    Abstract: The present invention provides alumina particles having a fixed card-house structure formed of three or more flat plate-like alumina particles and having an average particle diameter of 3 to 1000 ?m. Also, there is provided alumina particles having an average particle diameter of 3 to 1000 ?m and having a fixed card-house structure in which the three or more flat plate-like alumina are aggregated to be crossed each other at two or more plurality of positions, and the plane directions of the flat plates crossed each other are in a state of disordered arrangement.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: August 2, 2022
    Assignee: DIC Corporation
    Inventors: Shingo Takada, Kazuo Itoya, Jian-Jun Yuan, Takayuki Kanematsu, Masamichi Hayashi, Fumihiko Maekawa, Yoshiyuki Sano
  • Publication number: 20220235167
    Abstract: Provided are a block copolymer having a narrow molecular weight distribution such that the copolymer can be used in a DSA technique, a block copolymer intermediate thereof, and methods for producing the same. A block copolymer intermediate represented by the general formula (1) or (2) is used: wherein, in the general formulae (1) and (2), each of R1 and R3 independently represents a polymerization initiator residue, each of R2 and R4 independently represents an aromatic group or an alkyl group, Y1 represents a polymer block of (a)an (meth)acrylic acid ester, Y2 represents a polymer block of styrene or a derivative thereof, L represents an alkylene group having 1 to 6 carbon atoms, X represents a halogen atom, and each of m and n independently represents an integer of 1 to 5.
    Type: Application
    Filed: June 4, 2020
    Publication date: July 28, 2022
    Applicant: DIC Corporation
    Inventors: Youki Kou, Hisakazu Tanaka
  • Publication number: 20220234904
    Abstract: A hollow nano-particle includes a shell layer containing a block copolymer having a hydrophobic organic chain and a polyamine chain, and silica. A hollow silica nano-particle has a porosity of 20% by volume or more and 70% by volume or less, and a thickness of a shell layer containing silica of 3 nm or more and 100 nm or less. A production method for the hollow nano-particle includes: a step of dropping an aqueous solvent while stirring an organic solvent in which a block copolymer having a hydrophobic organic chain and a polyamine chain is dissolved, to obtain a dispersion liquid of vesicles containing the block copolymer; and a step of adding a silica source to the dispersion liquid of vesicles, carrying out a sol-gel reaction of the silica source using the vesicle as a template, and precipitating silica to obtain the hollow nano-particle.
    Type: Application
    Filed: July 8, 2020
    Publication date: July 28, 2022
    Applicant: DIC Corporation
    Inventors: Jianjun Yuan, Hiroshi Kinoshita, Hisakazu Tanaka, Yukie Uemura