Patents Assigned to Diceon Electronics, Inc.
  • Method of thermally dimensionally stabilizing a printed circuit board
    Patent number: 4115185
    Abstract: A method of thermally dimensionally stabilizing a printed circuit board prior to drilling and chemically processing wherein the printed circuit board has an epoxy fiberglass base and a layer of conductive material bonded to at least one side of the insulating base by transporting the printed circuit board thru a thermal shocking intense heat having a temperature of about 425.degree. F to about 450.degree. F (about 218.degree. C to about 232.degree. C) and a boiling point temperature in excess of 450.degree. F (232.degree.
    Type: Grant
    Filed: August 5, 1977
    Date of Patent: September 19, 1978
    Assignee: Diceon Electronics, Inc.
    Inventors: Carl S. Carlson, Lawrence M. Kinsella, Daniel L. Pixley