Abstract: The color uniformity of a light spot is measured by providing an image of the light spot by means of a camera or camera sensor with sensor elements, each of the sensor elements capturing a set of three or more color component values that together define a set of pixel values at such sensor element, wherein the image includes a plurality of sets of pixel values. The method also derives for each of the plurality of sets of pixel values at a corresponding sensor element a first ratio between a first pair of the pixel values or of values obtained therefrom in such set. Preferably a second ratio is also derived between a second pair of the pixel values or of values obtained therefrom in such set, where the second pair is different from the first pair.
Abstract: An array structure for light emitting diodes (LEDs) uses a patterned metal layer buried beneath LED chips to electrically interconnect non-adjacent chips in series, such that each chip in the LED array can be adjacently surrounded by LED chips of different colors. Thus, when the emission from the LED array is projected to a spot in the far field, its color uniformity over the spot is enhanced. Methods are also described for fabricating the multi-layer circuit board for such an array. Top and bottom patterned metal layers are formed, separated by a patterned insulating layer, so that electrical connections may be made between the metal layers. This provides “vias” between the metal layers for creating “cross-under” electrical connections under the second insulation layer, such that spatially-separated LED chips can be interconnected into strings, while maintaining electrical isolation between LED chips of different colors.
Abstract: A broad-spectrum, multiple wavelength illuminator comprises a luminescent body, and a plurality of semiconductor chips spaced apart from the luminescent body emitting light within one or more wavelength ranges towards the luminescent body, causing the luminescent body to emit light of one or more wavelength ranges. An optical element adjacent to the luminescent body collects light emitted by the luminescent body. An optical device collects light collected by the optical element. An aperture located between the optical element and the optical device passes the light emitted by the luminescent body along an optical axis, wherein light collected by the optical element and the optical device and passed by the aperture forms a beam of light illuminating a target. Alternatively, instead of being spaced apart from the chips, the luminescent body may be a layer adjacent to the chips.
Abstract: An LED array includes three or more strings of bare LEDs mounted in close proximity to each other on a substrate. The strings of LEDs emit light of one or more wavelengths of blue, indigo and/or violet light, with peak wavelengths that are less than 490 nm. Luminescent materials deposited on each of the LED chips in the array emit light of different wavelength ranges that are of longer wavelengths than and in response to light emissions from the LED chips. A control circuit applies currents to the strings of LEDs, causing the LEDs in the strings to emit light, which causes the luminescent materials to emit light. A user interface enables users to control the currents applied by the control circuit to the strings of LEDs to achieve a Correlated Color Temperature (CCT) value and hue that are desired by users, with CIE chromaticity coordinates that lie on, or near to the black body radiation curve.
Type:
Grant
Filed:
January 31, 2013
Date of Patent:
September 15, 2015
Assignee:
DiCon Fiberoptics Inc.
Inventors:
Ho-Shang Lee, Brian I-Yuan Chiang, Junying Jonathan Lu, Robert Eric Schleicher
Abstract: By diverting a small amount of current from a string of LED(s) powered by a LED driver at low current levels in a process of dimming the LED string, performance of the LED string light emission is improved.
Abstract: One embodiment of the invention is directed to a light mixing illuminator for illuminating an object, comprising an array of light emitting elements wherein at least some of the elements emit light of different wavelengths. An optical device is employed that focuses the light from the elements to a Fourier plane of the device, wherein the light emitting elements are arranged so that at least the zero spatial frequency components of light of the different wavelengths from the elements substantially overlap in a region at the Fourier plane. An objective is used to project the region onto the object. A mask is used that selectively blocks some of spatial frequency components of light from the elements without blocking the zero spatial frequency components of light from reaching the object.
Abstract: One embodiment provides light along an optical axis. It comprises a substrate and at least one array of multiple LED chips without individual packaging supported by the substrate. The LED chips emit light within different wavelength ranges and are distributed laterally with respect to the axis over an area, the LED chips having light emitting surfaces for emitting light in directions transverse to the area. An optical element adjacent to the light emitting surfaces of the LED chips in the at least one array collects and directs light emitted by the LED chips of the at least one array along the axis towards a target. Another embodiment is directed to a method for providing multiple wavelength light for fluorescent microscopy using the above system. Electric current is supplied to the multiple LED chips, causing them to emit light of multiple wavelengths.
Type:
Grant
Filed:
November 4, 2013
Date of Patent:
March 17, 2015
Assignee:
DiCon Fiberoptics Inc.
Inventors:
Jeffrey B. Lee, Junying Jonathan Lu, Robert E. Schleicher
Abstract: A LED array spot illuminator for providing light along an optical axis comprises a substrate and at least one array of multiple LED chips without individual packaging supported by the substrate, wherein the LED chips emit light within the same or different wavelength ranges and are distributed laterally with respect to the axis over a light-emitting area. The LED chips have light emitting surfaces for emitting light in directions transverse to the area. An optical device collects and directs light emitted by the LED chips of the at least one array along the axis. An aperture passes the light emitted by the LED chips of the at least one array along the axis, wherein light collected by the optical device and passed by the aperture forms a beam of light illuminating a spot. Electric current is supplied to the multiple LED chips, causing them to emit light. Light emitted by the multiple LED chips that passed through the optical device and the aperture form a beam of light illuminating a spot.
Type:
Grant
Filed:
August 23, 2011
Date of Patent:
March 17, 2015
Assignee:
DiCon Fiberoptics Inc.
Inventors:
Jeffrey B. Lee, Brian I-Yuan Chiang, Han-Kun Ho
Abstract: By diverting a small amount of current from a string of LED(s) powered by a LED driver at low current levels in a process of dimming the LED string, performance of the LED string light emission is improved.
Abstract: A broad-spectrum, multiple wavelength illuminator comprises a luminescent body, and a plurality of semiconductor chips spaced apart from the luminescent body emitting light within one or more wavelength ranges towards the luminescent body, causing the luminescent body to emit light of one or more wavelength ranges. An optical element adjacent to the luminescent body collects light emitted by the luminescent body. An optical device collects light collected by the optical element. An aperture located between the optical element and the optical device passes the light emitted by the luminescent body along an optical axis, wherein light collected by the optical element and the optical device and passed by the aperture forms a beam of light illuminating a target. Alternatively, instead of being spaced apart from the chips, the luminescent body may be a layer adjacent to the chips.
Abstract: The color uniformity of a light spot is measured by providing an image of the light spot by means of a camera or camera sensor with sensor elements, each of the sensor elements capturing a set of three or more color component values that together define a set of pixel values at such sensor element, wherein the image includes a plurality of sets of pixel values. The method also derives for each of the plurality of sets of pixel values at a corresponding sensor element a first ratio between a first pair of the pixel values or of values obtained therefrom in such set. Preferably a second ratio is also derived between a second pair of the pixel values or of values obtained therefrom in such set, where the second pair is different from the first pair.
Abstract: An LED array includes three or more strings of bare LEDs mounted in close proximity to each other on a substrate. The strings of LEDs emit light of one or more wavelengths of blue, indigo and/or violet light, with peak wavelengths that are less than 490 nm. Luminescent materials deposited on each of the LED chips in the array emit light of different wavelength ranges that are of longer wavelengths than and in response to light emissions from the LED chips. A control circuit applies currents to the strings of LEDs, causing the LEDs in the strings to emit light, which causes the luminescent materials to emit light. A user interface enables users to control the currents applied by the control circuit to the strings of LEDs to achieve a Correlated Color Temperature (CCT) value and hue that are desired by users, with CIE chromaticity coordinates that lie on, or near to the black body radiation curve.
Type:
Application
Filed:
January 31, 2013
Publication date:
July 31, 2014
Applicant:
DiCon Fiberoptics, Inc.
Inventors:
Ho-Shang Lee, Brian I-Yuan Chiang, Junying Jonathan Lu, Robert Eric Schleicher
Abstract: This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.
Abstract: One embodiment provides light along an optical axis. It comprises a substrate and at least one array of multiple LED chips without individual packaging supported by the substrate. The LED chips emit light within different wavelength ranges and are distributed laterally with respect to the axis over an area, the LED chips having light emitting surfaces for emitting light in directions transverse to the area. An optical element adjacent to the light emitting surfaces of the LED chips in the at least one array collects and directs light emitted by the LED chips of the at least one array along the axis towards a target. Another embodiment is directed to a method for providing multiple wavelength light for fluorescent microscopy using the above system. Electric current is supplied to the multiple LED chips, causing them to emit light of multiple wavelengths.
Type:
Application
Filed:
November 4, 2013
Publication date:
March 6, 2014
Applicant:
DiCon Fiberoptics, Inc.
Inventors:
Jeffrey B. Lee, Junying Jonathan Lu, Robert E. Schleicher
Abstract: One embodiment provides light along an optical axis. It comprises a substrate and at least one array of multiple LED chips without individual packaging supported by the substrate. The LED chips emit light within different wavelength ranges and are distributed laterally with respect to the axis over an area, the LED chips having light emitting surfaces for emitting light in directions transverse to the area. An optical element adjacent to the light emitting surfaces of the LED chips in the at least one array collects and directs light emitted by the LED chips of the at least one array along the axis towards a target. Another embodiment is directed to a method for providing multiple wavelength light for fluorescent microscopy using the above system. Electric current is supplied to the multiple LED chips, causing them to emit light of multiple wavelengths.
Type:
Grant
Filed:
April 15, 2011
Date of Patent:
December 3, 2013
Assignee:
DiCon Fiberoptics Inc.
Inventors:
Jeffrey B. Lee, Junying Jonathan Lu, Robert E. Schleicher