Abstract: A double sided edge clip terminal for forming soldered connections with opposed contact pads on the edge of a substrate includes a pair of solder contacts each having spaced metal arms and cold extruded solder masses in the interior of the contacts between the arms. Openings are formed in the contacts between the arms to prevent wicking of molten solder along the terminal and away from the contact pads. The terminals are manufactured by extruding the solder masses through the openings and into the space between the arms and beyond the arms, without solder waste.

Abstract: A solder terminal strip stamp formed from thin metal stock includes a carrier strip, a plurality of solder terminals extending to one side of the carrier strip and reverse bend the contact arms on the ends of the terminals away from the strip. A thin solder layer is integrally bonded to contact arm and is joined to solder reservoirs located on the sides of the arms.

Abstract: An apparatus and method for simultaneously mounting lead strip segments onto each side of a rectangular ceramic substrate. Four lead strip mounting assemblies are equally spaced 90 degrees apart around a central vertically oriented substrate support so that each assembly is perpendicular an edge of a substrate on the support. Lead strip feed assemblies located adjacent each mounting assemblies cuts lead strip segments and feeds the lead strip segments into the mounting assemblies. The four mounting assemblies simultaneously mount the lead strip segments on the substrate.

Abstract: A lead assembly and method for forming electrical connections between pads on an integrated circuit chip and pads on a circuit board includes small diameter wires adhesively bonded to a supporting tape. The wires may be inwardly fanned to form connections between relatively widely spaced circuit board pads and relatively closely spaced chip pads.

Abstract: A lead frame for orienting and then mounting a plurality of clip leads on a semi-conductor device or substrate and method.

Abstract: A substrate breaker positively feeds substrate plates to a stick breaker where the sticks are broken from the plate. The sticks are fed upwardly to an elevated chip breaker where chips are broken from the sticks.

Abstract: A lead frame for orienting and then mounting a plurality of clip leads on a semi-conductor device or substrate and method.

Abstract: A solder terminal includes a clip adapted to be positioned on one edge of a substrate for forming soldered electrical connections with substrate pads. One end of the clip extends away from the substrate for making an electrical connection with a circuit component.

Abstract: A solder terminal includes a clip adapted to be positioned on one edge of a substrate for forming soldered connections with substrate pads. A leg extends from the clip for forming an electrical connection with a circuit component.