Abstract: An apparatus for encapsulating selected portions of the printed circuit board in a pin grid array using transfer molding techniques. In one embodiment for encapsulating only the top surface and side edges of the board, a vacuum is provided in the lower cavity to hold the edges of the bottom surface of the board flush against the mold plate. In a second embodiment for encapsulating all exposed surfaces of the board, the array pins are inserted in holes in the bottom of the cavity and supported by an adjustable block which positions the board in the cavity.