Abstract: A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a second type having a surface area to mass ratio in the range of 0.59 m2/g to 2.19 m2/g and a tap density in the range of 3.2 to 6.9 g/cm3 and a first type having a surface area to mass ratio of 0.05 to 0.15 m2/g and a tap density in the range of about 4.7 to 8.2 g/cm3. According to certain embodiments of the invention the first type of silver particles includes oblong silver particles. The thermally conductive adhesive further comprises a binder, and optionally a solvent.

Abstract: Conductive compositions which are useful as thermally conductive compositions and may also be useful as electrically conductive compositions are provided. The compositions include a conductive particle constituent in combination with a sintering aid which can, for example be a compound of the same metal in the nanometal, an organo-metallic, a metalorganic salt, mercaptan and/or resinate. In some embodiments the conductive particles include a small amount of nanoscale (<200 nm) particles. The compositions exhibit increased thermal conductivity.

Abstract: A fiber optic feed-through tube, a method for making it and a method for hermetically sealing and aligning lightwave waveguides inserted into the tube. The feed-through tube is preferably a metal tube with low melting point hermetic sealing material deposited on one end and the lightwave waveguide is an optical glass fiber. The fiber is fed through a tube having low melting point hermetic sealing material on one end.

Abstract: A thermosetting adhesive paste exhibiting a high thermal conductivity suitable for die attach applications.

Abstract: Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.

Abstract: Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.

Abstract: Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.

Abstract: Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.

Abstract: A glass composition and method of use having unique crystallization and crystal remelt properties is disclosed. The glass composition consists essentially by weight percent on an oxide basis:about 40-65% Ag.sub.2 Oabout 15-35% V.sub.2 O.sub.5about 0-30% PbO.sub.2about 0-20% TeO.sub.2The present invention also contemplates a unique, essentially resin-free organic system that utilizes the novel glass composition described above.

Abstract: A stable Tl.sub.2 O.sub.3, V.sub.2 O.sub.5, P.sub.2 O.sub.5 glass composition for a die attach paste requiring no resin and having a glassy edge temperature of below about 350.degree. C.