Abstract: A micro-miniature light source assemblage is provided having enhanced mechanical strength, maximum light output, and versatile accommodation for other integrated circuit components by employing as mounting for the LED (light emitting diode) a preassemblage of electric leads having an overlapped and insulated bond which is durable and permits flexibility in the orientation of said leads in use.The preassemblage of leads can also provide for mounting of other solid state devices, and special adaptations include offset and/or reduced thickness portions of said leads at the bond area as well as a modification in which an integral extension of one lead forms the electrical connection to an LED or other device mounted on the other lead.