Abstract: The invention relates to a microarray structure including a substrate material layer, a continuous three-dimensional (3D) surface layer on the substrate material layer that is capable of functionalisation for use as an array, and an inert material wherein the structure includes accurately defined and functionalisable isolated areas which are millimeter to nanometer in size. The functionalised areas are part of the continuous 3D surface layer and are isolated by the inert material and are interconnected within the structure by the continuous 3D surface layer.
Type:
Grant
Filed:
October 12, 2012
Date of Patent:
February 11, 2020
Assignee:
Digital Sensing Limited
Inventors:
Andrew Haynes, David James Bates, Ashton Cyril Partridge, Karthik Kannappan
Abstract: The invention relates to a microarray structure including a substrate material layer, a continuous three-dimensional (3D) surface layer on the substrate material layer that is capable of functionalisation for use as an array, and an inert material wherein the structure includes accurately defined and functionalisable isolated areas which are millimeter to nanometer in size. The functionalised areas are part of the continuous 3D surface layer and are isolated by the inert material and are interconnected within the structure by the continuous 3D surface layer.
Type:
Application
Filed:
October 12, 2012
Publication date:
November 20, 2014
Applicant:
Digital Sensing Limited
Inventors:
Andrew Haynes, David James Bates, Ashton Cyril Partridge, Karthik Kannappan
Abstract: Disclosed is a method of producing a two dimensional microarray using a three dimensional or structured microarray. The invention involves forming defined functionalized areas by layering an inert material over the surface structures of the three dimensional microarray. Sufficient of the inert material and of the top of the surface structures are then removed to expose defined areas of the surface structures within the inert material.
Type:
Application
Filed:
April 15, 2011
Publication date:
May 2, 2013
Applicant:
Digital Sensing Limited
Inventors:
Andrew Haynes, Aston Cyril Partridge, Yinqiu Wu