Patents Assigned to Digital Sensing Ltd.
  • Arrays and methods of manufacture
    Patent number: 11577485
    Abstract: The invention relates to a microarray structure that may include a substrate material layer, a continuous three-dimensional (3D) surface layer on the substrate material layer that is capable of functionalisation for use as an array, and an inert material. The structure may include accurately defined and functionalisable isolated areas which are millimeter to nanometer in size. The functionalisable areas may be part of the continuous 3D surface layer and may be isolated by the inert material but interconnected within the structure by the continuous 3D surface layer.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: February 14, 2023
    Assignee: Digital Sensing Ltd.
    Inventors: Andrew Haynes, David James Bates, Ashton Cyril Partridge, Karthik Kannappan
  • ARRAYS AND METHODS OF MANUFACTURE
    Publication number: 20200198286
    Abstract: The invention relates to a microarray structure that may include a substrate material layer, a continuous three-dimensional (3D) surface layer on the substrate material layer that is capable of functionalisation for use as an array, and an inert material. The structure may include accurately defined and functionalisable isolated areas which are millimeter to nanometer in size. The functionalisable areas may be part of the continuous 3D surface layer and may be isolated by the inert material but interconnected within the structure by the continuous 3D surface layer.
    Type: Application
    Filed: December 20, 2019
    Publication date: June 25, 2020
    Applicant: Digital Sensing Ltd.
    Inventors: Andrew Haynes, David James Bates, Ashton Cyril Partridge, Karthik Kannappan