Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.

Abstract: An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.

Abstract: A method for transmitting a signal in an optical system includes generating an optical signal along an optical axis for transmission through an optical element, positioning the optical element so that a surface discontinuity is positioned along the optical axis such that the optical signal defines a substantially radially symmetric intensity profile, and launching the optical signal into an input face of an optical fiber such that the intensity profile is substantially null proximate an optical axis associated with the optical fiber.

Abstract: The present invention provides wafer level optical elements that obviate a substrate wafer or a portion thereof disposed between optical structures or optical surfaces of the element.

Abstract: An imaging lens for use with an operational waveband over any subset of 7.5-13.5 ?m may include a first optical element of a first high-index material and a second optical element of a second high-index material. At least two surfaces of the first and second optical elements may be optically powered surfaces. A largest clear aperture of all optically powered surfaces may not exceed a diameter of an image circle of the imaging lens corresponding to a field of view of 55 degrees or greater by more than 30%. The first and second high-index materials may have a refractive index greater than 2.2 in the operational waveband, an absorption per mm of less than 75% in the operational waveband, and an absorption per mm of greater than 75% in a visible waveband of 400-650 nm.

Abstract: A triplexer including an optics block including a first port configured to receive a first light beam at a first wavelength and a second light beam at a second wavelength, and a second port configured to receive a third light beam at a third wavelength, a bounce cavity between the first and second ports, the bounce cavity being formed by opposing reflective elements adjacent respective surfaces of the optics block, a first grating opposite the first port, the first grating receiving all three light beams at substantially a same location thereon, the first grating configured to provide the first and second light beams to the bounce cavity and the third light beam to the first port, and a second grating opposite the second port, the second grating receiving the first and second light beams at spatially separated portions thereon.

Abstract: The present invention provides wafer level optical elements that obviate a substrate wafer or a portion thereof disposed between optical structures or optical surfaces of the element.

Abstract: Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

Abstract: An optical device includes a transparent substrate, a first replicated refractive surface on a first surface of the substrate in a first material, and a second replicated refractive surface on a second surface, opposite the first surface, and made of a second material, different from the first material. The material and curvature of the first replicated surface and the material and curvature of the second replicated surface may be configured to substantially reduce the chromatic dispersion and/or the thermal sensitivity of the optical device.

Abstract: A camera system includes an optical assembly including a folded optic, the folded optic including a transparent support substrate, a first lens surface on a first surface of the transparent support substrate, and a second lens surface on the first surface of the transparent support substrate, at least one of the first and second lens surfaces including a replication material, and a sensor configured to receive light from the optical assembly that has been incident on both the first and second lens surfaces sequentially.

Abstract: A method of fabricating a plurality of components using wafer-level processing can include bonding first and second wafer-level substrates together to form a substrate assembly, such that first surfaces of the first and second substrates confront one another, the first substrate having first electrically conductive elements exposed at the first surface thereof, forming second electrically conductive elements contacting the first conductive elements, and processing the second substrate into individual substrate elements. The second conductive elements can extend through a thickness of the first substrate and can be exposed at a second surface thereof opposite the first surface. The processing can include trimming material to produce the substrate elements at least some of which have respective different controlled thicknesses between first surfaces adjacent the first substrate and second surfaces opposite therefrom.

Abstract: A thin camera having sub-pixel resolution includes an array of micro-cameras. Each micro-camera includes a lens, a plurality of sensors of size p, and a plurality of macro-pixels of size d having a feature of size q. The feature size q smaller than p and provides a resolution for the micro-camera greater than p. The smallest feature in the micro-cameras determines the resolution of the thin camera. Each macro-pixel may have any array of m features of size q, where q=d/m. Additional micro-cameras may be included to increase power.

Abstract: Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

Abstract: A micro-optical element includes a support substrate, a micro-optical lens in a cured replication material on a first surface of the support substrate, and an opaque material aligned with and overlapping the micro-optical lens along a vertical direction.

Abstract: An optics block includes a substrate having first and second opposing surfaces, the substrate being a first material, a plurality of through holes extending in the substrate between the first and second opposing surface, a second material, different than the first material, filling a portion of the through holes and extending on a portion of the first surface of the substrate outside the through holes, and a first lens structure in the second material and corresponding to each of the through holes.

Abstract: Improved packages for light emitters may be fabricated at the wafer level. The package can be a single device or an array of die. The package includes a thermal via that extends through the thickness of the package substrate. The thermal via may be made of a material possessing a high thermal conductivity. The thermal via may be wider at the package exterior than at the interior to provide heat spreading between the device and its heat sink. The taper angle of the thermal via may be around 45 degrees to match the natural spread of heat in a solid. The thermal via may extend above the package interior, so its height is sufficient to position an emitter placed thereon at one foci of a parabola, where the vertex of the parabola is at the surface of the package substrate from which the thermal via extends.

Abstract: An optical chassis includes a mount substrate an optoelectronic device on the mount substrate, a spacer substrate, and a sealer substrate. The mount substrate, the spacer substrate and the sealer substrate are vertically stacked and hermetically sealing the optoelectronic device. An external electrical contact for the optoelectronic device is provided outside the sealing. At least part of the optical chassis may be made on a wafer level. A passive optical element may be provided on the sealer substrate or on another substrate stacked and secured thereto.

Abstract: Optical devices of excellent optical and physical properties produced from cured resins are disclosed. The resins and/or the cured hybrid polymer material made with the resins are characterized by a high level of cycloaliphatic-containing groups. Specific additives that can participate in crosslinking the curable polysiloxane provide additional physical property advantages.

Abstract: Optical devices of excellent optical and physical properties produced from cured resins are disclosed. The resins and/or the cured hybrid polymer material made with the resins are characterized by a high level of cycloaliphatic-containing groups. Specific additives that can participate in crosslinking the curable polysiloxane provide additional physical property advantages.

Abstract: Optical devices of excellent optical and physical properties produced from cured resins are disclosed. The resins and/or the cured hybrid polymer material made with the resins are characterized by a high level of cycloaliphatic-containing groups. Specific additives that can participate in crosslinking the curable polysiloxane provide additional physical property advantages.