Patents Assigned to Dimensional Circuits Corp.
  • Wiring board constructions and methods of making same
    Patent number: 6460247
    Abstract: A wiring board construction includes at least one microvia disposed in a base substrate and includes a deep imprinted cup shaped in the top surface thereof. A conductor material is disposed within the recess, and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion helps to complete an electrically conductor path through the substrate to help complete an electrically conductive path through the substrate.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: October 8, 2002
    Assignee: Dimensional Circuits Corp.
    Inventor: George D. Gregoire