Abstract: An x-ray weld inspection apparatus has at least one x-ray source, at least one x-ray detector, a motor arrangement configured to move the at least one x-ray source and the at least one x-ray detector substantially along a weld, and a control device. The control device comprises memory and at least one processing core, configured to control the motor arrangement to move the at least one x-ray source and the at least one x-ray detector during an x-ray weld scan substantially along the direction of the weld. At least one section of the weld is imaged at least twice during a single x-ray scan, producing at least two imaging data sets, respectively. An angle of incidence of x-rays at the at least one section of the weld is different for the imaging data sets.

Abstract: Some embodiments include a sensor unit with a conversion element and a readout substrate. The conversion element has imaging pixels and each imaging pixel is configured to directly convert radiation into an electrical charge. Each imaging pixel has a charge collection electrode. The imaging pixels have first imaging pixels and second imaging pixels. The readout substrate has a plurality of readout pixels arranged in a grid. Each readout pixel is connected to an associated imaging pixel by means of an interconnection at a connection position on the charge collection electrode. The second imaging pixels are shifted in a shifting direction relative to the first imaging pixels. The connection positions, in relation to the charge collection electrodes, are different between the first imaging pixels and the second imaging pixels.

Abstract: Some embodiments include a sensor unit with a conversion element and a readout substrate. The conversion element has imaging pixels and each imaging pixel is configured to directly convert radiation into an electrical charge. Each imaging pixel has a charge collection electrode. The imaging pixels have first imaging pixels and second imaging pixels. The readout substrate has a plurality of readout pixels arranged in a grid. Each readout pixel is connected to an associated imaging pixel by means of an interconnection at a connection position on the charge collection electrode. The second imaging pixels are shifted in a shifting direction relative to the first imaging pixels. The connection positions, in relation to the charge collection electrodes, are different between the first imaging pixels and the second imaging pixels.