Abstract: A multi-layer rigid prototype printed circuit board is fabricated by applying a heat activated, rapid setting or tacking melt-remelt adhesive utilizing a moderate temperature heat laminating device onto appropriate surfaces of pre-etched and plated insulative film based, flexible film layers. A computer guided drill drills through-holes within an electrical insulative material planar substrate core using prescribed drill sizes for each through-hole pin size desired for a given hole location. The etched layers with the adhesive applied are positioned in proper sequence aligned to the drilled hole pattern and heat laminated thereto as a stacked array on the top and/or bottom surfaces of the substrate core. Computer guided drilling of the adhered films with prescribed smaller drill sizes at each through-hole location is effected to create film cantilever portions extending radially outwardly of the edge of the through-holes.