Abstract: A packaging system for minimizing thermal-induced stress in a high power semiconductor device. The system is comprised of an electrically insulating, thermally conductive substrate having planar upper and lower surfaces, a semiconductor die having a planar lower heat extraction surface attached to said upper surface of said substrate, and electrically insulating thermal compound disposed between and in contact with the said lower heat extraction surface of said substrate and the system heat extraction upper surface. .DELTA.L.varies..DELTA.S is defined in Equation 12, wherein T.sub.B is the temperature at said outer edge of the lower heat extraction surface of said die, T.sub.D is the temperature at said outer edge of the lower surface of said substrate, and PPM is part per million.

Abstract: An asymmetric RF excited gas laser includes an elongated chamber, a first reflector and a second reflector, a first supporting mechanism, a ribbon of a metal conductor and a impedance-matching circuit. The elongated chamber is of cross-sectional dimensions suitable for confining a laser gas discharge and is formed from a dielectric material. A laser gas is disposed in the elongated chamber. The first and second reflector reflect and guide light energy from the laser gas discharge within the elongated chamber so that the light energy is optically independent of the internal walls of the elongated chamber as the light energy travels longitudinally the length of the elongated chamber. The first supporting mechanism supports the elongated chamber and forms negative electrode. The first supporting mechanism has cooling tubes and is electrically coupled to ground. The ribbon of the metal conductor forms a positive electrode which is disposed along the elongated chamber.

Abstract: A laser marking apparatus provides markings of enhanced readability in an outer jacket of repetitively spaced sections along the length of a moving cable which is delivered from a supply source. The cable is advanced under tension and is wound onto a take-up spool. The outer jacket is of a specified color and has an outer surface. The laser marking apparatus includes a first guide roller, a laser marker, an applicator, a coarse brush roller with a first driving mechanism, a fine brush roller with a second driving mechanism and a second guide roller. The first and second guide rollers are disposed adjacent to the supply source before the laser marker and before the take-up spool after the fine brush roller, respectively, in order to guide the cable along a path of travel so that the outer jacket passes adjacent to the laser marker. The laser marker inscribes in the outer jacket markings opening to the outer surface thereof.

Abstract: Packaging techniques are described which provide electrical, thermal, and mechanical advantages. A low-profile semiconductor package is described in which the leads are flat and are present in the same plane. The leads are arranged and positioned in order to eliminate inductance. A semiconductor die is secured to a ceramic substrate, and a plurality of bond wires are secured between the pads on the die and the leads of the package.

Abstract: A laser thermal testing method and system for use in testing a fire alarm system which has a plurality of heat-sensors which are remotely distributed throughout a protected area. The laser thermal testing system includes a first laser and a second laser. The first laser generates an aiming beam of coherent electromagnetic radiation in the visible spectrum. The laser thermal testing system also includes a movable reflector which reflects the aiming beam. The movable reflector is optically coupled to the first laser. The movable reflector is first moved in order to align the aiming beam in an aligned position so that the aiming beam is reflected onto one of the heat-sensors. The movable reflector is then fixedly secured in the aligned position. The second laser generates a heating beam of coherent electromagnetic radiation in the infrared spectrum.