Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

Abstract: An LED component comprises a plurality of fused light-emitting diodes (LEDs) (e.g., micro-transfer printable or micro-transfer printed LEDs). Each fused LED comprises an LED with first and second LED electrical connections for providing power to the LED and a fuse with first and second fuse electrical connections. The first LED electrical connection is electrically connected to the first electrode. The first fuse electrical connection is electrically connected to the second LED electrical connection and the second fuse electrical connection is electrically connected to the second electrode. A fused LED source wafer comprises an LED wafer having a patterned sacrificial layer forming an array of sacrificial portions separated by anchors and a plurality of fused LED components, each fused LED component disposed entirely on or over a corresponding sacrificial portion. A light-emission system comprises a system substrate and a plurality of fused LED components disposed on or over the system substrate.

Abstract: A transfer-printable (e.g., micro-transfer-printable) device source wafer comprises a growth substrate comprising a growth material, a plurality of device structures comprising one or more device materials different from the growth material, the device structures disposed on and laterally spaced apart over the growth substrate, each device structure comprising a device, and a patterned dissociation interface disposed between each device structure of the plurality of device structures and the growth substrate. The growth material is more transparent to a desired frequency of electromagnetic radiation than at least one of the one or more device materials. The patterned dissociation interface has one or more areas of relatively greater adhesion each defining an anchor between the growth substrate and a device structure of the plurality of device structures and one or more dissociated areas of relatively lesser adhesion between the growth substrate and the device structure of the plurality of device structures.

Abstract: A transparent display comprises a display substrate having a display area and a bezel area adjacent to each of at least one corresponding side of the display area. The display substrate is at least partially transparent. Light-controlling elements are disposed in, on, or over the display substrate in the display area. Display wires are disposed in, on, or over the display substrate in the display area. The display wires are electrically connected to the light-controlling elements. Bezel wires are disposed in, on, or over the display substrate in the bezel area, the bezel wires electrically connected to respective ones of the display wires. A bezel transparency in the bezel area is greater than or equal to a display transparency in the display area.

Abstract: A tiled display structure comprises a screen support having a screen emitter side and an opposing screen back side. A black matrix comprises a patterned layer of black-matrix material disposed on the screen back side, the pattern defining pixel openings that are substantially devoid of black-matrix material. An array of tiles comprises tiles each having a tile substrate and a plurality of pixels disposed in or on the tile substrate. Each pixel comprises one or more light emitters. The one or more light emitters are each disposed to emit light through a pixel opening in the black matrix. A substantially transparent adhesive layer adheres the array of tiles to the black-matrix material.

Abstract: A light-emitting diode (LED) structure includes an LED substrate having a first side and a second side opposing the first side. One or more light-emitting diodes are disposed on the first side and arranged to emit light through the LED substrate. In certain embodiments, a wire-grid polarizer is disposed on the second side and arranged to polarize light emitted from the one or more light-emitting diodes. A plurality of different colored LEDs or an LED with one or more color-conversion materials can be provided on the LED substrate to provide white light. A spatially distributed plurality of the LED structures can be provided in a backlight for a liquid crystal display. A polarization-preserving transmissive diffuser can diffuse light emitted from the LED toward the liquid crystal layer and a polarization-preserving reflective diffuser can diffuse light emitted from the LED away from the liquid crystal layer.

Abstract: A single metal layer device, such as a display or sensor, comprises a substrate and a patterned metal layer. The patterned metal layer forms a two-dimensional array of spatially separated column line segments that each extend only partially across the display substrate in a column direction and forms a one-dimensional array of row lines extending across the display substrate in a row direction different from the column direction. The row lines and column line segments are electrically separate in the patterned metal layer. Spatially separated electrical jumpers are disposed on the display substrate and electrically connect pairs of column line segments adjacent in the column direction. Each electrical jumper has an independent jumper substrate independent of and separate from the display substrate. In certain embodiments, spatially separated light-emitting pixel circuits are disposed on a display substrate and are electrically connected to at least one row line and one column line.

Abstract: A method of making a display structure comprises providing a display substrate having a display surface, disposing components on and in contact with the display surface, uniformly blanket coating the display surface with a curable layer of uncured light-absorbing material, and curing the curable layer of uncured light-absorbing material to provide a layer of cured light-absorbing material so that the components project from the layer of cured light-absorbing material without having pattern-wise etched the layer of cured light-absorbing material after the light-absorbing material has been cured. The uniform blanket coating has a thickness greater than a thickness of the component, disposing the components comprises printing the components through the uniform blanket coating such that the components protrude from the uniform blanket coating, or the component is coated with a de-wetting material.

Abstract: A printed structure includes a destination substrate comprising two or more contact pads disposed on or in a surface of the destination substrate, a component disposed on the surface, and two or more electrically conductive connection posts. Each of the connection posts extends from a common side of the component. Each of the connection posts is in electrical and physical contact with one of the contact pads. The component is tilted with respect to the surface of the destination substrate. Each of the connection posts has a flat distal surface.

Abstract: A method of making a surface-mountable pixel engine package comprises providing an array of spaced-apart conductive pillars and an insulating mold compound laterally disposed between the conductive pillars on a substrate together defining a planarized surface. Pixel engines comprising connection posts are printed to the conductive pillars so that each of the connection posts is in electrical contact with one of the conductive pillars. The pixel engines are tested to determine known-good pixel engines. An optically clear mold compound is provided over the planarized surface and tested pixel engines. Optically clear mold compound is adhered to a tape and the substrate is removed. The optically clear mold compound, the insulating mold compound, the conductive pillars, the optically clear mold compound, and the tested pixel engines are singulated to provide pixel packages that comprise the pixel engines and the known-good pixel engines are transferred to a reel or tray.

Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.

Abstract: A printable electronic component includes a component substrate and a circuit disposed in or on the component substrate. One or more electrically conductive connection posts protrude from the component substrate. One or more electrically conductive component contact pads are exposed on or over the component substrate on a side of the component substrate opposite the one or more connection posts. The one or more component contact pads and the one or more electrically conductive connection posts are both electrically connected to the circuit. The components can be printed onto a destination substrate and electrically connected to contact pads on the destination substrate through the connection posts. The components can also be printed onto other components and electrically connected through the connection posts and component contact pads to form a three-dimensional electronic structure.

Abstract: A micro-LED laser display having an array of display pixels includes a display substrate for displaying an image and an array of display pixels. Each display pixel has one or more micro-LED lasers disposed on the display substrate. Each micro-LED laser emits light within an emission angle. One or more light spreaders for increasing the emission angle of light emitted by each micro-LED laser are disposed in relation to the light spreaders and a controller individually controls the micro-LED lasers.

Abstract: A stamp for micro-transfer printing comprises a rigid support having a support coefficient of thermal expansion (support CTE). Pedestals are disposed on (e.g., directly on and in contact with) the rigid support. Each of the pedestals is spatially separated from any other of the pedestals. The pedestals have a pedestal coefficient of thermal expansion (pedestal CTE) and the pedestal CTE is greater than the support CTE. Posts are disposed on (e.g., directly on and in contact with) each of the pedestals. Each post has a post coefficient of thermal expansion (post CTE) that is greater than the support CTE.

Abstract: A multi-color LED display comprises pixels, each comprising a first sub-pixel, a second sub-pixel, and a third sub-pixel. The first sub-pixel comprises a first light-emitting diode (LED) that emits a first color of light, the second sub-pixel comprises second LEDs that emit a second color of light different from the first color of light, and the third sub-pixel comprises third LEDs that emit a third color of light different from the first color of light and different from the second color of light. The second LEDs are electrically connected in parallel and the third LEDs are electrically connected in series.

Abstract: An exemplary micro-device and substrate structure includes a destination substrate and one or more contact pads disposed thereon, a micro-device disposed on or over the destination substrate, and a layer of cured adhesive disposed on the destination substrate. The micro-device comprises at least one electrical contact. The at least one electrical contact is in direct electrical contact with the one or more contact pads. The adhesive layer adheres the micro-device to the destination substrate and is in contact with the one or more contact pads. An exemplary method of making a micro-device and substrate structure includes providing a destination substrate and one or more contact pads disposed thereon, coating a layer of curable adhesive, disposing a micro-device comprising at least one electrical contact on the layer and curing the layer thereby directly electrically contacting the at least one electrical contact with the one or more contact pads.

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.

Abstract: Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. The semiconductor active layer and the sacrificial layer may be selectively etched in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. The capping layer and the first portion of the semiconductor active layer may be selectively etched to thereby expose the sacrificial layer.

Abstract: An inorganic light-emitting diode (iLED) display comprises a display substrate comprising a display area and one or more holes extending through the display substrate in the display area and a plurality of inorganic light-emitting diodes (iLEDs) disposed on, in, or over the display substrate in a regular array in the display area. At least some of the iLEDs are disposed between at least some of the holes in the display area and at least some of the holes are between at least some of the iLEDs in the display area. The display substrate can be substantially rigid and the iLED display can a flexible black sheet laminated, affixed, or adjacent to the display substrate. One or more audio loudspeakers can be disposed adjacent to the flexible sheet with the flexible sheet disposed between the display substrate and the one or more audio loudspeakers.