Abstract: A method for pressure packaging of articles between a heated thermoplastic film and a substrate utilizes apparatus providing a bed platen, means for heating a thermoplastic film, means for supporting the film above the bed platen and a pressure platen having a recess in the lower surface thereof adapted to receive the article being packaged. The pressure platen and bed platen are moved relative to each other so as to deform the heated thermoplastic film into a sheath about the article and to press the heated film against the substrate outwardly of the article to effect bonding therebetween. The pressure platen desirably has a release coating thereon to prevent adhesion of the heated film thereto. Vacuum may be drawn through the bed platen and the substrate to enhance bonding of the film to the substrate.

Abstract: A method and apparatus for pressure packaging of articles between a heated thermoplastic film and a substrate utilizes apparatus providing a bed platen, means for heating a thermoplastic film, means for supporting the film above the bed platen and a pressure platen having a recess in the lower surface thereof adapted to receive the article being packaged. The pressure platen and bed platen are moved relative to each other so as to deform the heated thermoplastic film into a sheath about the article and to press the heated film against the substrate outwardly of the article to effect bonding therebetween. The pressure platen desirably has a release coating thereon to prevent adhesion of the heated film thereto. Vacuum may be drawn through the bed platen and the substrate to enhance bonding of the film to the substrate.