Patents Assigned to DLY Technologies Inc.
  • Patent number: 11972962
    Abstract: The disclosure provides an adjustable device including plates and at least two adjustable modules connect with two adjacent of the plates. The adjustable module can stretch or shrink to change a distance between plates. The disclosure also provides an adjustable storage box including an upper cover and a lower cover. A storage space is formed by the upper cover and the lower cover and for the accommodating of the adjustable device. When the upper cover moves upward relative to the lower cover, the adjustable modules changes from a compression state to a stretch state and increase a distance between plates. Whereby, it is easy to pick and place object when a distance of two adjacent plates increases. The overall volume of the adjustable device is reduced when a distance of two adjacent plates decrease, thereby saving the working space.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: April 30, 2024
    Assignee: DLY TECHNOLOGIES INC.
    Inventor: Shih Feng Pan
  • Patent number: 11817342
    Abstract: A wafer access assembly, a wafer access device and a wafer carrier are provided. The wafer access device includes a base, a shaft, a plurality of couple plates, a plurality of arms, and a stretchable component. The base includes a groove. The shaft extends into the groove and is capable of sliding into the groove. The plurality of couple plates mounting on the shaft. Each of the plurality of couple plates includes a plate body and a through hole on the plate body for the shaft passing through. Each of the plurality of arms is extended from an end of each of the plurality of couple plates. The stretchable component includes a plurality of connecting side walls connecting adjacent couple plates together. The plurality of stretchable component are capable of changing a distance between adjacent couple plates.
    Type: Grant
    Filed: October 25, 2022
    Date of Patent: November 14, 2023
    Assignee: DLY TECHNOLOGIES INC.
    Inventor: Shih Feng Pan
  • Patent number: 11322379
    Abstract: A wafer storage box, wafer transfer device and wafer storage box and transfer assembly. The wafer storage and transfer assembly includes a chassis which is capable of translating or rotating, a sliding shaft, connecting levers, arms and at least two positioning sidewall. The chassis includes a groove. The sliding shaft can translate along the groove. The connecting levers are connected to the sliding shaft. Each arm extends from a connecting lever. The two positioning sidewall are respectively arranged on opposite sides of the chassis. Each positioning sidewall includes tracks accommodating the pins of connecting levers. The width of each of the tracks reduces from the front end of the positioning sidewall to the back end of the positioning sidewall. The wafer storage and transfer assembly can vacuum adsorb several wafers to achieve high efficiency of wafer storing and transferring.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: May 3, 2022
    Assignee: DLY Technologies Inc.
    Inventor: Shih Feng Pan