Patents Assigned to Dongbu Electronics Co., Inc.
  • CMOS image sensor and method for fabricating the same
    Patent number: 7538374
    Abstract: A CMOS image sensor and a method for fabricating the same are disclosed, in which the fabrication costs are reduced by reducing the number of photolithographic processes and yield is improved by obviating an alignment problem between color filter layers and microlenses. In one embodiment, the CMOS image sensor includes a sub layer provided with a unit pixel (e.g., a photodiode and various transistors), a planarization layer on the sub layer, and microlens-color filter structures formed on the planarization layer at constant intervals.
    Type: Grant
    Filed: September 12, 2005
    Date of Patent: May 26, 2009
    Assignee: Dongbu Electronics Co., Inc.
    Inventor: Yeon Sil Kim
  • Semiconductor package and structure thereof
    Patent number: 6949818
    Abstract: A semiconductor package includes a semiconductor chip connected to lead frames by wires and outer leads protruding from the semiconductor package. At this time, the outer leads are connected to the lead frames and grooves into which the outer leads are inserted into are provided in the semiconductor package, wherein the grooves are connected the lead frames. In mounting a first and a second semiconductor package, the outer leads of the first semiconductor package are inserted into the grooves of the second semiconductor package.
    Type: Grant
    Filed: December 30, 2003
    Date of Patent: September 27, 2005
    Assignee: Dongbu Electronics Co., Inc.
    Inventor: Jin Ho Park